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IMZA120R040M1HXKSA1

Infineon Technologies

IMZA120R040M1HXKSA1 by Infineon Technologies

IMZA120R040M1HXKSA1 by Infineon is a N-CHANNEL FET with 1200V DS breakdown voltage, 117A IDM, and 0.0615 ohm max RDS(on). It's used for switching applications due to its single configuration with built-in diode. The transistor operates in enhancement mode and has a max power dissipation of 227W.

Median Price

$14.022

Lifecycle Status

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16

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1k+

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DigiKey

USA . 200 parts In-Stock

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$12.190

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$7.351

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$6.200

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200

$12.190

$7.351

$6.200

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Mouser Electronics

USA . 158 parts In-Stock

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$12.190

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$7.090

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$7.090

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Farnell

UK . 145 parts In-Stock

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$12.770

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$9.910

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$9.740

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$12.770

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$9.740

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Newark

USA . 249 parts In-Stock

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$15.520

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$10.150

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$9.670

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$15.520

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$9.670

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Element14

Singapore . 145 parts In-Stock

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$26.180

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$19.320

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$18.080

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145

$26.180

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$18.080

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EBV Elektronik

Germany . 240 parts In-Stock

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RS (Exports)

UK . 193 parts In-Stock

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$15.273

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Verical

USA . 19 parts In-Stock

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IBS Electronics

USA . 240 parts In-Stock

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$9.551

100+ parts

$9.327

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$10.266

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240

$9.551

$9.327

$10.266

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Digiode

USA . 604 parts In-Stock

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$11.656

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Nova Conductors

Japan . 85 parts In-Stock

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$17.644

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$17.644

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Vyrian

USA . 13,418 parts In-Stock

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Rutronik

Germany . 1,200 parts In-Stock

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$8.620

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TME

Poland . 460 parts In-Stock

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$8.240

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NAC Semi

USA . 240 parts In-Stock

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$18.930

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Chip Stock

USA . 143 parts In-Stock

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Corohmni

South Africa . 344 parts In-Stock

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$0.528

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$0.528

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Aztec Data Supply Inc.

USA . 3,897 parts In-Stock

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$1.130

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$1.130

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Modulus Dynamics

Lithuania . 18,155 parts In-Stock

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$1.308

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$1.256

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$1.203

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$1.308

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Ampacity Inc.

Singapore . 2,772 parts In-Stock

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$7.520

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Corphita

USA . 931 parts In-Stock

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$11.043

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Continental Prestige Electronics

USA . 76 parts In-Stock

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$16.450

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$11.470

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Netroflash

USA . 2,000 parts In-Stock

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$17.644

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$16.762

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$16.409

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$17.644

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$16.409

Microchip USA

USA . 215 parts In-Stock

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$46.759

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Robosynatics

Brazil . 11,171 parts In-Stock

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$1.670

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$1.636

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$1.636

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Lucentia Tech

USA . 11,171 parts In-Stock

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$1.670

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$1.636

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$1.636

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$1.636

Argo Parts USA

USA . 3,980 parts In-Stock

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Eastek

USA . 240 parts In-Stock

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GreenTree Electronics

Israel . 240 parts In-Stock

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iodParts Technologies Inc.

India . 150 parts In-Stock

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Overview

Upgrade your power systems with the IMZA120R040M1HXKSA1 by Infineon Technologies. As a leader in the industry, Infineon ensures top-notch quality and reliability in their products. This Power Field Effect Transistor (FET) is perfect for switching applications, offering a high breakdown voltage of 1200V and a maximum drain current of 55A. With a built-in diode and Kelvin sensor, this transistor provides enhanced performance and efficiency. Say goodbye to overheating issues with its impressive maximum power dissipation of 227W. Trust Infineon to deliver cutting-edge technology that meets all your power needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides a good combination of durability and insulation, making the transistor suitable for a wide range of applications.

Minimum DS Breakdown Voltage: 1200 V

The high breakdown voltage allows for safe and reliable operation in high voltage applications.

Maximum Pulsed Drain Current (IDM): 117 A

The high current handling capability makes this transistor suitable for applications where high power output is required.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

This technology offers improved performance and efficiency compared to other types of transistors.

Maximum Operating Temperature: 175 °C

The high temperature rating ensures that the transistor can operate reliably in demanding conditions without overheating.

Transistor Element Material: SILICON CARBIDE

Silicon carbide offers superior thermal conductivity and can handle higher temperatures than traditional silicon transistors.

Maximum Drain-Source On Resistance: 0.0615 ohm

The low on-resistance minimizes power loss and improves efficiency in switching applications.

Technical Specifications

Power Field Effect Transistors (FET) IMZA120R040M1HXKSA1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Avalanche Energy Rating (EAS):

339 mJ

Minimum DS Breakdown Voltage:

1200 V

Maximum Drain Current (ID):

55 A

Maximum Drain-Source On Resistance:

.0615 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

11 pF

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T4

No. of Elements:

1

No. of Terminals:

4

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

117 A

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON CARBIDE

Trade Compliance

IMZA120R040M1HXKSA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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