Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
Featured manufacturers
Infineon's FM24CL04B-G FRAM offers 512x8 organization, operates at 3.3V with 1MHz clock frequency. Ideal for applications requiring high endurance like IoT devices due to its 100T write/erase cycles and I2C serial bus interface. Measuring just 4.889mm x 3.8985mm, it is a compact solution for data storage in small electronic devices.
Median Price
$1.860
Lifecycle Status
Suppliers In-Stock
25
In-Stock Inventory
1k+
Arrow
1+ parts
$1.859
100+ parts
$1.425
1k+ parts
$1.245
10k+ parts
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Chip1Stop
$1.620
Newark
$1.990
$1.690
$1.570
$1.520
Element14
$2.169
$1.685
$1.595
$1.506
Mouser Electronics
$2.260
$1.950
$1.800
$1.760
DigiKey
$2.350
$2.045
$1.921
$1.776
Farnell
$2.401
$1.648
$1.557
Adafruit Industries
$6.850
$6.507
Flip Electronics (Authorized)
Rochester
$1.430
$1.190
$1.060
Verical
$1.500
$1.220
$1.208
Avnet
$0.960
Future Electronics
$1.040
$0.975
RS (Exports)
$1.755
$1.526
Digiode
$1.188
Nova Conductors
Bristol Electronics
$2.508
$1.179
$1.129
TME
$3.850
$2.930
Flip Electronics
Chip Stock
IBS Electronics
$1.571
$1.543
$1.017
Vyrian
DigiKey Marketplace
Schukat
$1.354
$1.300
Halfin
Corphita
$1.125
Bastille Electronics
$1.492
$1.417
$1.397
Continental Prestige Electronics
$1.539
Argo Parts USA
Benley Electronics
$2.000
Advanced Electronics
Perfect Parts
GreenTree Electronics
QUARKTWIN TECHNOLOGY LTD
Authorized Procurement Solutions
Kepictronics
Component Stockers USA
$1.240
$1.090
Alle Elektronik GmbH
Metaverse IC Inc.
Durable material that protects the internal components from damage.
Ensures efficient data transfer and synchronization of operations.
Optimal supply voltage for stable operation and performance.
Can withstand high temperatures, making it suitable for various environments.
High endurance for extensive read/write operations, ensuring long-lasting usage.
Utilizes Ferroelectric RAM technology which offers fast read/write speeds and non-volatility.
FRAMs FM24CL04B-G attributes and parameters. Explore more FRAMs devices from Infineon Technologies
Additional Features:
Maximum Clock Frequency (fCLK):
Minimum Data Retention Time:
Endurance:
JESD-30 Code:
Length:
Memory Density:
Memory IC Type:
Memory Width:
Moisture Sensitivity Level (MSL):
No. of Functions:
No. of Terminals:
No. of Words:
No. of Words Code:
Operating Mode:
Maximum Operating Temperature:
Minimum Operating Temperature:
Organization:
Package Body Material:
Package Code:
Package Equivalence Code:
Package Shape:
Package Style (Meter):
Parallel or Serial:
Peak Reflow Temperature (C):
Power Supplies (V):
Qualification:
Maximum Seated Height:
Serial Bus Type:
Maximum Standby Current:
Minimum Standby Voltage:
Sub-Category:
Maximum Supply Current:
Maximum Supply Voltage (Vsup):
Minimum Supply Voltage (Vsup):
Nominal Supply Voltage / Vsup (V):
Surface Mount:
Technology:
Terminal Finish:
Terminal Form:
Terminal Pitch:
Terminal Position:
Maximum Time At Peak Reflow Temperature (s):
Width:
Write Protection:
FM24CL04B-G Memory ICs trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.32.00.71
SB
8542.32.00.70
Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.
