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BAT18

Infineon Technologies

BAT18 by Infineon Technologies

PIN DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;

Median Price

$0.235

Lifecycle Status

Suppliers In-Stock

31

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Bürklin Elektronik

Germany . 125 parts In-Stock

1+ parts

-

100+ parts

$0.235

1k+ parts

$0.191

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125

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$0.235

$0.191

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Distributors (In-Stock)

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Tomark Electronics Ltd

UK . 2,933 parts In-Stock

1+ parts

$0.050

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$0.050

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Flip Electronics

USA . 81,000 parts In-Stock

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ComSIT Distribution GmbH

Germany . 18,201 parts In-Stock

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Pegasus Components GmbH

Germany . 8,330 parts In-Stock

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Chip Stock

USA . 7,693 parts In-Stock

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Digiode

USA . 6,182 parts In-Stock

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LIBRA Elektronik GmbH

Germany . 5,416 parts In-Stock

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Connector Distribution Corp

USA . 4,574 parts In-Stock

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Right Parts Inc.

USA . 4,574 parts In-Stock

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Resion

USA . 4,312 parts In-Stock

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Vyrian

USA . 3,955 parts In-Stock

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First Choice Components Inc.

USA . 3,246 parts In-Stock

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Anansix

USA . 3,168 parts In-Stock

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ECAB

Sweden . 3,000 parts In-Stock

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J2 Sourcing AB

Sweden . 2,853 parts In-Stock

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Florida Circuit

USA . 2,745 parts In-Stock

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A&K Electronics

USA . 2,550 parts In-Stock

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Corel Iberica Componentes, S.L.

Spain . 2,000 parts In-Stock

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LWI Electronics Inc

India . 1,840 parts In-Stock

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Bristol Electronics

USA . 1,827 parts In-Stock

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Electronic Expediters

USA . 1,250 parts In-Stock

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Microfarads

USA . 1,242 parts In-Stock

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Lantek

USA . 1,200 parts In-Stock

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Manoshevitz Elec. Sales

Israel . 1,200 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 1,120 parts In-Stock

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Goldney Electronics S.L.

Spain . 500 parts In-Stock

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500

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Huijzer Components

Netherlands . 248 parts In-Stock

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LittleDiode

UK . 200 parts In-Stock

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200

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Manotoh

Italy . 101 parts In-Stock

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101

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Standard Data Resources

USA . 89 parts In-Stock

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Distributors (Availability)

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Modulus Dynamics

Lithuania . 8,201 parts In-Stock

1+ parts

$0.093

100+ parts

$0.089

1k+ parts

$0.086

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8,201

$0.093

$0.089

$0.086

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IDEA Electronic Components Group

UK . 611 parts In-Stock

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$0.098

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$0.088

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611

$0.098

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$0.088

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MKK Technologies

India . 1,292 parts In-Stock

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$0.183

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DigiPath Technology Company

USA . 1,292 parts In-Stock

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$0.183

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Northwest PG Solutions

USA . 2,173 parts In-Stock

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$30.976

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$27.878

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$30.976

$27.878

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Metaverse IC Inc.

Canada . 306,000 parts In-Stock

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Kepictronics

USA . 66,000 parts In-Stock

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Perfect Parts

USA . 9,464 parts In-Stock

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A-Z Elektronik GmbH

Germany . 9,086 parts In-Stock

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UNI Independent Distributors

Spain . 6,163 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 4,225 parts In-Stock

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Infinite Electronics LLP (Excess)

. 3,917 parts In-Stock

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Assy Fe

Spain . 2,005 parts In-Stock

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Native Components

USA . 1,815 parts In-Stock

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Corphita

USA . 1,601 parts In-Stock

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GreenTree Electronics

Israel . 1,200 parts In-Stock

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Parana Technologies

USA . 102 parts In-Stock

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$0.117

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$0.117

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Technical Specifications

PIN Diodes BAT18 attributes and parameters. Explore more PIN Diodes devices from Infineon Technologies

Specs

Application:

SWITCHING

Minimum Breakdown Voltage:

35 V

Config:

SINGLE

Maximum Diode Capacitance:

1 pF

Nominal Diode Capacitance:

.75 pF

Diode Element Material:

SILICON

Maximum Diode Forward Resistance:

.7 ohm

Diode Resistive Test Current:

5 mA

Diode Resistive Test Frequency:

100 MHz

Diode Type:

Frequency Band:

VERY HIGH FREQUENCY TO ULTRA HIGH FREQUENCY

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Reverse Test Voltage:

20 V

Sub-Category:

PIN Diodes

Surface Mount:

YES

Technology:

POSITIVE-INTRINSIC-NEGATIVE

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Position:

Trade Compliance

BAT18 Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.10.00.80

SB

8541.10.00.80

NSN

5961-01-374-7151, 5961013747151, 5961-14-434-8339, 5961144348339

NIIN

013747151, 144348339

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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