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CYDMX128B16-65BVXI

Infineon Technologies

CYDMX128B16-65BVXI by Infineon Technologies

MULTI-PORT SRAM; No. of Terminals: 100; Package Code: VFBGA; Package Shape: SQUARE; Output Characteristics: 3-STATE; Width: 6 mm;

Median Price

$7.645

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Avnet

USA . 172,382 parts In-Stock

1+ parts

-

100+ parts

$7.820

1k+ parts

$7.070

10k+ parts

-

172,382

-

$7.820

$7.070

-

Rochester

USA . 429 parts In-Stock

1+ parts

-

100+ parts

$7.470

1k+ parts

$6.680

10k+ parts

$6.290

429

-

$7.470

$6.680

$6.290

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 384 parts In-Stock

1+ parts

$7.820

100+ parts

-

1k+ parts

-

10k+ parts

-

384

$7.820

-

-

-

Digiode

USA . 892 parts In-Stock

1+ parts

$7.904

100+ parts

-

1k+ parts

-

10k+ parts

-

892

$7.904

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 677 parts In-Stock

1+ parts

$0.072

100+ parts

-

1k+ parts

-

10k+ parts

$0.069

677

$0.072

-

-

$0.069

Northwest PG Solutions

USA . 1,928 parts In-Stock

1+ parts

$0.079

100+ parts

-

1k+ parts

-

10k+ parts

$0.070

1,928

$0.079

-

-

$0.070

Modulus Dynamics

Lithuania . 1,867 parts In-Stock

1+ parts

$4.248

100+ parts

$4.078

1k+ parts

$3.908

10k+ parts

-

1,867

$4.248

$4.078

$3.908

-

Aztec Data Supply Inc.

USA . 90 parts In-Stock

1+ parts

$4.928

100+ parts

-

1k+ parts

-

10k+ parts

-

90

$4.928

-

-

-

Corphita

USA . 919 parts In-Stock

1+ parts

$7.488

100+ parts

-

1k+ parts

-

10k+ parts

-

919

$7.488

-

-

-

Andel Nordic

Denmark . 4,348 parts In-Stock

1+ parts

$8.057

100+ parts

-

1k+ parts

$7.734

10k+ parts

$7.734

4,348

$8.057

-

$7.734

$7.734

Component Stockers USA

USA . 148,819 parts In-Stock

1+ parts

$8.480

100+ parts

$7.970

1k+ parts

$7.210

10k+ parts

$7.210

148,819

$8.480

$7.970

$7.210

$7.210

Microchip USA

USA . 288 parts In-Stock

1+ parts

$22.372

100+ parts

-

1k+ parts

-

10k+ parts

-

288

$22.372

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 10,387 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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10,387

-

-

-

-

Authorized Procurement Solutions

USA . 4,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,000

-

-

-

-

A-Z Elektronik GmbH

Germany . 1,830 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,830

-

-

-

-

Alle Elektronik GmbH

Germany . 1,220 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,220

-

-

-

-

Perfect Parts

USA . 140 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

140

-

-

-

-

Technical Specifications

SRAM CYDMX128B16-65BVXI attributes and parameters. Explore more SRAM devices from Infineon Technologies

Specs

Maximum Access Time:

65 ns

Additional Features:

IT CAN OPERATE ALSO 2.5 AND 3.3 VOLT

Input/Output Type:

COMMON

JESD-30 Code:

S-PBGA-B100

Length:

6 mm

Memory Density:

131072 bit

Memory IC Type:

Memory Width:

16

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

100

No. of Words:

8192 words

No. of Words Code:

8K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

8KX16

Output Characteristics:

3-STATE

Output Enable:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA100,10X10,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Parallel or Serial:

PARALLEL

Maximum Seated Height:

1 mm

Maximum Standby Current:

.000006 Amp

Minimum Standby Voltage:

1.7 V

Maximum Supply Current:

40 mA

Maximum Supply Voltage (Vsup):

1.9 V

Minimum Supply Voltage (Vsup):

1.7 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

BALL

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Width:

6 mm

Trade Compliance

CYDMX128B16-65BVXI Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.41

SB

8542.32.00.40

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

Category top products 20

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