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CY7C64713-100AXCT

Infineon Technologies

CY7C64713-100AXCT by Infineon Technologies

CY7C64713-100AXCT by Infineon: 8-bit microcontroller with 16-bit address bus, 24 MHz clock frequency, and EEPROM ROM programmability. Ideal for commercial applications requiring low-profile flatpack design and 3.3V nominal voltage.

Median Price

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Lifecycle Status

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5

In-Stock Inventory

1k+

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Digiode

USA . 651 parts In-Stock

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Vyrian

USA . 444 parts In-Stock

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Nova Conductors

Japan . 50 parts In-Stock

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Sensible Micro Corp

USA . 10 parts In-Stock

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Cyclops Electronics Ltd

UK . 10 parts In-Stock

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AZTECH Wire

Italy . 775 parts In-Stock

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$15.891

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Ampacity Inc.

Singapore . 673 parts In-Stock

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$31.000

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Modulus Dynamics

Lithuania . 656 parts In-Stock

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$41.590

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$39.926

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$38.263

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Corohmni

South Africa . 1,136 parts In-Stock

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$85.428

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Argo Parts USA

USA . 4,898 parts In-Stock

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Corphita

USA . 761 parts In-Stock

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Continental Prestige Electronics

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Bastille Electronics

Australia . 40 parts In-Stock

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Overview

Unleash the power of cutting-edge technology with the CY7C64713-100AXCT microcontroller by Infineon Technologies. This high-quality product offers unparalleled performance and reliability, making it the perfect choice for a wide range of applications. From industrial automation to consumer electronics, this microcontroller delivers exceptional value, efficiency, and functionality. Stay ahead of the curve and experience the advantages that only Infineon Technologies can provide. Elevate your projects to new heights with the CY7C64713-100AXCT microcontroller today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product suitable for a wide range of applications.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards, saving space and simplifying the manufacturing process.

Maximum Supply Voltage: 3.45 V

Provides versatility in power supply options and compatibility with various voltage sources.

Address Bus Width: 16

Allows for efficient memory addressing and data transfer operations, improving overall performance.

Package Shape: RECTANGULAR

Facilitates easy integration into standard electronic assemblies and systems.

Bit Size: 8

Suitable for handling a wide range of tasks and applications, striking a balance between performance and power efficiency.

No. of Terminals: 100

Offers flexibility in connectivity options and supports complex circuit configurations.

Minimum Supply Voltage: 3.15 V

Ensures stable operation even with lower voltage inputs, increasing reliability in various operating conditions.

Maximum Operating Temperature: 70 °C

Allows for operation in a wide range of temperature environments, making the product suitable for diverse applications.

Minimum Operating Temperature: 0 °C

Ensures reliable performance even in low-temperature conditions, expanding the product's usability in different settings.

Terminal Finish: NICKEL PALLADIUM GOLD

Provides excellent conductivity and corrosion resistance, ensuring long-term reliability and performance.

Terminal Position: QUAD

Facilitates easy placement and soldering onto circuit boards, simplifying assembly processes.

Maximum Seated Height: 1.6 mm

Low profile design saves space and allows for compact designs in space-constrained applications.

Width: 14 mm

Compact size enables integration into small form-factor devices and systems.

External Data Bus Width: 8

Efficient data transfer capabilities suitable for various computing and control applications.

Maximum Clock Frequency: 24 MHz

Fast processing speed for quick response times and high-performance computing tasks.

Length: 20 mm

Optimal size for fitting into various electronic designs while providing necessary functionalities.

Temperature Grade: COMMERCIAL

Designed for standard commercial use, suitable for a wide range of industries and applications.

Peripheral IC Type: MICROCONTROLLER

Integrated peripheral functions for enhanced capabilities and versatile applications.

Technology: CMOS

Enhanced power efficiency and speed performance, ideal for battery-powered devices and energy-conscious applications.

Terminal Form: GULL WING

Facilitates easy soldering and connection to circuit boards, ensuring reliable electrical connections.

Nominal Supply Voltage: 3.3 V

Standard supply voltage for compatibility with common power sources and electronic components.

ROM Programmability: EEPROM

Flexible and reprogrammable memory storage for customizable and upgradeable applications.

Terminal Pitch: 0.65 mm

Fine pitch for compact design and efficient connectivity in tight spaces.

Moisture Sensitivity Level (MSL): 3

Resistant to moisture damage, ensuring reliability in humid or wet environments.

Speed: 48 rpm

High processing speed and performance for time-sensitive applications and real-time operations.

No. of I/O Lines: 40

Sufficient input/output capabilities for versatile connectivity and communication with external devices.

Technical Specifications

Microcontrollers CY7C64713-100AXCT attributes and parameters. Explore more Microcontrollers devices from Infineon Technologies

Specs

ADC Channels:

NO

Address Bus Width:

16

Bit Size:

8

Maximum Clock Frequency:

24 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

8

JESD-30 Code:

R-PQFP-G100

JESD-609 Code:

e4

Length:

20 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

40

No. of Terminals:

100

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

ROM Programmability:

EEPROM

Maximum Seated Height:

1.6 mm

Speed:

48 rpm

Maximum Supply Voltage:

3.45 V

Minimum Supply Voltage:

3.15 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Width:

14 mm

Peripheral IC Type:

Trade Compliance

CY7C64713-100AXCT Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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