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IPB90N04S4-02

Infineon Technologies

IPB90N04S4-02 by Infineon Technologies

IPB90N04S4-02 by Infineon Technologies is a N-channel power FET with a min DS breakdown voltage of 40V. It has a max pulsed drain current of 360A and an avalanche energy rating of 475mJ. This transistor is commonly used in applications requiring high power dissipation and low on-resistance.

Median Price

$3.070

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

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Mouser Electronics

USA . 971 parts In-Stock

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$3.070

100+ parts

$1.380

1k+ parts

$1.090

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971

$3.070

$1.380

$1.090

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Distributors (In-Stock)

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Nova Conductors

Japan . 550 parts In-Stock

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$1.797

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550

$1.797

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Digiode

USA . 745 parts In-Stock

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$2.774

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745

$2.774

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Freelance Electronics

USA . 860 parts In-Stock

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$3.250

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$3.412

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$3.218

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860

$3.250

$3.412

$3.218

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Cyclops Electronics Ltd

UK . 1,000 parts In-Stock

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Vyrian

USA . 937 parts In-Stock

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Distributors (Availability)

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Corohmni

South Africa . 616 parts In-Stock

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$0.604

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616

$0.604

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Modulus Dynamics

Lithuania . 14,448 parts In-Stock

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$0.837

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$0.804

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$0.770

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14,448

$0.837

$0.804

$0.770

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Continental Prestige Electronics

USA . 3,777 parts In-Stock

1+ parts

$1.797

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$1.761

3,777

$1.797

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$1.761

Argo Parts USA

USA . 3,567 parts In-Stock

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$1.797

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Ampacity Inc.

Singapore . 634 parts In-Stock

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$1.900

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Corphita

USA . 168 parts In-Stock

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$2.628

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AZTECH Wire

Italy . 315 parts In-Stock

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$7.194

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Andel Nordic

Denmark . 385 parts In-Stock

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$33.390

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$23.374

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$23.374

385

$33.390

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$23.374

$23.374

Lixinc

USA . 12,208 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,630 parts In-Stock

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6,630

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Alle Elektronik GmbH

Germany . 1,020 parts In-Stock

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Netroflash

USA . 1,000 parts In-Stock

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$1.761

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$1.707

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$1.671

1,000

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$1.761

$1.707

$1.671

Overview

Infineon Automotive COOLiRFET™ Power MOSFETs are specifically designed for Automotive applications. These HEXFET® Power MOSFETs utilize processing techniques that achieve low ON-resistance per silicon area. Additional features of this design are a +175°C junction operating temperature, fast switching speed, and improved repetitive avalanche rating. These devices offer low conduction losses and robust avalanche performance to deliver higher efficiency, power density, and reliability. With this performance, many applications using these COOLiRFET™ devices run significantly cooler than with state-of-the-art MOSFETs. These features combine to make this design an extremely efficient and reliable device for use in automotive applications and a wide variety of other applications.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material makes the package lightweight and durable, ensuring reliable performance in various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs generally have lower on-resistance and higher current-handling capabilities, making them suitable for high-power applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for efficient current flow and protection against reverse polarity, enhancing the overall performance and reliability of the FET.

Surface Mount: YES

Surface mount technology saves space, simplifies assembly, and improves thermal performance, making this FET suitable for compact and high-density designs.

Minimum DS Breakdown Voltage: 40 V

The high breakdown voltage ensures reliable operation and protection against voltage spikes, making this FET suitable for demanding applications.

Maximum Pulsed Drain Current (IDM): 360 A

The high pulsed drain current rating allows the FET to handle sudden surges of current without damage, making it ideal for high-power and transient load applications.

Maximum Power Dissipation (Abs): 150 W

The high power dissipation capability enables the FET to handle high power levels without overheating, ensuring long-term reliability in demanding environments.

Maximum Operating Temperature: 175 °C

The high operating temperature range allows the FET to operate in harsh thermal conditions without performance degradation, making it suitable for automotive and industrial applications.

Technical Specifications

Power Field Effect Transistors (FET) IPB90N04S4-02 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Avalanche Energy Rating (EAS):

475 mJ

Minimum DS Breakdown Voltage:

40 V

Maximum Drain Current (Abs) (ID):

90 A

Maximum Drain Current (ID):

90 A

Maximum Drain-Source On Resistance:

.0021 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-263AB

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

360 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Element Material:

SILICON

Trade Compliance

IPB90N04S4-02 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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