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CY91F467DBPVSR-GS-UJE2

Infineon Technologies

CY91F467DBPVSR-GS-UJE2 by Infineon Technologies

CY91F467DBPVSR-GS-UJE2 by Infineon Technologies is a 32-bit microcontroller with 208 terminals, 170 I/O lines, and ADC/DMA channels. Operating at up to 48 MHz clock frequency, it features a 26-bit address bus width and supports PWM functions. Ideal for applications requiring high-speed data processing and precise control systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Digiode

USA . 377 parts In-Stock

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Chip Stock

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Vyrian

USA . 302 parts In-Stock

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Nova Conductors

Japan . 50 parts In-Stock

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Semicontronic

India . 1,156 parts In-Stock

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$16.000

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$15.600

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$15.520

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Ampacity Inc.

Singapore . 1,416 parts In-Stock

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Aztec Data Supply Inc.

USA . 4,222 parts In-Stock

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$17.980

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AZTECH Wire

Italy . 725 parts In-Stock

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$19.780

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$19.000

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$18.620

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$18.240

725

$19.780

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$18.620

$18.240

Modulus Dynamics

Lithuania . 1,248 parts In-Stock

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$31.520

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$30.259

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$28.998

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Corohmni

South Africa . 216 parts In-Stock

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$50.788

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Continental Prestige Electronics

USA . 6,721 parts In-Stock

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Argo Parts USA

USA . 2,290 parts In-Stock

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Perfect Parts

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Microchip USA

USA . 433 parts In-Stock

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Bastille Electronics

Australia . 300 parts In-Stock

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Corphita

USA . 49 parts In-Stock

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Overview

Unleash the power of cutting-edge technology with the CY91F467DBPVSR-GS-UJE2 microcontroller by Infineon Technologies. Designed with precision and expertise, this innovative device offers unparalleled performance and reliability in a compact package. Ideal for a wide range of applications, from consumer electronics to industrial automation, this microcontroller boasts advanced features such as ADC channels, DMA channels, PWM channels, and more. Elevate your projects to new heights with the CY91F467DBPVSR-GS-UJE2 and experience the difference that quality engineering can make.

Feature Benefit Bullets

Surface Mount:

A surface mount design makes this microcontroller easy to integrate into compact electronic devices.

Maximum Supply Voltage:

With a maximum supply voltage of 5.5V, this microcontroller is versatile and can handle a wide range of power inputs.

Address Bus Width:

An address bus width of 26 enhances the memory addressing capabilities of this microcontroller.

Package Shape:

The square package shape ensures efficient use of space on a circuit board.

Bit Size:

The 32-bit size allows for fast and efficient processing of data.

No. of Terminals:

With 208 terminals, this microcontroller offers plenty of connectivity options for various components and peripherals.

Package Style:

The flatpack, low profile, fine pitch package style makes this microcontroller suitable for applications requiring a compact form factor.

Minimum Supply Voltage:

A minimum supply voltage of 3V provides flexibility in power requirements for different projects.

ADC Channels:

The presence of ADC channels enables analog-to-digital conversion within the microcontroller, making it suitable for sensor interfacing.

DMA Channels:

DMA channels enhance the data transfer capabilities of this microcontroller, improving overall performance.

Terminal Position:

The quad terminal position allows for easy soldering and connection of the microcontroller in a circuit.

Width:

With a width of 28mm, this microcontroller is suitable for applications with space constraints.

External Data Bus Width:

An external data bus width of 32 further enhances data transfer speeds and efficiency.

Maximum Clock Frequency:

A maximum clock frequency of 48MHz ensures rapid processing and execution of instructions.

Length:

The 28mm length of this microcontroller is ideal for use in compact electronic devices.

Peripheral IC Type:

As a microcontroller with a RISC architecture, it offers efficient performance for a wide range of applications.

Terminal Form:

The gull wing terminal form provides robust and reliable connections for the microcontroller.

Nominal Supply Voltage:

With a nominal supply voltage of 5V, this microcontroller is compatible with standard power sources.

PWM Channels:

PWM channels enable precise control over connected devices, making this microcontroller suitable for tasks such as motor control.

Terminal Pitch:

With a terminal pitch of 0.5mm, this microcontroller offers fine-pitch connections for high-density PCB designs.

Speed:

Operating at 96rpm, this microcontroller offers fast processing capabilities for real-time applications.

No. of I/O Lines:

The 170 I/O lines provide ample interfacing options for connecting external devices and peripherals.

Technical Specifications

Microcontrollers CY91F467DBPVSR-GS-UJE2 attributes and parameters. Explore more Microcontrollers devices from Infineon Technologies

Specs

ADC Channels:

YES

Address Bus Width:

26

Bit Size:

32

Maximum Clock Frequency:

48 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

32

Length:

28 mm

No. of I/O Lines:

170

No. of Terminals:

208

PWM Channels:

YES

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Speed:

96 rpm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

28 mm

Peripheral IC Type:

Trade Compliance

CY91F467DBPVSR-GS-UJE2 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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