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BTS133TCAUMA1

Infineon Technologies

BTS133TCAUMA1 by Infineon Technologies

BTS133TCAUMA1 by Infineon is a Power Management IC with AEC-Q100 screening, SIPMOS technology, and 1.7V nominal threshold voltage. It is used in power supply support circuits for automotive applications due to its small outline package style and wide operating temperature range (-40°C to 150°C).

Median Price

$2.646

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 1,000 parts In-Stock

1+ parts

-

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1,000

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Verical

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.646

10k+ parts

$2.046

1,000

-

-

$2.646

$2.046

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 500 parts In-Stock

1+ parts

$2.152

100+ parts

-

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500

$2.152

-

-

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Vyrian

USA . 6,304 parts In-Stock

1+ parts

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6,304

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Rutronik

Germany . 5,000 parts In-Stock

1+ parts

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$2.280

10k+ parts

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5,000

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-

$2.280

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VNN

France . 2,530 parts In-Stock

1+ parts

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2,530

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Digiode

USA . 717 parts In-Stock

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717

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aranea Global

USA . 50 parts In-Stock

1+ parts

$2.109

100+ parts

-

1k+ parts

$2.024

10k+ parts

-

50

$2.109

-

$2.024

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Continental Prestige Electronics

USA . 5,797 parts In-Stock

1+ parts

$2.152

100+ parts

-

1k+ parts

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10k+ parts

$2.109

5,797

$2.152

-

-

$2.109

Argo Parts USA

USA . 4,588 parts In-Stock

1+ parts

$2.152

100+ parts

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4,588

$2.152

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Ampacity Inc.

Singapore . 844 parts In-Stock

1+ parts

$2.250

100+ parts

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844

$2.250

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AZTECH Wire

Italy . 43 parts In-Stock

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$8.820

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43

$8.820

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Microchip USA

USA . 1,081 parts In-Stock

1+ parts

$11.720

100+ parts

$11.650

1k+ parts

$11.610

10k+ parts

$11.570

1,081

$11.720

$11.650

$11.610

$11.570

Modulus Dynamics

Lithuania . 2,297 parts In-Stock

1+ parts

$13.002

100+ parts

$12.482

1k+ parts

$11.962

10k+ parts

-

2,297

$13.002

$12.482

$11.962

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Corphita

USA . 613 parts In-Stock

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613

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Overview

Upgrade your power management solutions with the BTS133TCAUMA1 by Infineon Technologies. Designed with quality materials and advanced technology, this small outline power supply support circuit offers reliability and efficiency for a wide range of applications. With AEC-Q100 screening level certification, you can trust in the durability of this product even in extreme conditions. Experience the benefits of seamless integration and optimal performance with the BTS133TCAUMA1, delivering value and convenience to customers seeking top-notch power management solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Offers good durability and resistance to external factors, making it suitable for various environments.

Surface Mount: YES

Allows for easy installation on PCBs, saving time and effort during assembly.

Screening Level: AEC-Q100

Meets automotive-grade requirements for reliable performance in harsh automotive environments.

Package Shape: RECTANGULAR

Facilitates efficient use of space on the PCB and enables compact designs.

No. of Terminals: 2

Simplifies the connection process and reduces complexity in circuit design.

Package Style (Meter): SMALL OUTLINE

Helps in saving space on the PCB and allows for higher component density.

Maximum Operating Temperature: 150 °C

Ensures reliable operation even in high-temperature environments.

Minimum Operating Temperature: -40 °C

Can withstand extreme cold temperatures, making it suitable for a wide range of applications.

Width (mm): 9.25 mm

Compact size allows for flexibility in PCB layout and integration into various devices.

Nominal Threshold Voltage (V): 1.7

Provides precise voltage regulation and protection for connected components.

Technology: SIPMOS

Utilizes efficient power management technology for improved performance and energy efficiency.

Terminal Form: GULL WING

Facilitates easy soldering and ensures strong mechanical connection for reliability.

Terminal Pitch: 2.54 mm

Compatible with standard PCB designs and allows for easy integration into existing systems.

Technical Specifications

Power Management ICs BTS133TCAUMA1 attributes and parameters. Explore more Power Management ICs devices from Infineon Technologies

Specs

Adjustable Threshold:

NO

JESD-30 Code:

R-PSSO-G2

Length:

10 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

2

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SMSIP3H,.55TB

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Screening Level:

AEC-Q100

Maximum Seated Height:

4.5 mm

Surface Mount:

YES

Technology:

SIPMOS

Terminal Form:

GULL WING

Terminal Pitch:

2.54 mm

Terminal Position:

SINGLE

Nominal Threshold Voltage (V):

1.7

Width (mm):

9.25 mm

Trade Compliance

BTS133TCAUMA1 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

Category top products 20

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