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BTS4141D

Infineon Technologies

BTS4141D by Infineon Technologies

BTS4141D by Infineon is a MOS technology peripheral driver with built-in protections for transient, over current, and over voltage. It operates b/w -40 to 125 °C and has a max supply voltage of 45 V. Widely used in automotive applications due to its small outline package style and source output current flow direction.

Median Price

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Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

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Vyrian

USA . 8,096 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 1,894 parts In-Stock

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PC Components Company LLC

USA . 1,500 parts In-Stock

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Bristol Electronics

USA . 1,500 parts In-Stock

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VNN

France . 1,071 parts In-Stock

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Nova Conductors

Japan . 700 parts In-Stock

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ComSIT Distribution GmbH

Germany . 223 parts In-Stock

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Huijzer Components

Netherlands . 100 parts In-Stock

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Digiode

USA . 61 parts In-Stock

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Carlin Systems, Inc.

USA . 12 parts In-Stock

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Corohmni

South Africa . 235 parts In-Stock

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$2.811

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Modulus Dynamics

Lithuania . 2,251 parts In-Stock

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$3.627

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$3.482

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$3.337

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Aztec Data Supply Inc.

USA . 153 parts In-Stock

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$6.895

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AZTECH Wire

Italy . 680 parts In-Stock

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Ampacity Inc.

Singapore . 912 parts In-Stock

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$23.500

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A-Z Elektronik GmbH

Germany . 8,408 parts In-Stock

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Glotronic Ltd.

UK . 3,900 parts In-Stock

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Argo Parts USA

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Alle Elektronik GmbH

Germany . 3,487 parts In-Stock

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Continental Prestige Electronics

USA . 3,023 parts In-Stock

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Bastille Electronics

Australia . 1,000 parts In-Stock

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Microchip USA

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Corphita

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Assy Fe

Spain . 5 parts In-Stock

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Overview

Experience the power and reliability of the BTS4141D by Infineon Technologies, a leading manufacturer in the industry. As a high-quality peripheral driver, this product offers built-in protections against transient, over current, over voltage, thermal, and under voltage situations. With a wide range of applications in automotive technology, the BTS4141D provides customers with unmatched value and benefits. Trust in the innovative technology and superior performance of Infineon Technologies to enhance your projects and drive success.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the peripheral driver.

Surface Mount: YES

Allows for easy installation on circuit boards without the need for additional mounting hardware.

Built-in Protections: TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

Multiple protections ensure the safety and reliability of the peripheral driver in various operating conditions.

Maximum Operating Temperature: 125 °C

Can operate in high temperature environments without risk of damage or malfunction.

Terminal Finish: TIN LEAD

Provides good electrical conductivity and corrosion resistance for the terminals of the peripheral driver.

Technology: MOS

Utilizes Metal-Oxide-Semiconductor technology for efficient and reliable performance.

Technical Specifications

Peripheral Drivers BTS4141D attributes and parameters. Explore more Peripheral Drivers devices from Infineon Technologies

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

Driver No. of Bits:

1

JESD-30 Code:

R-PSSO-G4

JESD-609 Code:

e0

Length:

6.5 mm

No. of Functions:

1

No. of Terminals:

4

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Current Flow Direction:

SOURCE

Nominal Output Peak Current Limit:

1.4 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SMSIP5H,.37,50TB

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

24

Qualification:

Not Qualified

Maximum Seated Height:

2.5 mm

Sub-Category:

Peripheral Drivers

Maximum Supply Voltage:

45 V

Minimum Supply Voltage:

12 V

Nominal Supply Voltage:

15 V

Surface Mount:

YES

Technology:

MOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.14 mm

Terminal Position:

SINGLE

Turn-off Time:

150 us

Turn-on Time:

100 us

Width:

6.22 mm

Trade Compliance

BTS4141D Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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