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BTS117TC

Infineon Technologies

BTS117TC by Infineon Technologies

BTS117TC by Infineon Technologies is a Power Management IC with AEC-Q100 screening. It features a small outline package, 2 terminals, and operates b/w -40 to 150°C. Ideal for power supply support circuits in automotive applications.

Median Price

$1.390

Lifecycle Status

Suppliers In-Stock

14

In-Stock Inventory

1k+

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Mouser Electronics

USA . 2,289 parts In-Stock

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$1.390

10k+ parts

$1.220

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$1.390

$1.220

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Maritex

Poland . 6,218 parts In-Stock

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$7.662

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$7.662

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Astute Electronics Inc

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Rutronik

Germany . 41,000 parts In-Stock

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$1.570

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$1.350

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$1.350

Cyclops Electronics Ltd

UK . 8,684 parts In-Stock

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VNN

France . 3,732 parts In-Stock

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Component Sense

UK . 2,308 parts In-Stock

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Vyrian

USA . 2,220 parts In-Stock

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Bristol Electronics

USA . 1,055 parts In-Stock

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Atlantic Semiconductor

USA . 1,055 parts In-Stock

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ComSIT Distribution GmbH

Germany . 1,000 parts In-Stock

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Nova Conductors

Japan . 1,000 parts In-Stock

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Digiode

USA . 463 parts In-Stock

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463

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LIBRA Elektronik GmbH

Germany . 96 parts In-Stock

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Semicontronic

India . 2,265 parts In-Stock

1+ parts

$1.180

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$1.150

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$1.145

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2,265

$1.180

$1.150

$1.145

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Ampacity Inc.

Singapore . 1,905 parts In-Stock

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$1.180

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$1.180

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Corohmni

South Africa . 91 parts In-Stock

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$2.378

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$2.378

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Modulus Dynamics

Lithuania . 4,785 parts In-Stock

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$10.334

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$9.921

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$9.507

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4,785

$10.334

$9.921

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Perfect Parts

USA . 67,740 parts In-Stock

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A-Z Elektronik GmbH

Germany . 7,521 parts In-Stock

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Futuretech Components

Singapore . 5,000 parts In-Stock

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Lixinc

USA . 4,130 parts In-Stock

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Glotronic Ltd.

UK . 3,900 parts In-Stock

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Argo Parts USA

USA . 3,621 parts In-Stock

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Continental Prestige Electronics

USA . 2,059 parts In-Stock

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GreenTree Electronics

Israel . 2,000 parts In-Stock

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S.R.D Solutions

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Alle Elektronik GmbH

Germany . 1,157 parts In-Stock

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Kepictronics

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Corphita

USA . 920 parts In-Stock

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Bastille Electronics

Australia . 300 parts In-Stock

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Akira Global LLC

USA . 79 parts In-Stock

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Overview

Unlock the power of efficient power management with the BTS117TC by Infineon Technologies. Crafted with precision and expertise, this Power Management IC offers reliability and performance like no other. Ideal for a range of applications, this small outline package is designed to meet your needs with ease. Experience the benefits of top-notch quality and cutting-edge technology, all in one compact design. Take your projects to the next level with the BTS117TC and enjoy seamless operation and superior functionality like never before.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - This material provides durability and protection for the IC, making it a reliable choice for various applications.

Surface Mount:

YES - This feature allows for easy and efficient installation onto circuit boards, saving time and effort during assembly.

Screening Level:

AEC-Q100 - This high screening level ensures the IC meets automotive industry standards for quality and reliability.

Package Shape:

RECTANGULAR - The rectangular shape makes it easy to fit and integrate the IC into different electronic devices and systems.

No. of Terminals:

2 - With a simple two-terminal design, this IC is straightforward to connect and use in a wide range of power management applications.

Package Style (Meter):

SMALL OUTLINE - The small outline package style saves space and allows for compact designs in electronic circuits.

Maximum Operating Temperature:

150 °C - This high temperature tolerance ensures reliable performance even in demanding environments.

Minimum Operating Temperature:

40 °C - The wide temperature range allows for versatility in usage, from extreme cold to extreme heat conditions.

Terminal Finish:

TIN - The tin finish provides good conductivity and corrosion resistance, maintaining the IC's performance over time.

Terminal Position:

SINGLE - With a single terminal position, this IC is easy to orient and install correctly in the circuit.

Maximum Seated Height:

4.5 mm - The low profile of this IC saves space and allows for more compact and efficient electronic designs.

Width (mm):

9.25 mm - The compact width of the IC allows for flexibility in placement and integration in various electronic devices.

Other IC type:

POWER SUPPLY SUPPORT CIRCUIT - This IC is specifically designed to support power supply functions, making it an ideal choice for power management applications.

Peak Reflow Temperature °C:

245 - The high peak reflow temperature ensures proper soldering and bonding during the manufacturing process, resulting in a secure connection.

Length:

10 mm - The moderate length of the IC allows for convenient placement and integration in different electronic systems.

Nominal Threshold Voltage (V):

1.7 - The specific nominal threshold voltage value makes this IC suitable for applications requiring precise voltage regulation.

Technology:

SIPMOS - The SIPMOS technology used in this IC ensures high performance and efficiency in power management applications.

Terminal Form:

GULL WING - The gull wing terminal form offers reliable connectivity and secure attachment to the circuit board.

Terminal Pitch:

2.54 mm - The standard terminal pitch allows for compatibility and ease of integration with other electronic components and systems.

Moisture Sensitivity Level (MSL):

3 - The MSL 3 rating indicates that this IC has a moderate moisture sensitivity level, making it suitable for various environmental conditions.

Technical Specifications

Power Management ICs BTS117TC attributes and parameters. Explore more Power Management ICs devices from Infineon Technologies

Specs

Adjustable Threshold:

NO

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

2

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Equivalence Code:

SMSIP3H,.55TB

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

245

Screening Level:

AEC-Q100

Maximum Seated Height:

4.5 mm

Surface Mount:

YES

Technology:

SIPMOS

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Pitch:

2.54 mm

Terminal Position:

SINGLE

Nominal Threshold Voltage (V):

1.7

Width (mm):

9.25 mm

Trade Compliance

BTS117TC Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

Category top products 20

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