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CY9BF365KPMC-G-JNE2

Infineon Technologies

CY9BF365KPMC-G-JNE2 by Infineon Technologies

Infineon CY9BF365KPMC-G-JNE2 is a 32-bit microcontroller with 48 terminals, operating at up to 48 MHz. Ideal for automotive applications, it features 8-channel ADC, 2-channel DAC, and peripherals like DMA and RTC. With a wide supply voltage range of 2.7V to 5.5V, this low-profile chip offers versatile connectivity options including CSIO, I2C, LIN, UART, and USB interfaces.

Median Price

$5.375

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 250 parts In-Stock

1+ parts

-

100+ parts

$5.660

1k+ parts

-

10k+ parts

-

250

-

$5.660

-

-

Rochester

USA . 250 parts In-Stock

1+ parts

-

100+ parts

$4.300

1k+ parts

$3.850

10k+ parts

$3.620

250

-

$4.300

$3.850

$3.620

Verical

USA . 250 parts In-Stock

1+ parts

-

100+ parts

$5.375

1k+ parts

$4.813

10k+ parts

$4.525

250

-

$5.375

$4.813

$4.525

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 105 parts In-Stock

1+ parts

$4.541

100+ parts

-

1k+ parts

-

10k+ parts

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105

$4.541

-

-

-

Vyrian

USA . 584 parts In-Stock

1+ parts

$4.780

100+ parts

-

1k+ parts

-

10k+ parts

-

584

$4.780

-

-

-

Nova Conductors

Japan . 100 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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100

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 130 parts In-Stock

1+ parts

$4.060

100+ parts

-

1k+ parts

-

10k+ parts

-

130

$4.060

-

-

-

Corphita

USA . 573 parts In-Stock

1+ parts

$4.302

100+ parts

-

1k+ parts

-

10k+ parts

-

573

$4.302

-

-

-

Modulus Dynamics

Lithuania . 859 parts In-Stock

1+ parts

$26.935

100+ parts

$25.858

1k+ parts

$24.780

10k+ parts

-

859

$26.935

$25.858

$24.780

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QUARKTWIN TECHNOLOGY LTD

USA . 20,206 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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20,206

-

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Microchip USA

USA . 3,822 parts In-Stock

1+ parts

-

100+ parts

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3,822

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-

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Aranea Global

USA . 500 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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500

-

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Authorized Procurement Solutions

USA . 500 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

-

10k+ parts

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500

-

-

-

-

Overview

Unlock the power of innovation with the CY9BF365KPMC-G-JNE2 by Infineon Technologies. This cutting-edge microcontroller offers unparalleled performance and reliability for a wide range of applications. From automotive to industrial, this versatile device delivers high-speed processing and advanced connectivity options to meet your project needs. Trust in the quality and expertise of Infineon Technologies to bring your designs to life. Discover the value and benefits this product has to offer and revolutionize your next project today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the microcontroller, ensuring a longer lifespan.

Surface Mount: YES

Easier and more efficient installation on circuit boards.

Maximum Supply Voltage: 5.5 V

Allows for flexibility in power input without risking damage to the microcontroller.

Package Shape: SQUARE

Compact design that saves space on the circuit board.

Bit Size: 32

Higher bit size allows for more complex processing capabilities.

DAC Channels: YES

Enables analog output for a wider range of applications.

No. of Terminals: 48

Sufficient number of terminals for connectivity and interfacing with other components.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Facilitates compact and efficient circuit design.

Minimum Supply Voltage: 2.7 V

Allows for low power operation and energy efficiency.

Maximum Operating Temperature: 125 °C

Capable of operating in high temperature environments, suitable for industrial and automotive applications.

Minimum Operating Temperature: -40 °C

Capable of operating in low temperature environments, suitable for a wide range of applications.

Terminal Finish: PURE TIN

Provides good conductivity and corrosion resistance for reliable connections.

ADC Channels: YES

Enables analog input for a wide range of sensors and signal processing.

DMA Channels: YES

Allows for efficient data transfer between peripherals and memory, improving overall system performance.

Terminal Position: QUAD

Facilitates easy and secure mounting on the circuit board.

ROM Words: 425984

Large ROM capacity for storing program instructions and data.

Maximum Seated Height: 1.7 mm

Low profile design for space-constrained applications.

Digital To Analog Convertors: 2-Ch 12-Bit

Provides accurate analog output for various interfacing needs.

Width: 7 mm

Compact form factor for integration into small devices.

Peripherals: DMA(8), POR, RTC, TIMER(16), WDT(2)

Wide range of peripherals for enhanced functionality and connectivity.

Maximum Clock Frequency: 48 MHz

High clock frequency for faster processing and response times.

Length: 7 mm

Compact form factor for integration into small devices.

Temperature Grade: AUTOMOTIVE

Meets automotive industry standards for reliability and performance in automotive applications.

Peripheral IC Type: MICROCONTROLLER, RISC

Uses RISC architecture for efficient processing and control capabilities.

RAM Bytes: 49152

Sufficient RAM capacity for data storage and processing.

Technology: CMOS

Low power consumption and high noise immunity.

Terminal Form: GULL WING

Secure and reliable terminal design for robust connections.

Analog To Digital Convertors: 8-Ch 12-Bit

Provides accurate analog to digital conversion for input signal processing.

Nominal Supply Voltage: 4.5 V

Optimal supply voltage for stable operation and performance.

PWM Channels: YES

Enables pulse-width modulation for precise control of analog outputs.

Connectivity: CSIO(5), I2C(6), LIN(5), UART(5), USB

Versatile connectivity options for communication with external devices and systems.

ROM Programmability: FLASH

Allows for flexible and reprogrammable ROM for firmware updates and customization.

Terminal Pitch: 0.5 mm

Fine pitch design for compact layout and efficient PCB design.

Moisture Sensitivity Level (MSL): 3

Suitable for a wide range of environmental conditions and moisture exposure.

Speed: 160 rpm

High processing speed for real-time applications and fast response times.

On Chip Program ROM Width: 8

Wide ROM width for storing program instructions and data.

No. of I/O Lines: 33

Sufficient I/O lines for interfacing with external devices and peripherals.

Technical Specifications

Microcontrollers CY9BF365KPMC-G-JNE2 attributes and parameters. Explore more Microcontrollers devices from Infineon Technologies

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

48 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G48

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

33

No. of Terminals:

48

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

RAM Bytes:

49152

ROM Words:

425984

ROM Programmability:

FLASH

Maximum Seated Height:

1.7 mm

Speed:

160 rpm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.7 V

Nominal Supply Voltage:

4.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

PURE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CSIO(5), I2C(6), LIN(5), UART(5), USB

Peripherals:

DMA(8), POR, RTC, TIMER(16), WDT(2)

Analog To Digital Convertors:

8-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

CY9BF365KPMC-G-JNE2 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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