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BTS117AKSA1

Infineon Technologies

BTS117AKSA1 by Infineon Technologies

BTS117AKSA1 by Infineon Technologies is a Power Management IC with AEC-Q100 screening level. It features SIPMOS technology, 3 terminals, and max operating temp of 150°C. Ideal for power supply support circuits in automotive applications due to its flange mount package style.

Median Price

$2.115

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 450 parts In-Stock

1+ parts

$2.115

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450

$2.115

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Vyrian

USA . 5,385 parts In-Stock

1+ parts

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5,385

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VNN

France . 1,484 parts In-Stock

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1,484

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Digiode

USA . 282 parts In-Stock

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282

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 4,743 parts In-Stock

1+ parts

$2.115

100+ parts

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1k+ parts

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10k+ parts

$2.073

4,743

$2.115

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-

$2.073

Argo Parts USA

USA . 1,926 parts In-Stock

1+ parts

$2.115

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1,926

$2.115

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Ampacity Inc.

Singapore . 1,543 parts In-Stock

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$3.500

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1,543

$3.500

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Aztec Data Supply Inc.

USA . 21,480 parts In-Stock

1+ parts

$4.232

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21,480

$4.232

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Corohmni

South Africa . 208 parts In-Stock

1+ parts

$10.559

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208

$10.559

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AZTECH Wire

Italy . 878 parts In-Stock

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$12.916

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878

$12.916

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Modulus Dynamics

Lithuania . 3,896 parts In-Stock

1+ parts

$22.628

100+ parts

$21.723

1k+ parts

$20.818

10k+ parts

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3,896

$22.628

$21.723

$20.818

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Microchip USA

USA . 4,350 parts In-Stock

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4,350

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Eastek

USA . 2,000 parts In-Stock

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2,000

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Corphita

USA . 577 parts In-Stock

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577

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Netroflash

USA . 100 parts In-Stock

1+ parts

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100+ parts

$2.073

1k+ parts

$2.010

10k+ parts

$1.967

100

-

$2.073

$2.010

$1.967

Overview

Unlock the potential of your power management system with the BTS117AKSA1 by Infineon Technologies. This high-quality Power Management IC offers unparalleled reliability and efficiency, backed by the reputable manufacturer's commitment to excellence. Ideal for a wide range of applications, this product provides customers with value and benefits that exceed expectations. Elevate your projects with the superior performance and advantages that only the BTS117AKSA1 can deliver.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and cost-effective, making it suitable for various applications.

Screening Level: AEC-Q100

AEC-Q100 screening ensures high reliability and quality, making this product ideal for automotive applications where durability and performance are critical.

Package Shape: RECTANGULAR

Rectangular package shape allows for easy mounting and integration into a circuit board, providing convenience during the assembly process.

No. of Terminals: 3

Having 3 terminals simplifies the connection process and helps reduce the overall complexity of the power management system.

Package Style (Meter): FLANGE MOUNT

Flange mount style enables secure and stable attachment to a surface, enhancing the mechanical robustness of the product.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature of 150°C, this IC can withstand elevated temperatures without compromising performance, suitable for demanding industrial environments.

Minimum Operating Temperature: -40 °C

The ability to operate at a minimum temperature of -40°C ensures reliable performance even in cold conditions, extending the range of applications where this product can be used.

Terminal Position: SINGLE

Single terminal position simplifies installation and reduces the risk of connection errors, improving reliability and ease of use.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

Being a power supply support circuit, this IC provides critical functionality for power management systems, making it a necessary component for efficient power distribution.

Maximum Supply Current (Isup): 0.06 mA

With a maximum supply current of 0.06 mA, this IC consumes minimal power, making it energy-efficient and suitable for low-power applications.

Technology: SIPMOS

SIPMOS technology offers high efficiency and performance in power management applications, ensuring reliable operation and optimized power delivery.

Terminal Form: THROUGH-HOLE

Through-hole terminal form allows for easy and secure soldering to the circuit board, ensuring reliable electrical connections and mechanical stability.

Technical Specifications

Power Management ICs BTS117AKSA1 attributes and parameters. Explore more Power Management ICs devices from Infineon Technologies

Specs

Adjustable Threshold:

NO

JESD-30 Code:

R-PSFM-T3

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Equivalence Code:

SIP3,.1TB

Package Shape:

Package Style (Meter):

FLANGE MOUNT

Screening Level:

AEC-Q100

Maximum Supply Current (Isup):

.06 mA

Surface Mount:

NO

Technology:

SIPMOS

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Trade Compliance

BTS117AKSA1 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

Category top products 20

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