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FF6MR12KM1BOSA1

Infineon Technologies

FF6MR12KM1BOSA1 by Infineon Technologies

Infineon's FF6MR12KM1BOSA1 is a N-CHANNEL FET with 1200V DS breakdown voltage, ideal for switching applications. Featuring series connected, center tap configuration and built-in diode elements, it offers 500A IDM and 0.00581 ohm max drain-source resistance. With Silicon Carbide material and UL recognition, this MOSFET operates b/w -40 to 150 °C for high-power requirements.

Median Price

$358.390

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Avnet

USA . 2 parts In-Stock

1+ parts

$333.989

100+ parts

-

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2

$333.989

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Element14

Singapore . 1 parts In-Stock

1+ parts

$345.540

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-

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1

$345.540

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Rochester

USA . 100 parts In-Stock

1+ parts

$358.390

100+ parts

$336.890

1k+ parts

$315.380

10k+ parts

-

100

$358.390

$336.890

$315.380

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DigiKey

USA . 8 parts In-Stock

1+ parts

$433.860

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8

$433.860

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Verical

USA . 90 parts In-Stock

1+ parts

$447.988

100+ parts

$421.113

1k+ parts

$394.225

10k+ parts

-

90

$447.988

$421.113

$394.225

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 493 parts In-Stock

1+ parts

$303.724

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-

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493

$303.724

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Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$491.300

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10

$491.300

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Vyrian

USA . 2,581 parts In-Stock

1+ parts

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2,581

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Distributors (Availability)

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Corohmni

South Africa . 385 parts In-Stock

1+ parts

$0.352

100+ parts

-

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385

$0.352

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Modulus Dynamics

Lithuania . 3,481 parts In-Stock

1+ parts

$0.545

100+ parts

$0.523

1k+ parts

$0.501

10k+ parts

-

3,481

$0.545

$0.523

$0.501

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Aztec Data Supply Inc.

USA . 1,170 parts In-Stock

1+ parts

$0.830

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1,170

$0.830

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AZTECH Wire

Italy . 378 parts In-Stock

1+ parts

$8.800

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378

$8.800

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Ampacity Inc.

Singapore . 40 parts In-Stock

1+ parts

$271.750

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40

$271.750

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Corphita

USA . 773 parts In-Stock

1+ parts

$287.739

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773

$287.739

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Continental Prestige Electronics

USA . 11 parts In-Stock

1+ parts

$434.740

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11

$434.740

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Aranea Global

USA . 1,000 parts In-Stock

1+ parts

$481.474

100+ parts

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1k+ parts

$462.215

10k+ parts

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1,000

$481.474

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$462.215

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Argo Parts USA

USA . 3,352 parts In-Stock

1+ parts

$491.300

100+ parts

$486.387

1k+ parts

$481.474

10k+ parts

$476.561

3,352

$491.300

$486.387

$481.474

$476.561

Advanced Electronics

New Zealand . 650 parts In-Stock

1+ parts

$501.126

100+ parts

$501.126

1k+ parts

$501.126

10k+ parts

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650

$501.126

$501.126

$501.126

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Microchip USA

USA . 192 parts In-Stock

1+ parts

$600.675

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192

$600.675

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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1,000

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GreenTree Electronics

Israel . 50 parts In-Stock

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50

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Overview

Experience the power of cutting-edge technology with the FF6MR12KM1BOSA1 by Infineon Technologies. As a leading manufacturer in the industry, Infineon delivers unrivaled quality and reliability in their Power Field Effect Transistors. Perfect for switching applications, this N-CHANNEL FET offers a multitude of benefits including a high DS breakdown voltage of 1200V, maximum pulsed drain current of 500A, and a low on-resistance of 0.00581 ohm. Whether you're looking to enhance your industrial equipment or improve the efficiency of your power systems, the FF6MR12KM1BOSA1 provides unmatched performance and value for all your needs.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-channel FETs generally have lower on-resistance and higher electron mobility, making them more efficient for switching applications.

Minimum DS Breakdown Voltage: 1200 V

High breakdown voltage allows for operation in high voltage applications, providing a reliable and stable performance.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring efficient and fast response times.

Maximum Pulsed Drain Current (IDM): 500 A

High pulsed drain current capability enables handling of large current spikes without damage, suitable for high-power applications.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature, the FET can withstand elevated temperatures without compromising performance.

Technical Specifications

Power Field Effect Transistors (FET) FF6MR12KM1BOSA1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Case Connection:

ISOLATED

Minimum DS Breakdown Voltage:

1200 V

Maximum Drain Current (ID):

250 A

Maximum Drain-Source On Resistance:

.00581 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

112 pF

JESD-30 Code:

R-XUFM-X7

No. of Elements:

1

No. of Terminals:

7

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

500 A

Reference Standard:

UL RECOGNIZED

Surface Mount:

NO

Terminal Form:

UNSPECIFIED

Terminal Position:

UPPER

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON CARBIDE

Maximum Turn Off Time (toff):

167.9 ns

Maximum Turn On Time (ton):

102.8 ns

Trade Compliance

FF6MR12KM1BOSA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

Category top products 20

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