CEO
Jochen Hanebeck
Chief Financial Officer
Sven Schneider
Chief Marketing Officer
Andreas Urschitz
Villach 300mm
Fabrication
Fab Initiation
2011
Austria
Villach
Wafer Capacity
11,000
Kulim 2
2016
Malaysia
Kulim
79,500
Dresden - Module 3
1999
Germany
Dresden
58,000
Villach Building
2,000
Regensburg
1986
60,000
Dresden 200 - Module 1
1995
28,000
Dresden 200 - Module 2
1996
Building 38
2005
500
Building 47
Kulim 1
2006
110,000
Mesa Facility
1990
USA
Mesa
3,000
Villach 150mm
1981
35,000
Villach 200mm
68,000
Temecula
30,000
2021
2018
5,000
Kulim 3
2024
Fab 25
Austin
31,000
Dresden - Module 4
2026
LM555CM
National Semiconductor
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
LM358D-T
Philips Semiconductors
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
43025-0400
Molex
The Molex 43025-0400 is a board connector with 4 contacts, 2 rows, and a mating contact pitch of 0.118". It has a body length of 0.27", insulation resistance of 1Gohm, and operates b/w -40 to 105°C. Ideal for commercial applications requiring a female connector with crimp termination and UL94V-0 flammability rating.
NXP Semiconductors
LM358D-T by NXP Semiconductors is a dual operational amplifier with 70dB CMRR, 1000kHz unity gain bandwidth, and 9000uV max input offset voltage. Widely used in commercial applications due to its small outline package and low bias current of 0.5uA.
LM107H
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Code: TO-99; Package Shape: ROUND;
1N4148
Vishay Telefunken
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
BAV99
Micro Commercial Components
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
General Electric Solid State
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Shape: ROUND; Minimum Voltage Gain: 25000;
Daco Semiconductor
LM317T
Linear Technology
ADJUSTABLE POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Terminal Form: THROUGH-HOLE; Operating Temperature (TJ-Min): 0 Cel; No. of Functions: 1; JESD-609 Code: e0;
Comset Semiconductors
Other Regulators; No. of Terminals: 3; Terminal Pitch: 2.54 mm; Minimum Output Voltage-1: 1.2 V; Technology: BIPOLAR; Operating Temperature (TJ-Max): 125 Cel;
SMBJ18CA
Rectron
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
DS18B20Z+T&R
Analog Devices
DS18B20Z+T&R by Analog Devices is a 12-bit temperature sensor with 1-Wire interface. It operates b/w -55 to 125°C, offering ±0.5°C accuracy. The sensor comes in a plastic package suitable for surface mount applications, with a max supply voltage of 5.5V and min of 3V.
FT232RL-REEL
FTDI
FTDI's FT232RL-REEL is a bus controller with 28 terminals, operating at 3.3V to 5.25V. It supports USB, VBUS, and UART buses with a data transfer rate of 60MBps. Ideal for industrial applications due to its CMOS technology and compatibility with RS232, RS422, and RS485 standards.
2N7002
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Package Style (Meter): SMALL OUTLINE; Terminal Position: DUAL;
Protek Devices
NDT2955
Fairchild Semiconductor
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 3 W; Package Style (Meter): SMALL OUTLINE; Maximum Drain Current (Abs) (ID): 2.5 A;
1N4148WS
Tak Cheong Electronics Holdings
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LM317AEMP/NOPB
Texas Instruments
LM317AEMP/NOPB by Texas Instruments is an adjustable positive single output standard regulator with a max output voltage of 37V and a max output current of 1.5A. It operates in temperatures ranging from -40°C to 125°C, making it suitable for various applications requiring precise voltage regulation in a compact package.
