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CY7C68053-56BAXIT

Infineon Technologies

CY7C68053-56BAXIT by Infineon Technologies

Infineon's CY7C68053-56BAXIT is an 8051 microcontroller with 8-bit CPU, 16-bit address bus, and 8-bit external data bus. Operating at up to 24 MHz, it features a max supply voltage of 1.89 V and is suitable for industrial applications requiring a high-speed microcontroller with 24 I/O lines.

Median Price

$20.620

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 3,921 parts In-Stock

1+ parts

-

100+ parts

$20.620

1k+ parts

$18.450

10k+ parts

$17.370

3,921

-

$20.620

$18.450

$17.370

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,548 parts In-Stock

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-

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4,548

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Chip Stock

USA . 2,700 parts In-Stock

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2,700

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Nova Conductors

Japan . 100 parts In-Stock

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100

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Digiode

USA . 19 parts In-Stock

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19

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Distributors (Availability)

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Corohmni

South Africa . 892 parts In-Stock

1+ parts

$15.703

100+ parts

-

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-

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892

$15.703

-

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Ampacity Inc.

Singapore . 4,739 parts In-Stock

1+ parts

$19.520

100+ parts

-

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4,739

$19.520

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Semicontronic

India . 4,571 parts In-Stock

1+ parts

$19.520

100+ parts

$19.032

1k+ parts

$18.934

10k+ parts

-

4,571

$19.520

$19.032

$18.934

-

Aztec Data Supply Inc.

USA . 188 parts In-Stock

1+ parts

$32.941

100+ parts

-

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-

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188

$32.941

-

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Modulus Dynamics

Lithuania . 958 parts In-Stock

1+ parts

$41.504

100+ parts

$39.844

1k+ parts

$38.184

10k+ parts

-

958

$41.504

$39.844

$38.184

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Microchip USA

USA . 311 parts In-Stock

1+ parts

$50.611

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311

$50.611

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Component Stockers USA

USA . 346 parts In-Stock

1+ parts

$99.990

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346

$99.990

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Glotronic Ltd.

UK . 3,700 parts In-Stock

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3,700

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Argo Parts USA

USA . 3,221 parts In-Stock

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3,221

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Continental Prestige Electronics

USA . 2,734 parts In-Stock

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2,734

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Corphita

USA . 990 parts In-Stock

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990

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Lucentia Tech

USA . 100 parts In-Stock

1+ parts

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100+ parts

$1.465

1k+ parts

$1.465

10k+ parts

$1.465

100

-

$1.465

$1.465

$1.465

Bastille Electronics

Australia . 78 parts In-Stock

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78

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iodParts Technologies Inc.

India . 27 parts In-Stock

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27

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Overview

Unlock limitless possibilities with the CY7C68053-56BAXIT microcontroller by Infineon Technologies. As a leading manufacturer in the industry, Infineon delivers top-quality products that guarantee reliability and performance. Ideal for a wide range of applications, this microcontroller offers unparalleled value and benefits to customers looking for cutting-edge technology. Experience seamless integration, superior functionality, and innovative solutions with the CY7C68053-56BAXIT microcontroller. Upgrade your projects today with this versatile and high-performing product.

Feature Benefit Bullets

Package Body Material : PLASTIC/EPOXY

Plastic/epoxy material provides durability and protection for the microcontroller, ensuring reliable performance in various environmental conditions.

Surface Mount : YES

Surface mount capability allows for easy and efficient integration of the microcontroller onto PCBs, saving space and simplifying assembly processes.

Maximum Supply Voltage : 1.89 V

Low maximum supply voltage helps in reducing power consumption and minimizing heat dissipation, contributing to energy efficiency.

Address Bus Width : 16

A wider address bus allows for accessing a larger memory space, enabling the microcontroller to handle complex tasks and store more data.

Package Shape : SQUARE

Square package shape facilitates easier placement and orientation of the microcontroller on the PCB, optimizing space utilization and layout design.

Bit Size : 8

8-bit architecture offers a good balance of performance and cost-effective solution for basic embedded system applications.

Power Supplies (V) : 1.8,3.3

Multiple power supply options allow flexibility in voltage selection for different operational requirements and interfaces with other components.

