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BSS123L6433HTMA1

Infineon Technologies

BSS123L6433HTMA1 by Infineon Technologies

Infineon's BSS123L6433HTMA1 is a N-CHANNEL FET with 100V DS Breakdown Voltage, 0.17A ID, and 6ohm RDS. Ideal for small outline applications requiring high temp operation up to 150°C. Suitable for circuits needing low feedback capacitance of 6.3pF and built-in diode configuration.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

VNN

France . 4,633 parts In-Stock

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4,633

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Vyrian

USA . 2,951 parts In-Stock

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2,951

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Nova Conductors

Japan . 900 parts In-Stock

1+ parts

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900

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Digiode

USA . 614 parts In-Stock

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614

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aztec Data Supply Inc.

USA . 3,478 parts In-Stock

1+ parts

$0.350

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3,478

$0.350

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Modulus Dynamics

Lithuania . 22,930 parts In-Stock

1+ parts

$0.928

100+ parts

$0.891

1k+ parts

$0.854

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-

22,930

$0.928

$0.891

$0.854

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Advanced Electronics

New Zealand . 314 parts In-Stock

1+ parts

$1.394

100+ parts

$1.324

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$1.324

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314

$1.394

$1.324

$1.324

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Corohmni

South Africa . 115 parts In-Stock

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$1.982

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115

$1.982

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Ampacity Inc.

Singapore . 1,271 parts In-Stock

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$9.050

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1,271

$9.050

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AZTECH Wire

Italy . 733 parts In-Stock

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$12.619

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733

$12.619

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Semicontronic

India . 1,612 parts In-Stock

1+ parts

$63.050

100+ parts

$61.474

1k+ parts

$61.158

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1,612

$63.050

$61.474

$61.158

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Continental Prestige Electronics

USA . 5,797 parts In-Stock

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5,797

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Corphita

USA . 963 parts In-Stock

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963

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Bastille Electronics

Australia . 450 parts In-Stock

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450

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Robosynatics

Brazil . 450 parts In-Stock

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450

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Lucentia Tech

USA . 450 parts In-Stock

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$11.823

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$11.823

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$11.823

450

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$11.823

$11.823

$11.823

Argo Parts USA

USA . 13 parts In-Stock

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13

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Overview

Enhance your electronic projects with the high-quality BSS123L6433HTMA1 by Infineon Technologies. As a leading manufacturer in the industry, Infineon delivers reliable and innovative solutions for Small Signal Field Effect Transistors (FET). This N-CHANNEL transistor with a built-in diode offers exceptional performance and versatility. Whether you're designing consumer electronics, automotive systems, or industrial equipment, this product provides the value, benefits, and advantages you need to bring your ideas to life. Trust Infineon Technologies for cutting-edge technology and superior components that elevate your creations to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material provides durability and protection for the transistor, making it reliable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel transistors generally have higher mobility and conductivity, making them suitable for high-frequency applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Having a built-in diode allows for easier circuit design and can provide additional functionality in certain applications.

Surface Mount: YES

The surface mount capability enables easy and efficient PCB assembly, saving space and ensuring a more compact design.

Minimum DS Breakdown Voltage: 100 V

The high minimum breakdown voltage ensures that the transistor can handle higher voltages, making it suitable for power applications.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient PCB layout and ease of mounting.

Terminal Form: GULL WING

The gull wing terminal form provides mechanical strength and reliability during soldering and operation.

Operating Mode: ENHANCEMENT MODE

Enhancement mode transistors offer easier biasing and control of the transistor, making them ideal for many circuit designs.

No. of Terminals: 3

Having 3 terminals allows for easy interfacing with other components and flexibility in circuit connections.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the PCB and enables compact designs, ideal for space-constrained applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology provides high switching speeds and efficiency, suitable for high-performance applications.

Maximum Operating Temperature: 150 °C

The high maximum operating temperature range ensures reliability and stable performance even in harsh operating conditions.

Transistor Element Material: SILICON

Silicon transistors offer high performance, reliability, and versatility, making them a popular choice for many applications.

Maximum Drain Current (ID): 0.17 A

The high maximum drain current rating allows for handling higher currents, making the transistor suitable for power applications.

Maximum Drain-Source On Resistance: 6 ohm

The low on-resistance ensures minimal power loss and efficient operation in various circuit configurations.

Terminal Position: DUAL

Having dual terminal positions provides flexibility in circuit design and allows for easy integration into different types of circuits.

Maximum Feedback Capacitance (Crss): 6.3 pF

The low feedback capacitance ensures stability and reliable high-frequency performance in the circuit.

Technical Specifications

Small Signal Field Effect Transistors (FET) BSS123L6433HTMA1 attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Additional Features:

LOGIC LEVEL COMPATIBLE

Minimum DS Breakdown Voltage:

100 V

Maximum Drain Current (ID):

.17 A

Maximum Drain-Source On Resistance:

6 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

6.3 pF

JESD-30 Code:

R-PDSO-G3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Element Material:

SILICON

Trade Compliance

BSS123L6433HTMA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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