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CYT2B63CADQ0AZEGS

Infineon Technologies

CYT2B63CADQ0AZEGS by Infineon Technologies

Infineon Technologies' CYT2B63CADQ0AZEGS microcontroller features a 32-bit Cortex-M4F CPU, 65536 bytes of RAM, and 22-Ch 12-Bit ADC channels. With a max clock frequency of 80 MHz, it is suitable for applications requiring high-speed data processing and analog-to-digital conversion. This microcontroller is commonly used in automotive systems, industrial automation, and IoT devices due to its low power mode capability and extensive peripheral support.

Median Price

$8.165

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 1,600 parts In-Stock

1+ parts

$6.470

100+ parts

-

1k+ parts

-

10k+ parts

-

1,600

$6.470

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-

Arrow

USA . 1,600 parts In-Stock

1+ parts

$9.860

100+ parts

$5.938

1k+ parts

$5.725

10k+ parts

-

1,600

$9.860

$5.938

$5.725

-

Mouser Electronics

USA . 1,767 parts In-Stock

1+ parts

$10.460

100+ parts

$6.820

1k+ parts

$6.160

10k+ parts

-

1,767

$10.460

$6.820

$6.160

-

DigiKey

USA . 1,225 parts In-Stock

1+ parts

$10.460

100+ parts

$7.602

1k+ parts

$6.437

10k+ parts

$6.323

1,225

$10.460

$7.602

$6.437

$6.323

Verical

USA . 1,600 parts In-Stock

1+ parts

-

100+ parts

$5.938

1k+ parts

$5.725

10k+ parts

-

1,600

-

$5.938

$5.725

-

Rochester

USA . 802 parts In-Stock

1+ parts

-

100+ parts

$5.800

1k+ parts

$5.190

10k+ parts

$4.880

802

-

$5.800

$5.190

$4.880

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 568 parts In-Stock

1+ parts

$3.528

100+ parts

-

1k+ parts

-

10k+ parts

-

568

$3.528

-

-

-

Nova Conductors

Japan . 500 parts In-Stock

1+ parts

$9.011

100+ parts

-

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-

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500

$9.011

-

-

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Vyrian

USA . 1,118 parts In-Stock

1+ parts

-

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1,118

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 1,205 parts In-Stock

1+ parts

$3.160

100+ parts

-

1k+ parts

-

10k+ parts

-

1,205

$3.160

-

-

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Corphita

USA . 228 parts In-Stock

1+ parts

$3.343

100+ parts

-

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-

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228

$3.343

-

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Bastille Electronics

Australia . 1,000 parts In-Stock

1+ parts

$9.011

100+ parts

$8.560

1k+ parts

-

10k+ parts

$8.020

1,000

$9.011

$8.560

-

$8.020

Continental Prestige Electronics

USA . 2,606 parts In-Stock

1+ parts

$9.011

100+ parts

-

1k+ parts

-

10k+ parts

$8.831

2,606

$9.011

-

-

$8.831

Microchip USA

USA . 2,845 parts In-Stock

1+ parts

$31.810

100+ parts

$31.350

1k+ parts

$31.130

10k+ parts

$30.900

2,845

$31.810

$31.350

$31.130

$30.900

Modulus Dynamics

Lithuania . 1,688 parts In-Stock

1+ parts

$77.150

100+ parts

$74.064

1k+ parts

$70.978

10k+ parts

-

1,688

$77.150

$74.064

$70.978

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Argo Parts USA

USA . 1,095 parts In-Stock

1+ parts

-

100+ parts

-

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10k+ parts

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1,095

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-

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Overview

Unlock the potential of your next project with the CYT2B63CADQ0AZEGS microcontroller by Infineon Technologies. Designed with cutting-edge technology and a wide range of peripherals, this powerful device offers seamless connectivity options and efficient performance. From its low power mode to its integrated cache, this microcontroller delivers unparalleled value and benefits to customers across various applications. Trust Infineon Technologies for top-notch quality and reliability in every component. Elevate your designs with the CYT2B63CADQ0AZEGS microcontroller today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides a durable and impact-resistant package for the microcontroller, ensuring reliable performance in various environments.

Integrated Cache: YES

Helps to improve overall performance by storing frequently accessed data closer to the processor for faster access.

Maximum Supply Voltage: 1.15 V

Allows for a higher supply voltage input, providing flexibility in power requirements for the system.

No. of Terminals: 64

Offers a sufficient number of terminals for connecting various external devices and peripherals, enhancing the microcontroller's versatility.

Peripheral IC Type: MICROCONTROLLER, RISC

Utilizes a RISC (Reduced Instruction Set Computing) architecture, which enhances processing efficiency and speed for better overall performance.

ADC Channels: YES

Includes Analog-to-Digital Converter channels, allowing the microcontroller to read analog signals and convert them into digital data for processing.

Connectivity: CAN(3), I2C(5), SPI(3), UART(6)

Provides a range of communication interfaces such as Controller Area Network (CAN), Inter-Integrated Circuit (I2C), Serial Peripheral Interface (SPI), and Universal Asynchronous Receiver-Transmitter (UART) for seamless connectivity with other devices.

Low Power Mode: YES

Supports a low power mode for energy efficiency, making it suitable for battery-powered or energy-conscious applications.

Technical Specifications

Microcontrollers CYT2B63CADQ0AZEGS attributes and parameters. Explore more Microcontrollers devices from Infineon Technologies

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M4F

Maximum Clock Frequency:

80 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FLOATING-POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G64

Length:

10 mm

Low Power Mode:

YES

No. of DMA Channels:

82

No. of External Interrupts:

49

No. of I/O Lines:

49

No. of Serial I/Os:

14

No. of Terminals:

64

No. of Timers:

3

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

RAM Bytes:

65536

ROM Words:

589824

ROM Programmability:

FLASH

Maximum Seated Height:

1.7 mm

Speed:

80 rpm

Maximum Supply Current:

48 mA

Maximum Supply Voltage:

1.15 V

Minimum Supply Voltage:

1.05 V

Nominal Supply Voltage:

1.1 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

65536

Connectivity:

CAN(3), I2C(5), SPI(3), UART(6)

Peripherals:

BOD, LIN(5), POR, RTC, TIMER(52), WDT(2)

Analog To Digital Convertors:

22-Ch 12-Bit

Trade Compliance

CYT2B63CADQ0AZEGS Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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