No. of Terminals : 56

A higher number of terminals enable enhanced connectivity options and peripheral interfacing, expanding the functionality and versatility of the microcontroller.

Package Style (Meter) : GRID ARRAY, FINE PITCH

Grid array and fine pitch package style offer high-density mounting capabilities, enabling compact and efficient PCB designs with increased component density.

Minimum Supply Voltage : 1.71 V

Low minimum supply voltage ensures operational reliability and stability even under low power conditions, enhancing overall system performance.

Maximum Operating Temperature : 85 °C

Wide operating temperature range of up to 85°C allows the microcontroller to function effectively in a variety of temperature environments, making it suitable for industrial applications.

CPU Family : 8051

8051 CPU family is well-established and widely supported, offering a proven and reliable architecture for embedded system development.

Minimum Operating Temperature : -40 °C

Low minimum operating temperature of -40°C ensures reliable performance in harsh and cold environments, making it suitable for various industrial applications.

Terminal Finish : TIN SILVER COPPER

Tin silver copper terminal finish provides good solderability and corrosion resistance, ensuring robust connections and long-term reliability.

Terminal Position : BOTTOM

Bottom terminal position simplifies PCB layout and assembly processes, allowing for easier access and connection to other components and peripherals.

Width : 5 mm

Compact width dimension enables easy integration into space-constrained designs and allows for efficient placement on the PCB, optimizing layout flexibility.

External Data Bus Width : 8

8-bit external data bus width allows for efficient data transfer and processing, suitable for handling moderate complexity tasks in embedded systems.

Maximum Clock Frequency : 24 MHz

High maximum clock frequency of 24 MHz provides fast processing speed and improves overall system performance, making it suitable for real-time applications.

Length : 5 mm

Compact length dimension facilitates space-saving integration and PCB layout optimization, ensuring efficient use of available space in compact designs.

Temperature Grade : INDUSTRIAL

Industrial temperature grade certification ensures reliable operation and performance in harsh industrial environments, making it suitable for rugged applications.

Peripheral IC Type : MICROCONTROLLER

Microcontroller with built-in peripheral ICs offers integrated functionality and versatile capabilities, reducing the need for additional external components and simplifying system design.

RAM Bytes : 16384

Large RAM size of 16384 bytes provides ample memory space for data storage and processing, allowing for efficient multitasking and complex algorithm execution.

Technology : CMOS

CMOS technology offers low power consumption, high noise immunity, and fast switching speeds, enhancing energy efficiency and overall performance of the microcontroller.

Terminal Form : BALL

Ball terminal form provides reliable connections and improved mechanical strength, ensuring secure mounting and stable performance in demanding operational conditions.

Nominal Supply Voltage : 1.8 V

Low nominal supply voltage of 1.8 V helps in reducing power consumption and heat dissipation, contributing to energy-efficient operation and extended battery life.

Terminal Pitch : 0.5 mm

Fine terminal pitch of 0.5 mm allows for high-density mounting and compact PCB designs, enabling efficient use of available board space and component placement.

Moisture Sensitivity Level (MSL) : 3

Moisture sensitivity level of 3 indicates moderate sensitivity to moisture exposure, requiring proper handling and storage to prevent potential damage during assembly and operation.

Speed : 48 rpm

High processing speed of 48 rpm enables efficient data processing and rapid response times, making it suitable for time-critical applications and real-time control systems.

No. of I/O Lines : 24

A generous number of I/O lines provides versatile connectivity options and peripheral interfacing capabilities, allowing for flexible interactions with external devices and sensors.

Technical Specifications

Microcontrollers CY7C68053-56BAXIT attributes and parameters. Explore more Microcontrollers devices from Infineon Technologies

Specs

ADC Channels:

NO

Address Bus Width:

16

Bit Size:

8

CPU Family:

8051

Maximum Clock Frequency:

24 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

8

JESD-30 Code:

S-PBGA-B56

JESD-609 Code:

e1

Length:

5 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

24

No. of Terminals:

56

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA56,8X8,20

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Power Supplies (V):

1.8,3.3

Qualification:

Not Qualified

RAM Bytes:

16384

Speed:

48 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

1.89 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Width:

5 mm

Peripheral IC Type:

Trade Compliance

CY7C68053-56BAXIT Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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