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FF11MR12W1M1B11BOMA1

Infineon Technologies

FF11MR12W1M1B11BOMA1 by Infineon Technologies

Infineon's FF11MR12W1M1B11BOMA1 is a N-CHANNEL FET with 1200V DS breakdown voltage, 200A IDM, and -40°C min. operating temp. Ideal for switching applications, it features series connected elements with built-in diode and thermistor in a rectangular package style.

Median Price

$146.450

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 3 parts In-Stock

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$134.000

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$134.000

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Verical

USA . 3 parts In-Stock

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$155.000

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3

$155.000

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RS (Exports)

UK . 1 parts In-Stock

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$146.450

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1

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$146.450

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Distributors (In-Stock)

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Digiode

USA . 801 parts In-Stock

1+ parts

$127.300

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801

$127.300

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Nova Conductors

Japan . 500 parts In-Stock

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$167.400

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500

$167.400

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Vyrian

USA . 8,504 parts In-Stock

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8,504

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Distributors (Availability)

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Advanced Electronics

New Zealand . 2,500 parts In-Stock

1+ parts

$1.022

100+ parts

$0.930

1k+ parts

$0.838

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-

2,500

$1.022

$0.930

$0.838

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Corohmni

South Africa . 83 parts In-Stock

1+ parts

$1.233

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83

$1.233

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Modulus Dynamics

Lithuania . 9,131 parts In-Stock

1+ parts

$1.376

100+ parts

$1.321

1k+ parts

$1.266

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9,131

$1.376

$1.321

$1.266

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Aztec Data Supply Inc.

USA . 240 parts In-Stock

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$1.610

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240

$1.610

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AZTECH Wire

Italy . 210 parts In-Stock

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$12.916

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210

$12.916

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Andel Nordic

Denmark . 4,110 parts In-Stock

1+ parts

$28.640

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$20.048

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$20.048

4,110

$28.640

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$20.048

$20.048

Ampacity Inc.

Singapore . 2 parts In-Stock

1+ parts

$113.900

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$113.900

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Semicontronic

India . 2 parts In-Stock

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$113.900

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$111.052

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$110.483

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$113.900

$111.052

$110.483

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Corphita

USA . 582 parts In-Stock

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$120.600

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582

$120.600

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Aranea Global

USA . 1,000 parts In-Stock

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$164.052

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$157.490

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$164.052

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$157.490

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Continental Prestige Electronics

USA . 483 parts In-Stock

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$167.400

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$164.052

483

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$164.052

QUARKTWIN TECHNOLOGY LTD

USA . 24,196 parts In-Stock

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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Argo Parts USA

USA . 4,921 parts In-Stock

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Perfect Parts

USA . 54 parts In-Stock

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Overview

Experience superior performance and reliability with the Infineon Technologies FF11MR12W1M1B11BOMA1 Power Field Effect Transistor (FET). This N-CHANNEL transistor, featuring a series connected, center tap design with built-in diode and thermistor, is perfect for switching applications. With a minimum DS breakdown voltage of 1200 V and maximum pulsed drain current of 200 A, this transistor ensures optimal functionality. Trust in Infineon's reputation for quality and innovation, and elevate your electronic designs with this advanced FET.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL FETs typically have better conductivity and lower on-resistance, making them suitable for high current applications.

Configuration: SERIES CONNECTED, CENTER TAP, 2 ELEMENTS WITH BUILT-IN DIODE AND THERMISTOR

This configuration allows for efficient power distribution and protection features, making it a versatile choice for various circuits.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET ensures fast and efficient operation in electronic circuits.

Minimum DS Breakdown Voltage: 1200 V

With a high breakdown voltage, this FET can handle high voltage spikes and surges, providing reliability in demanding conditions.

Package Shape: RECTANGULAR

The rectangular shape allows for easy and secure mounting on circuit boards or heatsinks, improving overall reliability and thermal performance.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs provide better control over the switching operation, resulting in improved efficiency and performance in electronic circuits.

Maximum Pulsed Drain Current (IDM): 200 A

With a high pulsed drain current rating, this FET can handle short duration high current spikes, making it suitable for demanding applications.

No. of Terminals: 18

A higher number of terminals allow for more connectivity options and features, enhancing the versatility of this FET in electronic circuits.

Package Style (Meter): FLANGE MOUNT

The flange mount package style provides secure and stable mounting options, ensuring a reliable connection in various electronic systems.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high performance and reliability, making this FET suitable for critical applications.

Transistor Element Material: SILICON

Silicon FETs are known for their high efficiency and reliability, making them a common choice in electronic circuits.

Minimum Operating Temperature: -40 °C

With a low minimum operating temperature, this FET can function reliably in cold environments without compromising performance.

Maximum Drain Current (ID): 100 A

The high maximum drain current rating ensures that this FET can handle significant power loads, making it suitable for high-power applications.

Terminal Position: UPPER

The upper terminal position simplifies installation and connection in circuits, improving usability and convenience.

Case Connection: ISOLATED

Isolated case connection provides additional safety and protection in circuits, preventing electrical hazards and improving overall reliability.

Technical Specifications

Power Field Effect Transistors (FET) FF11MR12W1M1B11BOMA1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Case Connection:

ISOLATED

Minimum DS Breakdown Voltage:

1200 V

Maximum Drain Current (ID):

100 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-XUFM-X18

No. of Elements:

2

No. of Terminals:

18

Operating Mode:

ENHANCEMENT MODE

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

200 A

Surface Mount:

NO

Terminal Form:

UNSPECIFIED

Terminal Position:

UPPER

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

FF11MR12W1M1B11BOMA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

Category top products 20

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