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BTS282ZE-3180A

Infineon Technologies

BTS282ZE-3180A by Infineon Technologies

BTS282ZE-3180A by Infineon is a N-channel Power FET with 49V DS breakdown voltage and 320A IDM. It features a built-in diode, temp sensor, and 0.0095 ohm RDS(on), suitable for switching applications. With a max operating temp of 175°C, it's ideal for high-power systems requiring efficient performance.

Median Price

$2.130

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 3,098 parts In-Stock

1+ parts

$2.130

100+ parts

$2.090

1k+ parts

$2.040

10k+ parts

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3,098

$2.130

$2.090

$2.040

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Distributors (In-Stock)

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Digiode

USA . 202 parts In-Stock

1+ parts

$2.052

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202

$2.052

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Bristol Electronics

USA . 437 parts In-Stock

1+ parts

$7.168

100+ parts

$3.106

1k+ parts

$2.939

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437

$7.168

$3.106

$2.939

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ComSIT Distribution GmbH

Germany . 50,367 parts In-Stock

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50,367

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Rutronik

Germany . 14,000 parts In-Stock

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$2.280

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14,000

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$2.280

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Vyrian

USA . 4,285 parts In-Stock

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4,285

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ComSIT USA

USA . 538 parts In-Stock

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538

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VNN

France . 100 parts In-Stock

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100

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Nova Conductors

Japan . 26 parts In-Stock

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26

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QIE Inc.

USA . 9 parts In-Stock

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9

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Distributors (Availability)

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Ampacity Inc.

Singapore . 418 parts In-Stock

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$1.840

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418

$1.840

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Modulus Dynamics

Lithuania . 2,510 parts In-Stock

1+ parts

$1.881

100+ parts

$1.806

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$1.731

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2,510

$1.881

$1.806

$1.731

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Corphita

USA . 681 parts In-Stock

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$1.944

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681

$1.944

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AZTECH Wire

Italy . 91 parts In-Stock

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$16.790

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91

$16.790

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Perfect Parts

USA . 39,117 parts In-Stock

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A-Z Elektronik GmbH

Germany . 15,677 parts In-Stock

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15,677

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Authorized Procurement Solutions

USA . 8,500 parts In-Stock

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8,500

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Alle Elektronik GmbH

Germany . 3,079 parts In-Stock

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3,079

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Netroflash

USA . 500 parts In-Stock

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500

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Overview

Discover the BTS282ZE-3180A by Infineon Technologies, a high-quality Power Field Effect Transistor designed for switching applications. With a single configuration, built-in diode, and temperature sensor, this N-channel transistor offers unparalleled performance and reliability. Ideal for various electronic devices, this transistor provides maximum pulsing drain current of 320A and a minimum breakdown voltage of 49V. Trust in the expertise of Infineon Technologies to deliver cutting-edge technology that exceeds expectations. Upgrade your projects with the BTS282ZE-3180A and experience the superior value and benefits it brings to your designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy package body material provides good insulation and protection for the internal components of the transistor, ensuring its durability and reliability in various operating conditions.

Polarity or Channel Type: N-CHANNEL

N-channel transistors typically have higher mobility and lower resistance compared to P-channel transistors, leading to better overall performance and efficiency.

Configuration: SINGLE WITH BUILT-IN DIODE AND TEMPERATURE SENSOR

Built-in diode and temperature sensor add extra functionality to the transistor, allowing for more advanced control and monitoring features in power applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET is optimized for fast turn-on/off times and efficient power handling, making it ideal for power management and control tasks.

Surface Mount: YES

Surface mount capability allows for easy and convenient integration onto PCBs, saving space and simplifying assembly processes in modern electronic devices.

Minimum DS Breakdown Voltage: 49 V

With a minimum breakdown voltage of 49V, this FET can safely handle high voltage spikes and surges without risking damage to the device or the circuit it is a part of.

Package Shape: RECTANGULAR

Rectangular package shape provides a compact form factor for the transistor, enabling dense packing in PCB layouts and efficient use of space in electronic designs.

Terminal Form: GULL WING

Gull wing terminal form offers robust mechanical strength and easy soldering connections, ensuring reliable electrical contacts and secure mounting on circuit boards.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for more precise control over the transistor's switching behavior, resulting in improved efficiency and performance in power management applications.

Maximum Pulsed Drain Current (IDM): 320 A

High maximum pulsed drain current rating of 320A enables this FET to handle short-duration peak currents effectively, making it suitable for applications requiring power spikes or surges.

Avalanche Energy Rating (EAS): 2000 mJ

High avalanche energy rating of 2000mJ indicates the FET's ability to withstand and dissipate energy induced by sudden voltage spikes, ensuring long-term reliability in demanding environments.

No. of Terminals: 7

Seven terminals provide multiple connection points for power supply, control signals, and temperature sensing, enabling versatile integration and functionality in complex electronic systems.

Package Style (Meter): SMALL OUTLINE

Small outline package style offers a compact footprint and low profile design, allowing for space-efficient placement on PCBs and enabling high-density component layouts in compact devices.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology provides high performance, low power consumption, and excellent thermal stability, making this FET suitable for a wide range of power management applications.

Maximum Operating Temperature: 175 °C

High maximum operating temperature of 175°C ensures reliable performance in harsh environmental conditions or high-temperature applications, providing thermal robustness and long-term stability.

Transistor Element Material: SILICON

Silicon material for the transistor element offers high efficiency, low noise, and reliable operation, making it a preferred choice for power handling and switching applications in electronic circuits.

Terminal Finish: TIN

Tin terminal finish provides good solderability and corrosion resistance, ensuring strong and reliable electrical connections for the FET in various operating environments.

Maximum Drain Current (ID): 80 A

High maximum drain current rating of 80A allows this FET to handle significant power loads with efficiency and reliability, making it suitable for high-power switching applications.

Maximum Drain-Source On Resistance: 0.0095 ohm

Low maximum drain-source on resistance of 0.0095 ohm results in minimal power loss and heat generation during operation, improving the efficiency and performance of the FET in power management tasks.

Terminal Position: SINGLE

Single terminal position simplifies the connection and mounting process for the FET, enabling easy integration into circuit designs and ensuring consistent electrical performance across applications.

Case Connection: DRAIN

Drain terminal connection provides a common reference point for the FET's output, facilitating easy coupling with external components or circuits and enabling efficient power delivery in switching applications.

Technical Specifications

Power Field Effect Transistors (FET) BTS282ZE-3180A attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Additional Features:

LOGIC LEVEL COMPATIBLE

Avalanche Energy Rating (EAS):

2000 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

49 V

Maximum Drain Current (ID):

80 A

Maximum Drain-Source On Resistance:

.0095 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSSO-G7

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

7

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

320 A

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

BTS282ZE-3180A Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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