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BFN18H6327XTSA1

Infineon Technologies

BFN18H6327XTSA1 by Infineon Technologies

Infineon's BFN18H6327XTSA1 is a NPN BJT transistor for switching applications. With max. VCE of 300V, IC of 0.2A, and hFE of 30, it operates at up to 150°C. This surface-mount device in a small outline package is ideal for high-frequency switching circuits.

Median Price

$0.218

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 8,000 parts In-Stock

1+ parts

-

100+ parts

$0.236

1k+ parts

$0.196

10k+ parts

$0.175

8,000

-

$0.236

$0.196

$0.175

Verical

USA . 5,000 parts In-Stock

1+ parts

-

100+ parts

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$0.218

5,000

-

-

-

$0.218

Future Electronics

Canada . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

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$0.137

10k+ parts

$0.128

3,000

-

-

$0.137

$0.128

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 600 parts In-Stock

1+ parts

$0.259

100+ parts

-

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600

$0.259

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Vyrian

USA . 9,720 parts In-Stock

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9,720

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VNN

France . 3,258 parts In-Stock

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Digiode

USA . 233 parts In-Stock

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233

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Distributors (Availability)

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Semicontronic

India . 4,456 parts In-Stock

1+ parts

$0.116

100+ parts

$0.113

1k+ parts

$0.113

10k+ parts

-

4,456

$0.116

$0.113

$0.113

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Modulus Dynamics

Lithuania . 21,397 parts In-Stock

1+ parts

$0.231

100+ parts

$0.222

1k+ parts

$0.213

10k+ parts

-

21,397

$0.231

$0.222

$0.213

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Corohmni

South Africa . 208 parts In-Stock

1+ parts

$0.231

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-

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208

$0.231

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Argo Parts USA

USA . 2,253 parts In-Stock

1+ parts

$0.239

100+ parts

-

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10k+ parts

$0.232

2,253

$0.239

-

-

$0.232

Continental Prestige Electronics

USA . 183 parts In-Stock

1+ parts

$0.239

100+ parts

-

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$0.234

183

$0.239

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$0.234

Ampacity Inc.

Singapore . 4,373 parts In-Stock

1+ parts

$0.253

100+ parts

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4,373

$0.253

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Bastille Electronics

Australia . 10 parts In-Stock

1+ parts

$0.259

100+ parts

$0.246

1k+ parts

$0.234

10k+ parts

$0.231

10

$0.259

$0.246

$0.234

$0.231

Aztec Data Supply Inc.

USA . 43,944 parts In-Stock

1+ parts

$1.860

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43,944

$1.860

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AZTECH Wire

Italy . 1,169 parts In-Stock

1+ parts

$16.420

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1,169

$16.420

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Perfect Parts

USA . 127,680 parts In-Stock

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127,680

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Eastek

USA . 4,000 parts In-Stock

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4,000

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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Corphita

USA . 64 parts In-Stock

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64

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Overview

Enhance your electronic projects with the reliable BFN18H6327XTSA1 from Infineon Technologies. As a leading manufacturer in the industry, Infineon ensures top-notch quality and performance in their Small Signal Bipolar Junction Transistors. With applications in switching and a maximum operating temperature of 150°C, this NPN transistor offers versatility and durability. Experience the benefits of a high DC current gain, low collector-emitter voltage, and a fast transition frequency of 70 MHz for seamless operation. Upgrade your circuits with the BFN18H6327XTSA1 today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the transistor, making it suitable for a variety of applications.

Polarity or Channel Type: NPN

NPN transistors are commonly used in amplifier and switching circuits, making this product versatile for different electronic projects.

Configuration: SINGLE

Simplifies circuit design and integration, making it easier to work with.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring reliable performance in these scenarios.

Surface Mount: YES

Suitable for surface mount applications, saving space and allowing for efficient PCB layout.

Maximum Collector-Emitter Voltage: 300 V

Allows for higher voltage handling capabilities, providing flexibility in circuit design.

Maximum Collector Current (IC): 0.2 A

Able to handle moderate current levels, suitable for various low to medium power applications.

Nominal Transition Frequency (fT): 70 MHz

High transition frequency enables fast switching speeds, making it ideal for high frequency applications.

Technical Specifications

Small Signal Bipolar Junction Transistors (BJT) BFN18H6327XTSA1 attributes and parameters. Explore more Small Signal Bipolar Junction Transistors (BJT) devices from Infineon Technologies

Specs

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

300 V

Configuration:

Minimum DC Current Gain (hFE):

30

JESD-30 Code:

R-PSSO-F3

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

NPN

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

FLAT

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Nominal Transition Frequency (fT):

Trade Compliance

BFN18H6327XTSA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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