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CY25100SXCFT

Infineon Technologies

CY25100SXCFT by Infineon Technologies

CLOCK GENERATOR, OTHER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;

Median Price

$13.270

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Flip Electronics (Authorized)

USA . 12,500 parts In-Stock

1+ parts

-

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12,500

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Rochester

USA . 10,000 parts In-Stock

1+ parts

-

100+ parts

$12.120

1k+ parts

$10.850

10k+ parts

$10.210

10,000

-

$12.120

$10.850

$10.210

DigiKey

USA . 10,000 parts In-Stock

1+ parts

-

100+ parts

$13.270

1k+ parts

-

10k+ parts

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10,000

-

$13.270

-

-

Verical

USA . 10,000 parts In-Stock

1+ parts

-

100+ parts

$15.113

1k+ parts

$13.525

10k+ parts

$12.725

10,000

-

$15.113

$13.525

$12.725

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 753 parts In-Stock

1+ parts

$12.796

100+ parts

-

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753

$12.796

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Vyrian

USA . 440 parts In-Stock

1+ parts

$13.470

100+ parts

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440

$13.470

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Flip Electronics

USA . 12,500 parts In-Stock

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-

100+ parts

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1k+ parts

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10k+ parts

-

12,500

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 188 parts In-Stock

1+ parts

$0.559

100+ parts

-

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-

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188

$0.559

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-

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Northwest PG Solutions

USA . 21 parts In-Stock

1+ parts

$0.615

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-

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21

$0.615

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Corphita

USA . 769 parts In-Stock

1+ parts

$12.123

100+ parts

-

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769

$12.123

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Modulus Dynamics

Lithuania . 1,087 parts In-Stock

1+ parts

$47.613

100+ parts

$45.708

1k+ parts

$43.804

10k+ parts

-

1,087

$47.613

$45.708

$43.804

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Corohmni

South Africa . 2,560 parts In-Stock

1+ parts

$73.280

100+ parts

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2,560

$73.280

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Microchip USA

USA . 11,402 parts In-Stock

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11,402

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A-Z Elektronik GmbH

Germany . 6,165 parts In-Stock

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6,165

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Alle Elektronik GmbH

Germany . 4,110 parts In-Stock

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4,110

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Technical Specifications

Clock Generators CY25100SXCFT attributes and parameters. Explore more Clock Generators devices from Infineon Technologies

Specs

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

4.889 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

8

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Maximum Output Clock Frequency:

200 MHz

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Nominal Primary Clock/Crystal Frequency:

166 MHz

Qualification:

Not Qualified

Maximum Seated Height:

1.727 mm

Sub-Category:

Clock Generators

Maximum Supply Current:

35 mA

Maximum Supply Voltage:

3.45 V

Minimum Supply Voltage:

3.13 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.8985 mm

Peripheral IC Type:

Trade Compliance

CY25100SXCFT Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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