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IPP50R190CE

Infineon Technologies

IPP50R190CE by Infineon Technologies

IPP50R190CE by Infineon Technologies is a N-CHANNEL FET with 500V DS breakdown voltage and 0.19 ohm max RDS(on). Ideal for switching applications, it features 63A IDM, 339mJ EAS, and a built-in diode. Package style is flange mount with through-hole terminals.

Median Price

$1.486

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 191 parts In-Stock

1+ parts

$1.938

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191

$1.938

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Rutronik

Germany . 7,700 parts In-Stock

1+ parts

-

100+ parts

$1.034

1k+ parts

$0.827

10k+ parts

$0.797

7,700

-

$1.034

$0.827

$0.797

Vyrian

USA . 372 parts In-Stock

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372

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Nova Conductors

Japan . 300 parts In-Stock

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300

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Modulus Dynamics

Lithuania . 7,261 parts In-Stock

1+ parts

$0.413

100+ parts

$0.396

1k+ parts

$0.380

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-

7,261

$0.413

$0.396

$0.380

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Aztec Data Supply Inc.

USA . 334 parts In-Stock

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$1.110

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334

$1.110

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Corphita

USA . 711 parts In-Stock

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$1.836

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711

$1.836

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Ampacity Inc.

Singapore . 241 parts In-Stock

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$2.010

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241

$2.010

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AZTECH Wire

Italy . 414 parts In-Stock

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$10.529

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414

$10.529

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Authorized Procurement Solutions

USA . 15,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,975 parts In-Stock

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Kepictronics

USA . 4,500 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,983 parts In-Stock

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Continental Prestige Electronics

USA . 2,842 parts In-Stock

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Speed Components Ltd (Excess)

Israel . 2,729 parts In-Stock

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2,729

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Argo Parts USA

USA . 2,456 parts In-Stock

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Legend Electronics Inc. (Excess)

USA . 229 parts In-Stock

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ChipstoGo Electronic ltd

UK . 79 parts In-Stock

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Bastille Electronics

Australia . 15 parts In-Stock

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15

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Overview

Infineon's CoolMOS™ CE Power MOSFETs are a technology platform of high voltage power MOSFETs that are designed according to the super junction principle (SJ) and conceived to fulfill consumer requirements. CoolMOS™ CE portfolio offers 500V, 600V, 650V, 700V, and 800V devices targeting low power chargers for mobile devices and power tools, adapters for notebook and laptops, LCD, LED TV and LED lighting. This new series of CoolMOS™ is cost-optimized to meet typical requirements in consumers with no compromise on proven CoolMOS™ quality and reliability while still being price attractive.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection, making it a reliable choice for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel transistors offer high efficiency and faster switching speeds, making them ideal for power electronics.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and saves space, making this transistor convenient for use in compact devices.

Transistor Application: SWITCHING

Designed specifically for switching applications, this transistor ensures efficient performance in a variety of electronic devices.

Minimum DS Breakdown Voltage: 500 V

With a high breakdown voltage, this transistor can withstand higher voltage levels, offering increased reliability in demanding environments.

Package Shape: RECTANGULAR

The rectangular shape allows for easy mounting and installation in circuits, making it user-friendly for assembly.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide secure connections and easy soldering, enhancing the overall reliability of the transistor.

Operating Mode: ENHANCEMENT MODE

Enhancement mode transistors offer high control and low on-resistance, improving efficiency and performance in power applications.

Maximum Pulsed Drain Current (IDM): 63 A

The high pulsed drain current rating ensures the transistor can handle sudden surges in current, making it suitable for high-power devices.

Avalanche Energy Rating (EAS): 339 mJ

The high avalanche energy rating allows the transistor to withstand transient voltages, ensuring reliable operation in harsh conditions.

No. of Terminals: 3

With three terminals, this transistor is simple to connect and integrate into circuits, making it a versatile choice for various applications.

Package Style (Meter): FLANGE MOUNT

The flange mount style offers easy installation and thermal management, ensuring optimal performance and longevity of the transistor.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFET technology provides high efficiency and fast switching speeds, making this transistor suitable for power conversion applications.

Transistor Element Material: SILICON

Silicon transistors offer excellent thermal stability and reliability, ensuring consistent performance in a wide range of operating conditions.

Terminal Finish: TIN

The tin terminal finish provides corrosion resistance and reliable solder connections, prolonging the lifespan of the transistor.

Maximum Drain-Source On Resistance: 0.19 ohm

With low on-resistance, this transistor minimizes power loss and heat generation, improving efficiency in power electronics.

Terminal Position: SINGLE

The single terminal position simplifies circuit design and installation, making this transistor easy to use for various electronic applications.

Technical Specifications

Power Field Effect Transistors (FET) IPP50R190CE attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Avalanche Energy Rating (EAS):

339 mJ

Minimum DS Breakdown Voltage:

500 V

Maximum Drain-Source On Resistance:

.19 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

63 A

Surface Mount:

NO

Terminal Finish:

TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

IPP50R190CE Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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