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CY91F594BSPMC-GSE1

Infineon Technologies

CY91F594BSPMC-GSE1 by Infineon Technologies

Infineon's CY91F594BSPMC-GSE1 microcontroller features 32-bit architecture, 8KB RAM, and 25-bit address bus width. Ideal for applications requiring low power consumption, it supports up to 16 DMA channels and offers connectivity options like CAN, I2C, LIN, SPI, and UART.

Median Price

$22.162

Lifecycle Status

EOL

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 830 parts In-Stock

1+ parts

-

100+ parts

$19.700

1k+ parts

$17.630

10k+ parts

$16.590

830

-

$19.700

$17.630

$16.590

Verical

USA . 444 parts In-Stock

1+ parts

-

100+ parts

$24.625

1k+ parts

$22.038

10k+ parts

$20.738

444

-

$24.625

$22.038

$20.738

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 701 parts In-Stock

1+ parts

-

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701

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Digiode

USA . 242 parts In-Stock

1+ parts

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242

-

-

-

-

TME

Poland . 170 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$10.720

10k+ parts

-

170

-

-

$10.720

-

Nova Conductors

Japan . 10 parts In-Stock

1+ parts

-

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-

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10

-

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 530 parts In-Stock

1+ parts

$18.660

100+ parts

-

1k+ parts

-

10k+ parts

-

530

$18.660

-

-

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Modulus Dynamics

Lithuania . 1,286 parts In-Stock

1+ parts

$18.808

100+ parts

$18.056

1k+ parts

$17.303

10k+ parts

-

1,286

$18.808

$18.056

$17.303

-

Microchip USA

USA . 1,747 parts In-Stock

1+ parts

$55.330

100+ parts

-

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-

10k+ parts

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1,747

$55.330

-

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Authorized Procurement Solutions

USA . 3,080 parts In-Stock

1+ parts

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3,080

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GreenTree Electronics

Israel . 1,800 parts In-Stock

1+ parts

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1,800

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Argo Parts USA

USA . 1,110 parts In-Stock

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1,110

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Continental Prestige Electronics

USA . 598 parts In-Stock

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598

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Aranea Global

USA . 500 parts In-Stock

1+ parts

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100+ parts

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500

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A-Z Elektronik GmbH

Germany . 500 parts In-Stock

1+ parts

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500

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Corphita

USA . 57 parts In-Stock

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57

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Overview

Unlock the power of advanced technology with the CY91F594BSPMC-GSE1 microcontroller by Infineon Technologies. Designed with precision and expertise, this versatile device offers unparalleled performance for a wide range of applications. From automotive to industrial automation, this microcontroller delivers exceptional value and benefits to customers looking for reliable and efficient solutions. Experience seamless connectivity, enhanced functionality, and superior quality with this innovative product. Choose excellence, choose Infineon Technologies.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material for compact and sturdy packaging.

Maximum Supply Voltage: 5.5 V

Allows for flexibility in power supply options.

Bit Size: 32

High bit size allows for processing large amounts of data efficiently.

No. of Terminals: 208

Provides ample connectivity options for various peripherals.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity.

Analog To Digital Convertors: 32-Ch 10-Bit

Multiple ADC channels with high resolution for accurate analog signal conversion.

Connectivity: CAN(3), I2C(2), LIN(6), SPI, UART(6)

Offers a wide range of communication options for connecting to different devices.

Low Power Mode: YES

Enables energy-efficient operation, prolonging battery life in portable devices.

Technical Specifications

Microcontrollers CY91F594BSPMC-GSE1 attributes and parameters. Explore more Microcontrollers devices from Infineon Technologies

Specs

ADC Channels:

YES

Additional Features:

IT ALSO HAS 800KB VRAM

Address Bus Width:

25

Bit Size:

32

Boundary Scan:

YES

CPU Family:

FR81

Maximum Clock Frequency:

4 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

16

Format:

FLOATING-POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G208

Length:

28 mm

Low Power Mode:

YES

No. of DMA Channels:

16

No. of External Interrupts:

16

No. of I/O Lines:

156

No. of Serial I/Os:

9

No. of Terminals:

208

No. of Timers:

4

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP208,1.2SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

RAM Bytes:

73728

ROM Words:

1114112

ROM Programmability:

FLASH

Maximum Seated Height:

1.7 mm

Speed:

80 rpm

Maximum Supply Current:

165 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

28 mm

Peripheral IC Type:

Data EEPROM Size:

64K

Connectivity:

CAN(3), I2C(2), LIN(6), SPI, UART(6)

Peripherals:

DMA(16), POR, TIMER(42), RTC, WDT(2)

Analog To Digital Convertors:

32-Ch 10-Bit

Trade Compliance

CY91F594BSPMC-GSE1 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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