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AUIRFZ44VZSTRL

Infineon Technologies

AUIRFZ44VZSTRL by Infineon Technologies

AUIRFZ44VZSTRL by Infineon Technologies is a N-CHANNEL Power FET with 60V DS Breakdown Voltage, ideal for SWITCHING applications. It features a max IDM of 230A and EAS of 73mJ, suitable for high-power operations. With a low 0.012 ohm RDS(on), this MOSFET offers efficient performance in ENHANCEMENT MODE operation.

Median Price

$1.320

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 50 parts In-Stock

1+ parts

-

100+ parts

$1.320

1k+ parts

$1.100

10k+ parts

$0.977

50

-

$1.320

$1.100

$0.977

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 450 parts In-Stock

1+ parts

$0.964

100+ parts

-

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-

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450

$0.964

-

-

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Digiode

USA . 278 parts In-Stock

1+ parts

$1.026

100+ parts

-

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278

$1.026

-

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Vyrian

USA . 6,935 parts In-Stock

1+ parts

-

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6,935

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VNN

France . 3,169 parts In-Stock

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3,169

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 50 parts In-Stock

1+ parts

$0.920

100+ parts

-

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-

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-

50

$0.920

-

-

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Continental Prestige Electronics

USA . 6,501 parts In-Stock

1+ parts

$0.964

100+ parts

-

1k+ parts

-

10k+ parts

$0.944

6,501

$0.964

-

-

$0.944

Argo Parts USA

USA . 4,626 parts In-Stock

1+ parts

$0.964

100+ parts

-

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4,626

$0.964

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Corphita

USA . 385 parts In-Stock

1+ parts

$0.972

100+ parts

-

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385

$0.972

-

-

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Modulus Dynamics

Lithuania . 13,936 parts In-Stock

1+ parts

$1.621

100+ parts

$1.556

1k+ parts

$1.491

10k+ parts

-

13,936

$1.621

$1.556

$1.491

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AZTECH Wire

Italy . 780 parts In-Stock

1+ parts

$6.166

100+ parts

-

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780

$6.166

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Microchip USA

USA . 2,841 parts In-Stock

1+ parts

$6.760

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2,841

$6.760

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QUARKTWIN TECHNOLOGY LTD

USA . 18,176 parts In-Stock

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18,176

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Perfect Parts

USA . 2,688 parts In-Stock

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2,688

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Overview

Discover the power of the AUIRFZ44VZSTRL Power Field Effect Transistor by Infineon Technologies. With a single configuration and built-in diode, this N-CHANNEL transistor is perfect for switching applications. Its high-quality construction and advanced technology make it a reliable choice for various projects. From automotive to industrial applications, this transistor offers exceptional performance and efficiency. Upgrade your designs with the AUIRFZ44VZSTRL and experience the benefits of Infineon Technologies' top-notch products.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the transistor, ensuring a longer lifespan and better performance.

Polarity or Channel Type: N-CHANNEL

N-channel FETs generally have lower on-resistance and higher efficiency compared to P-channel FETs, making them a suitable choice for various applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode helps to protect the circuit from reverse voltage spikes, enhancing the reliability of the transistor in switching applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, this transistor offers fast switching speeds and high efficiency, making it ideal for power management circuits.

Surface Mount: YES

Being surface mountable allows for easy and efficient PCB assembly, saving time and reducing costs during production.

Minimum DS Breakdown Voltage: 60 V

With a high breakdown voltage, this transistor can handle higher voltages without breakdown, making it suitable for various high-power applications.

Maximum Pulsed Drain Current (IDM): 230 A

The high pulsed drain current rating allows this transistor to handle sudden surge currents without getting damaged, making it reliable in dynamic power systems.

Avalanche Energy Rating (EAS): 73 mJ

The high avalanche energy rating indicates the ability of this transistor to withstand short-duration high-energy transients, ensuring robust protection in rugged environments.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

This technology offers low gate capacitance and high switching speeds, enhancing the overall efficiency and performance of the transistor in various applications.

Maximum Drain Current (ID): 57 A

With a high drain current rating, this transistor can handle high continuous currents without overheating, making it suitable for power management tasks.

Maximum Drain-Source On Resistance: 0.012 ohm

The low on-resistance minimizes power losses and improves efficiency during conduction, making this transistor a suitable choice for high-power applications.

Case Connection: DRAIN

The drain connection allows for easy integration into circuit designs, facilitating efficient current handling and proper thermal management.

Technical Specifications

Power Field Effect Transistors (FET) AUIRFZ44VZSTRL attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Additional Features:

ULTRA LOW RESISTANCE

Avalanche Energy Rating (EAS):

73 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (ID):

57 A

Maximum Drain-Source On Resistance:

.012 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-263AB

JESD-30 Code:

R-PSSO-G2

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

230 A

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

AUIRFZ44VZSTRL Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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