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BSM150GB120DLCHOSA1

Infineon Technologies

BSM150GB120DLCHOSA1 by Infineon Technologies

Infineon's BSM150GB120DLCHOSA1 is a N-CHANNEL IGBT with 2 SERIES CONNECTED elements, 1200V max. collector-emitter voltage, and 300A max. collector current. It features a fast turn-off time of 650ns and turn-on time of 190ns, making it ideal for high-power applications like motor drives and inverters.

Median Price

$226.094

Lifecycle Status

EOL

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 530 parts In-Stock

1+ parts

$207.900

100+ parts

$195.430

1k+ parts

$182.950

10k+ parts

-

530

$207.900

$195.430

$182.950

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Verical

USA . 530 parts In-Stock

1+ parts

-

100+ parts

$244.287

1k+ parts

$228.688

10k+ parts

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530

-

$244.287

$228.688

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Distributors (In-Stock)

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Digiode

USA . 673 parts In-Stock

1+ parts

$229.900

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-

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673

$229.900

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Nova Conductors

Japan . 200 parts In-Stock

1+ parts

$246.823

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200

$246.823

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VNN

France . 10,438 parts In-Stock

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10,438

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Vyrian

USA . 5,992 parts In-Stock

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5,992

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Distributors (Availability)

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Modulus Dynamics

Lithuania . 16,600 parts In-Stock

1+ parts

$0.701

100+ parts

$0.673

1k+ parts

$0.645

10k+ parts

-

16,600

$0.701

$0.673

$0.645

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Corohmni

South Africa . 241 parts In-Stock

1+ parts

$1.361

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241

$1.361

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Aztec Data Supply Inc.

USA . 1,439 parts In-Stock

1+ parts

$1.400

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1,439

$1.400

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AZTECH Wire

Italy . 283 parts In-Stock

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$16.590

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283

$16.590

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Ampacity Inc.

Singapore . 56 parts In-Stock

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$205.700

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56

$205.700

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Corphita

USA . 308 parts In-Stock

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$217.800

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308

$217.800

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Aranea Global

USA . 100 parts In-Stock

1+ parts

$241.887

100+ parts

-

1k+ parts

$232.211

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100

$241.887

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$232.211

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Continental Prestige Electronics

USA . 6,402 parts In-Stock

1+ parts

$246.823

100+ parts

-

1k+ parts

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10k+ parts

$241.887

6,402

$246.823

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$241.887

Microchip USA

USA . 3,785 parts In-Stock

1+ parts

$305.073

100+ parts

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3,785

$305.073

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Argo Parts USA

USA . 4,581 parts In-Stock

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4,581

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Overview

Upgrade your power system with the BSM150GB120DLCHOSA1 by Infineon Technologies. As a leader in the industry, Infineon delivers top-quality Insulated Gate Bipolar Transistors (IGBT) like this one, designed for maximum performance and reliability. With a nominal turn-off time of 650 ns and a maximum collector current of 300 A, this N-channel IGBT is perfect for high-power applications. Trust Infineon to provide you with the best technology in the market, ensuring superior efficiency and durability for your projects.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL IGBTs typically have higher electron mobility, making them more efficient and suitable for high power applications.

Configuration: SERIES CONNECTED, CENTER TAP, 2 ELEMENTS WITH BUILT-IN DIODE

This configuration allows for better control and efficiency in power applications, especially in motor drives and power conversion systems.

No. of Elements: 2

Having 2 elements increases the power handling capacity of the IGBT, making it suitable for medium to high power applications.

Nominal Turn Off Time (toff): 650 ns

With a relatively fast turn off time, this IGBT can switch off quickly, minimizing switching losses and improving efficiency.

Maximum Collector-Emitter Voltage: 1200 V

The high collector-emitter voltage rating allows for use in high voltage applications, such as power supplies and inverters.

Maximum Collector Current (IC): 300 A

With a high collector current rating, this IGBT can handle large amounts of current, making it suitable for high power applications.

Nominal Turn On Time (ton): 190 ns

Having a fast turn on time allows for quick switching and efficient operation, reducing power losses and improving performance.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) BSM150GB120DLCHOSA1 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Case Connection:

ISOLATED

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

1200 V

JESD-30 Code:

R-XUFM-X7

No. of Elements:

2

No. of Terminals:

7

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Surface Mount:

NO

Terminal Form:

UNSPECIFIED

Terminal Position:

UPPER

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

650 ns

Nominal Turn On Time (ton):

190 ns

Trade Compliance

BSM150GB120DLCHOSA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00.95

SB

8541.29.00.80

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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