International Components
RECTIFIER DIODE; Surface Mount: NO; No. of Elements: 1; Terminal Finish: Tin/Lead (Sn/Pb); JESD-609 Code: e0; Maximum Reverse Recovery Time: .004 us;
FM22LD16-55-BG
Infineon Technologies
FRAM; No. of Terminals: 48; Package Code: TFBGA; Package Shape: RECTANGULAR; Technology: CMOS; Minimum Data Retention Time: 10;
FM25L04B-GA
Cypress Semiconductor
FRAM; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Maximum Supply Voltage (Vsup): 3.6 V; No. of Words: 512 words;
CY15B108QN-20LPXC
FRAM; No. of Terminals: 8; Package Code: VSON; Package Shape: RECTANGULAR; Peak Reflow Temperature (C): 260; Terminal Finish: NICKEL PALLADIUM GOLD;
FM25V02-GTR
FM25V02-GTR by Cypress Semiconductor is a 32KX8 FRAM with SPI interface, 40 MHz clock frequency, and 100000000000000 write/erase cycles. It operates at -40 to 85 °C, suitable for applications requiring high endurance non-volatile memory in compact designs.
FM25L16B-G
FM25L16B-G by Infineon Technologies is a FRAM with 2KX8 organization, operating at 3.3V. It offers 20MHz clock frequency, SPI serial bus type, and 100000000000000 write/erase cycles endurance. Ideal for applications requiring high-speed data transfer and reliable non-volatile memory storage in compact electronic devices.
FM25V02A-DGTR
FRAM; No. of Terminals: 8; Package Code: HVSON; Package Shape: RECTANGULAR; Terminal Finish: Pure Tin (Sn); Length: 4.5 mm;
FM25CL64B-GTR
FM25CL64B-GTR by Infineon Technologies is a FRAM with 8KX8 organization, operating at 3.3V. It offers 20MHz clock frequency, SPI serial bus type, and 100000000000000 write/erase cycles endurance. Ideal for applications requiring high-speed data writing and low power consumption in compact designs.
FM24V10-G
Ramtron International
FRAM; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Serial Bus Type: I2C; Memory Density: 1048576 bit;
CY15V108QN-20LPXCT
FRAM; No. of Terminals: 8; Package Code: VSSOP; Package Shape: RECTANGULAR; Nominal Supply Voltage / Vsup (V): 1.8; Memory Density: 8388608 bit;
FM1808B-SG
FRAM; No. of Terminals: 28; Package Code: SOP; Package Shape: RECTANGULAR; Minimum Standby Voltage: 4.5 V; Maximum Seated Height: 2.67 mm;
FM25L16B-DG
FRAM; No. of Terminals: 8; Package Code: HVSON; Package Shape: RECTANGULAR; Operating Mode: SYNCHRONOUS; Length: 4.5 mm;
FM28V102A-TG
FRAM; No. of Terminals: 44; Package Code: TSOP2; Package Shape: RECTANGULAR; Memory Density: 1048576 bit; Moisture Sensitivity Level (MSL): 3;
CY15V102QN-50SXI
FRAM; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Memory Width: 8; Terminal Form: GULL WING;
FM25V10-GTR
FRAM; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Peak Reflow Temperature (C): 260; Maximum Operating Temperature: 85 Cel;
CY15V116QN-40BKXI
FRAM; No. of Terminals: 24; Package Code: TBGA; Package Shape: RECTANGULAR; Package Body Material: PLASTIC/EPOXY; No. of Functions: 1;
FM24C04B-GTR
FRAM; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Operating Mode: SYNCHRONOUS; Terminal Position: DUAL;
CY15B101N-ZS60XET
FRAM; No. of Terminals: 44; Package Code: TSOP2; Package Shape: RECTANGULAR; Additional Features: DATA RETENTION TIME @ 105 DEGREE CENTIGRADE;2KV ESD AVAILABLE; Organization: 64KX16;
CY15V104QN-50LPXI
Infineon CY15V104QN-50LPXI FRAM offers 512Kx8 organization, operates at 50MHz clock frequency, and has 1000000000000000 write/erase cycles endurance. Ideal for applications requiring high-speed data storage with low power consumption in compact designs.
