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FF6MR12W2M1B11BOMA1

Infineon Technologies

FF6MR12W2M1B11BOMA1 by Infineon Technologies

Infineon's FF6MR12W2M1B11BOMA1 is a N-CHANNEL FET with 1200V DS breakdown voltage, 400A IDM, and 0.00563 ohm RDS(on). Ideal for high-power switching applications due to its series connected configuration, built-in diode, and thermistor. Operating in enhancement mode with fast turn-on/off times of 39.1ns and 92.6ns respectively.

Median Price

$284.000

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 11 parts In-Stock

1+ parts

$253.950

100+ parts

$238.710

1k+ parts

$223.480

10k+ parts

-

11

$253.950

$238.710

$223.480

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Chip1Stop

Japan . 30 parts In-Stock

1+ parts

$284.000

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-

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-

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30

$284.000

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-

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Verical

USA . 11 parts In-Stock

1+ parts

-

100+ parts

$298.387

1k+ parts

$279.350

10k+ parts

-

11

-

$298.387

$279.350

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 182 parts In-Stock

1+ parts

$241.300

100+ parts

-

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182

$241.300

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-

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Nova Conductors

Japan . 15 parts In-Stock

1+ parts

$335.720

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-

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15

$335.720

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Vyrian

USA . 7,411 parts In-Stock

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7,411

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Modulus Dynamics

Lithuania . 25,452 parts In-Stock

1+ parts

$1.544

100+ parts

$1.482

1k+ parts

$1.420

10k+ parts

-

25,452

$1.544

$1.482

$1.420

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AZTECH Wire

Italy . 287 parts In-Stock

1+ parts

$11.378

100+ parts

-

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287

$11.378

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Ampacity Inc.

Singapore . 24 parts In-Stock

1+ parts

$225.250

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-

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24

$225.250

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Corphita

USA . 194 parts In-Stock

1+ parts

$228.600

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194

$228.600

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Continental Prestige Electronics

USA . 1,785 parts In-Stock

1+ parts

$335.720

100+ parts

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10k+ parts

$329.006

1,785

$335.720

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$329.006

Microchip USA

USA . 477 parts In-Stock

1+ parts

$521.310

100+ parts

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477

$521.310

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Argo Parts USA

USA . 214 parts In-Stock

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214

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Perfect Parts

USA . 101 parts In-Stock

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101

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Overview

Unleash the power of the FF6MR12W2M1B11BOMA1 by Infineon Technologies, a top-tier manufacturer known for their cutting-edge technology and superior quality. As a leader in the Power Field Effect Transistors category, this N-CHANNEL transistor with SERIES CONNECTED, CENTER TAP configuration is perfect for SWITCHING applications. With impressive features like a 1200V DS Breakdown Voltage and a maximum Pulsed Drain Current of 400A, this transistor offers unmatched performance and reliability. Say goodbye to inefficiencies and hello to seamless operation with the FF6MR12W2M1B11BOMA1 - your gateway to enhanced productivity and precision.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL FETs are commonly used in high power applications due to their lower on-resistance compared to P-CHANNEL FETs.

Configuration: SERIES CONNECTED, CENTER TAP, 2 ELEMENTS WITH BUILT-IN DIODE AND THERMISTOR

This configuration allows for enhanced performance and protection features, making the product versatile and reliable.

Transistor Application: SWITCHING

Designed for switching applications, ensuring efficient and rapid control of power flow.

Minimum DS Breakdown Voltage: 1200 V

High breakdown voltage ensures the device can handle high voltage loads, providing safety and reliability.

Package Shape: RECTANGULAR

Rectangular shape offers convenient mounting and allows for efficient use of space.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs provide better control and lower power consumption compared to depletion mode FETs.

Maximum Pulsed Drain Current (IDM): 400 A

High pulsed drain current capability allows for handling peak loads without compromising performance.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFET technology offers high switching speeds and low gate drive power requirements, enhancing overall efficiency.

Maximum Operating Temperature: 150 °C

Wide operating temperature range ensures reliable performance in varying environmental conditions.

Transistor Element Material: SILICON CARBIDE

Silicon carbide material offers high temperature tolerance and superior performance compared to silicon-only FETs.

Maximum Turn On Time (ton): 39.1 ns

Fast turn-on time ensures quick response and efficient operation in time-sensitive applications.

Minimum Operating Temperature: -40 °C

Low operating temperature limit allows for usage in extreme cold environments without compromising performance.

Maximum Turn Off Time (toff): 92.6 ns

Fast turn-off time minimizes power loss and heat generation during switching transitions, improving overall efficiency.

Maximum Drain Current (ID): 200 A

High drain current rating allows for handling substantial current loads without overheating.

Maximum Drain-Source On Resistance: 0.00563 ohm

Low on-resistance ensures minimal power loss and efficient operation under high current conditions.

Terminal Position: UPPER

Upper terminal position simplifies connection and layout considerations in circuit design.

Case Connection: ISOLATED

Isolated case connection enhances safety and reliability by preventing electrical interference and potential short circuits.

Maximum Feedback Capacitance (Crss): 112 pF

Low feedback capacitance minimizes signal distortion and enhances high-frequency performance.

Reference Standard: UL RECOGNIZED

UL recognition indicates compliance with rigorous safety standards, providing confidence in the product's quality and reliability.

Technical Specifications

Power Field Effect Transistors (FET) FF6MR12W2M1B11BOMA1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Case Connection:

ISOLATED

Minimum DS Breakdown Voltage:

1200 V

Maximum Drain Current (ID):

200 A

Maximum Drain-Source On Resistance:

.00563 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

112 pF

JESD-30 Code:

R-XUFM-X35

No. of Elements:

1

No. of Terminals:

35

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

400 A

Reference Standard:

UL RECOGNIZED

Surface Mount:

NO

Terminal Form:

UNSPECIFIED

Terminal Position:

UPPER

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON CARBIDE

Maximum Turn Off Time (toff):

92.6 ns

Maximum Turn On Time (ton):

39.1 ns

Trade Compliance

FF6MR12W2M1B11BOMA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

Category top products 20

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