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ESD3V3XU1USE6327XTSA1

Infineon Technologies

ESD3V3XU1USE6327XTSA1 by Infineon Technologies

ESD3V3XU1USE6327XTSA1 by Infineon is a unidirectional Trans Voltage Suppressor Diode with 3.3V peak reverse voltage, operating from -40 to 125°C. It uses avalanche technology in a chip carrier package for surface mount applications, providing transient suppression in electronic circuits.

Median Price

$0.169

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 11,285 parts In-Stock

1+ parts

$0.169

100+ parts

$0.160

1k+ parts

$0.153

10k+ parts

$0.148

11,285

$0.169

$0.160

$0.153

$0.148

Verical

USA . 11,285 parts In-Stock

1+ parts

-

100+ parts

$0.164

1k+ parts

-

10k+ parts

-

11,285

-

$0.164

-

-

Chip1Stop

Japan . 11,285 parts In-Stock

1+ parts

-

100+ parts

$0.170

1k+ parts

$0.162

10k+ parts

$0.157

11,285

-

$0.170

$0.162

$0.157

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 566 parts In-Stock

1+ parts

$0.171

100+ parts

-

1k+ parts

-

10k+ parts

-

566

$0.171

-

-

-

Vyrian

USA . 5,332 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,332

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Modulus Dynamics

Lithuania . 17,149 parts In-Stock

1+ parts

$0.094

100+ parts

$0.090

1k+ parts

$0.086

10k+ parts

-

17,149

$0.094

$0.090

$0.086

-

Ampacity Inc.

Singapore . 10,952 parts In-Stock

1+ parts

$0.145

100+ parts

-

1k+ parts

-

10k+ parts

-

10,952

$0.145

-

-

-

Corphita

USA . 994 parts In-Stock

1+ parts

$0.162

100+ parts

-

1k+ parts

-

10k+ parts

-

994

$0.162

-

-

-

Component Stockers USA

USA . 16,885 parts In-Stock

1+ parts

$0.200

100+ parts

$0.190

1k+ parts

$0.180

10k+ parts

$0.170

16,885

$0.200

$0.190

$0.180

$0.170

Native Components

USA . 984 parts In-Stock

1+ parts

$5.427

100+ parts

-

1k+ parts

-

10k+ parts

-

984

$5.427

-

-

-

AZTECH Wire

Italy . 808 parts In-Stock

1+ parts

$9.170

100+ parts

-

1k+ parts

-

10k+ parts

-

808

$9.170

-

-

-

Perfect Parts

USA . 8,254 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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8,254

-

-

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Northwest PG Solutions

USA . 1,639 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$5.318

10k+ parts

-

1,639

-

-

$5.318

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Overview

Protect your valuable electronic devices with the ESD3V3XU1USE6327XTSA1 by Infineon Technologies, a top-quality transient suppression device designed to safeguard against voltage spikes and transients. Manufactured by Infineon Technologies, a trusted leader in semiconductor solutions, this product offers unparalleled reliability and performance. Ideal for a wide range of applications, this single-config chip carrier is easy to install and provides peace of mind knowing that your electronics are protected from potential damage. Invest in the ESD3V3XU1USE6327XTSA1 today and experience the benefits of superior protection for your devices.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good durability and protection for the device, ensuring long-term reliability.

Config: SINGLE

Single configuration simplifies installation and reduces complexity in circuit design.

Surface Mount: YES

Surface mount capability allows for easy and convenient mounting on PCBs, saving space and assembly time.

Package Shape: RECTANGULAR

Rectangular shape enables easy placement and alignment on circuit boards.

No. of Terminals: 2

Having only 2 terminals simplifies connection and reduces chances of wiring errors.

Package Style (Meter): CHIP CARRIER

Chip carrier style is compact and suitable for space-constrained applications.

Maximum Operating Temperature: 125 °C

High maximum operating temperature ensures reliable performance under varying environmental conditions.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows for use in a wide range of environments, including extreme cold conditions.

Terminal Position: BOTTOM

Bottom terminal position makes it easy to integrate into existing circuit designs and layouts.

Diode Type: TRANS VOLTAGE SUPPRESSOR DIODE

Trans voltage suppressor diode provides superior protection against voltage spikes and surges.

Technology: AVALANCHE

Avalanche technology ensures fast response times and high energy handling capabilities for transient suppression.

Terminal Form: NO LEAD

No lead terminal form is environmentally friendly and eliminates the risk of lead contamination.

Maximum Repetitive Peak Reverse Voltage: 3.3 V

High maximum repetitive peak reverse voltage allows for protection against higher voltage transients.

Polarity: UNIDIRECTIONAL

Unidirectional polarity ensures that the device conducts in only one direction, providing consistent protection.

Diode Element Material: SILICON

Silicon diode element material offers high performance and reliability for transient suppression applications.

Technical Specifications

Transient Suppression Devices ESD3V3XU1USE6327XTSA1 attributes and parameters. Explore more Transient Suppression Devices devices from Infineon Technologies

Specs

Config:

SINGLE

Diode Element Material:

SILICON

JESD-30 Code:

R-PBCC-N2

No. of Elements:

1

No. of Terminals:

2

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity:

UNIDIRECTIONAL

Maximum Repetitive Peak Reverse Voltage:

3.3 V

Surface Mount:

YES

Technology:

AVALANCHE

Terminal Form:

Terminal Position:

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

ESD3V3XU1USE6327XTSA1 Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.10.00.50

SB

8541.10.00.50

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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