CY15B064Q-SXET
CY15B064Q-SXET by Infineon Technologies is a FRAM with 8Kx8 organization, operating at 3.3V. It has a max clock frequency of 16MHz and offers 10000000000000 write/erase cycles. This FRAM is commonly used in applications requiring high endurance and non-volatile memory storage.
CY15V102QN-50PZXI
FRAM; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Package Style (Meter): IN-LINE; Endurance: 1000000000000000 Write/Erase Cycles;
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
FM24CL64B-GTR
FRAM; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Memory Width: 8; Terminal Position: DUAL;
FRAM; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Maximum Supply Voltage (Vsup): 3.65 V; Package Body Material: PLASTIC/EPOXY;
FM24CL64B-GTR by Infineon Technologies is a FRAM memory IC with 8Kx8 organization and 65536-bit memory density. It operates in synchronous mode with a max clock frequency of 1 MHz. This small outline package is suitable for applications requiring high endurance, such as industrial automation and automotive systems.
FM24CL64B-G
FRAM; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Maximum Seated Height: 1.727 mm; Terminal Form: GULL WING;
Infineon Technologies' FM24CL64B-G is a FRAM with 8KX8 organization, operating at 3.3V, featuring 8192 words and 65536-bit memory density. It offers synchronous operation, hardware write protection, and serial bus type I2C. Ideal for applications requiring high endurance with up to 100T write/erase cycles in a small outline package style.
FRAM; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Additional Features: DATA RETENTION TIME @ 85 DEGREE CENTIGRADE; Minimum Standby Voltage: 2.7 V;
FM24W256-GTR
Infineon's FM24W256-GTR FRAM offers 32Kx8 organization, operates at 1MHz clock frequency, and has a memory density of 262144 bits. Ideal for applications requiring high endurance with 100T write/erase cycles, such as IoT devices and industrial automation systems.
FRAM; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Nominal Supply Voltage / Vsup (V): 3.3; Minimum Supply Voltage (Vsup): 2.7 V;
FRAM; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Package Equivalence Code: SOP8,.25; Maximum Time At Peak Reflow Temperature (s): 30;
FM24CL16B-GTR
FM24CL16B-GTR by Infineon Technologies is a FRAM with 2Kx8 organization, operating at 3.3V. It offers synchronous operation, 1MHz clock frequency, and 100 trillion write/erase cycles. Ideal for applications requiring high-speed data writing and low power consumption in compact designs.
FRAM; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Width: 3.9 mm; Maximum Standby Current: .000006 Amp;
FRAM; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Terminal Pitch: 1.27 mm; Serial Bus Type: I2C;
FM24CL04B-GTR
Infineon's FM24CL04B-GTR is a FRAM with 512x8 organization, operates at 3.3V, and has a clock frequency of 1MHz. Ideal for applications requiring high endurance, such as IoT devices or industrial sensors due to its low standby current and write/erase cycles.
FRAM; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Organization: 512X8; Package Body Material: PLASTIC/EPOXY;
FRAM; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Maximum Seated Height: 1.75 mm; Maximum Supply Current: .3 mA;
FM24W256-G
FRAM; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Serial Bus Type: I2C; Moisture Sensitivity Level (MSL): 1;
FM24W256-G by Infineon Technologies is a FRAM memory IC with 32KX8 organization, operating at 3.3V. It features a max clock frequency of 1 MHz and offers high endurance with 100T write/erase cycles. Ideal for applications requiring fast and reliable non-volatile memory storage in compact electronic devices.
FRAM; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Moisture Sensitivity Level (MSL): 3; Minimum Operating Temperature: -40 Cel;
FM24V10-GTR
Infineon's FM24V10-GTR is a FRAM with 128KX8 organization, operating at 3.4 MHz clock frequency. It has a memory density of 1048576 bit and offers 100000000000000 write/erase cycles endurance. Ideal for applications requiring high-speed data writing and low power consumption in compact designs.
FRAM; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Terminal Position: DUAL; Write Protection: HARDWARE;
Supply Digital Components
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