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CYDMX128A16-65BVXI

Infineon Technologies

CYDMX128A16-65BVXI by Infineon Technologies

MULTI-PORT SRAM; No. of Terminals: 100; Package Code: VFBGA; Package Shape: SQUARE; Operating Mode: ASYNCHRONOUS; Parallel or Serial: PARALLEL;

Median Price

$9.612

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 10,528 parts In-Stock

1+ parts

-

100+ parts

$8.300

1k+ parts

$7.430

10k+ parts

$6.990

10,528

-

$8.300

$7.430

$6.990

Verical

USA . 3,219 parts In-Stock

1+ parts

-

100+ parts

$10.925

1k+ parts

-

10k+ parts

-

3,219

-

$10.925

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 340 parts In-Stock

1+ parts

$8.788

100+ parts

-

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-

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-

340

$8.788

-

-

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Vyrian

USA . 951 parts In-Stock

1+ parts

$9.250

100+ parts

-

1k+ parts

-

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951

$9.250

-

-

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Electronics Depot

USA . 1,285 parts In-Stock

1+ parts

-

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1,285

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-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Modulus Dynamics

Lithuania . 4,580 parts In-Stock

1+ parts

$2.071

100+ parts

$1.988

1k+ parts

$1.905

10k+ parts

-

4,580

$2.071

$1.988

$1.905

-

Advanced Electronics

New Zealand . 550 parts In-Stock

1+ parts

$4.741

100+ parts

$4.314

1k+ parts

$3.888

10k+ parts

-

550

$4.741

$4.314

$3.888

-

Corohmni

South Africa . 15 parts In-Stock

1+ parts

$5.512

100+ parts

-

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-

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15

$5.512

-

-

-

Corphita

USA . 23 parts In-Stock

1+ parts

$8.325

100+ parts

-

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-

10k+ parts

-

23

$8.325

-

-

-

Component Stockers USA

USA . 12,947 parts In-Stock

1+ parts

$9.420

100+ parts

$8.840

1k+ parts

$8.000

10k+ parts

$8.000

12,947

$9.420

$8.840

$8.000

$8.000

Microchip USA

USA . 416 parts In-Stock

1+ parts

$24.864

100+ parts

-

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416

$24.864

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QUARKTWIN TECHNOLOGY LTD

USA . 29,985 parts In-Stock

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29,985

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A-Z Elektronik GmbH

Germany . 5,291 parts In-Stock

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5,291

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Alle Elektronik GmbH

Germany . 3,527 parts In-Stock

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3,527

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

1+ parts

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3,000

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Native Components

USA . 824 parts In-Stock

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824

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Metaverse IC Inc.

Canada . 700 parts In-Stock

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700

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Northwest PG Solutions

USA . 647 parts In-Stock

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647

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Kepictronics

USA . 600 parts In-Stock

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600

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-

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Perfect Parts

USA . 39 parts In-Stock

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39

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Technical Specifications

SRAM CYDMX128A16-65BVXI attributes and parameters. Explore more SRAM devices from Infineon Technologies

Specs

Maximum Access Time:

65 ns

Additional Features:

IT CAN OPERATE ALSO 2.5 AND 3.3 VOLT

Input/Output Type:

COMMON

JESD-30 Code:

S-PBGA-B100

Length:

6 mm

Memory Density:

131072 bit

Memory IC Type:

Memory Width:

16

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

100

No. of Words:

8192 words

No. of Words Code:

8K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

8KX16

Output Characteristics:

3-STATE

Output Enable:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA100,10X10,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Parallel or Serial:

PARALLEL

Maximum Seated Height:

1 mm

Maximum Standby Current:

.000006 Amp

Minimum Standby Voltage:

1.7 V

Maximum Supply Current:

40 mA

Maximum Supply Voltage (Vsup):

1.9 V

Minimum Supply Voltage (Vsup):

1.7 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

BALL

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Width:

6 mm

Trade Compliance

CYDMX128A16-65BVXI Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.41

SB

8542.32.00.40

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

Category top products 20

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