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CY91F467DAPVSR-GS-UJE2

Infineon Technologies

CY91F467DAPVSR-GS-UJE2 by Infineon Technologies

Infineon's CY91F467DAPVSR-GS-UJE2 is a 32-bit microcontroller with 208 terminals, 170 I/O lines, and ADC/DMA channels. Operating at up to 48 MHz, it features a 26-bit address bus width and supports a max supply voltage of 5.5 V. Ideal for applications requiring high-speed data processing and control functions in compact designs.

Median Price

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Lifecycle Status

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3

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1k+

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Digiode

USA . 829 parts In-Stock

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Vyrian

USA . 633 parts In-Stock

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Nova Conductors

Japan . 500 parts In-Stock

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AZTECH Wire

Italy . 633 parts In-Stock

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$12.240

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$11.760

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$11.520

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$11.290

633

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$11.290

Ampacity Inc.

Singapore . 1,344 parts In-Stock

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$21.000

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Aztec Data Supply Inc.

USA . 4,738 parts In-Stock

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Semicontronic

India . 1,429 parts In-Stock

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$26.000

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$25.350

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$25.220

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Modulus Dynamics

Lithuania . 3,433 parts In-Stock

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$77.698

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$74.590

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$71.482

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Corohmni

South Africa . 571 parts In-Stock

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$79.068

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Continental Prestige Electronics

USA . 3,184 parts In-Stock

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Futuretech Components

Singapore . 1,635 parts In-Stock

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Corphita

USA . 889 parts In-Stock

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Microchip USA

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Argo Parts USA

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Bastille Electronics

Australia . 10 parts In-Stock

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Overview

Unlock endless possibilities with the CY91F467DAPVSR-GS-UJE2 by Infineon Technologies, a high-quality microcontroller designed to revolutionize your projects. Infineon Technologies is a trusted manufacturer known for producing top-of-the-line components. This microcontroller is perfect for a wide range of applications, offering 32-bit processing power and a maximum clock frequency of 48 MHz. With 170 I/O lines and PWM channels, this product provides unparalleled flexibility and control. Elevate your creations with the CY91F467DAPVSR-GS-UJE2 and experience the superior performance and reliability that only Infineon can deliver.

Feature Benefit Bullets

Surface Mount: YES

Surface mount allows for easy installation on printed circuit boards, saving space and making the product more compact.

Maximum Supply Voltage: 5.5 V

The high maximum supply voltage allows for versatility in power supply options and compatibility with a variety of systems.

Package Shape: SQUARE

Square package shape provides stability and ease of handling during assembly and installation.

Bit Size: 32

32-bit architecture allows for faster and more efficient processing of data, making the product suitable for high performance applications.

No. of Terminals: 208

The large number of terminals provide ample connectivity options, making the product versatile and suitable for complex projects.

Minimum Supply Voltage: 3 V

The low minimum supply voltage allows for operation in low power situations, making the product energy efficient.

ADC Channels: YES

Having ADC channels allows for analog to digital conversion, making the product suitable for applications involving sensor data or analog inputs.

DMA Channels: YES

Integrated DMA channels enable direct memory access, improving data transfer efficiency and freeing up the CPU for other tasks.

Width: 28 mm

Compact width makes the product space-saving and suitable for applications where size constraints are a concern.

External Data Bus Width: 32

A wide external data bus width of 32 bits allows for high speed data transfer and processing, enhancing overall performance.

Maximum Clock Frequency: 48 MHz

High maximum clock frequency enables fast processing speeds, making the product suitable for applications with tight timing requirements.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC microcontroller with various peripheral ICs integrated, the product offers efficient and streamlined operation for a wide range of applications.

Nominal Supply Voltage: 5 V

Having a standard nominal supply voltage of 5V ensures compatibility with common power sources and simplifies power management.

PWM Channels: YES

Support for PWM channels allows for precise control of output signals, making the product suitable for applications such as motor control or LED dimming.

No. of I/O Lines: 170

The large number of I/O lines provide extensive connectivity options, allowing for interfacing with a wide range of external devices and sensors.

Technical Specifications

Microcontrollers CY91F467DAPVSR-GS-UJE2 attributes and parameters. Explore more Microcontrollers devices from Infineon Technologies

Specs

ADC Channels:

YES

Address Bus Width:

26

Bit Size:

32

Maximum Clock Frequency:

48 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

32

Length:

28 mm

No. of I/O Lines:

170

No. of Terminals:

208

PWM Channels:

YES

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Speed:

96 rpm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

28 mm

Peripheral IC Type:

Trade Compliance

CY91F467DAPVSR-GS-UJE2 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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