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BUX84

Infineon Technologies

BUX84 by Infineon Technologies

NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 4 MHz; Maximum Power Dissipation (Abs): 40 W; Maximum Collector Current (IC): 2 A;

Median Price

$0.206

Lifecycle Status

Suppliers In-Stock

28

In-Stock Inventory

1k+

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Newark

USA . 166 parts In-Stock

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Digiode

USA . 12,831 parts In-Stock

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Anansix

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Vyrian

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

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Bristol Electronics

USA . 1,053 parts In-Stock

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Holdelec - ElecDif-Pro

France . 808 parts In-Stock

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LIBRA Elektronik GmbH

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Belgium . 742 parts In-Stock

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Amar Radio Corporation

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Electronic Expediters

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ECAB

Sweden . 312 parts In-Stock

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Kiltronic GmbH

Germany . 300 parts In-Stock

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Zilex Electronics Inc.

Canada . 284 parts In-Stock

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Manotoh

Italy . 250 parts In-Stock

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Dark Horse Electronics

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Fibra_Brandt Electronic GMBH

Germany . 159 parts In-Stock

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GES GmbH

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ICP Electronique

France . 79 parts In-Stock

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A&K Electronics

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Rotakorn

Sweden . 60 parts In-Stock

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LittleDiode

UK . 55 parts In-Stock

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LWI Electronics Inc

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Huijzer Components

Netherlands . 30 parts In-Stock

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Donberg Electronics Ltd

Ireland . 5 parts In-Stock

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Cyclops Electronics Ltd

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MISTER SPROCKETS

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Corphita

USA . 9,742 parts In-Stock

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Corohmni

South Africa . 272 parts In-Stock

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IDEA Electronic Components Group

UK . 858 parts In-Stock

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Modulus Dynamics

Lithuania . 1,113 parts In-Stock

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ChromeModa Solutions

Germany . 2,624 parts In-Stock

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DigiPath Technology Company

USA . 1,014 parts In-Stock

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MKK Technologies

India . 710 parts In-Stock

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Northwest PG Solutions

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UNI Independent Distributors

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Parana Technologies

USA . 3,151 parts In-Stock

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SupplyDigital Components

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Kulean Microsystems

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Problanco Electronics

Mexico . 1,378 parts In-Stock

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TANS Electronics

Latvia . 849 parts In-Stock

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UHIMA Technologies

Türkiye . 378 parts In-Stock

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Perfect Parts

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Cyclops Electronics Ltd (Excess)

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Technical Specifications

Other Function Transistors BUX84 attributes and parameters. Explore more Other Function Transistors devices from Infineon Technologies

Specs

Maximum Collector Current (IC):

2 A

Configuration:

Minimum DC Current Gain (hFE):

30

JESD-609 Code:

e0

No. of Elements:

1

Maximum Operating Temperature:

150 Cel

Polarity or Channel Type:

NPN

Maximum Power Dissipation (Abs):

Sub-Category:

Other Transistors

Surface Mount:

NO

Terminal Finish:

Tin/Lead (Sn/Pb)

Nominal Transition Frequency (fT):

Trade Compliance

BUX84 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

NSN

5961-12-322-1690, 5961123221690, 5961-01-336-2045, 5961013362045

NIIN

123221690, 013362045

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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