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XPC745BPX350LE

Freescale Semiconductor

XPC745BPX350LE by Freescale Semiconductor

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 255; Package Code: BGA; Package Shape: SQUARE; Boundary Scan: YES;

Median Price

-

Lifecycle Status

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In-Stock Inventory

< 1k

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One Stop Electronics

USA . 276 parts In-Stock

1+ parts

$3.000

100+ parts

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1k+ parts

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10k+ parts

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276

$3.000

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Technical Specifications

Microprocessors XPC745BPX350LE attributes and parameters. Explore more Microprocessors devices from Freescale Semiconductor

Specs

Additional Features:

ALSO REQUIRES 2.5V OR 3.3V SUPPLY

Address Bus Width:

32

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

100 MHz

External Data Bus Width:

64

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B255

JESD-609 Code:

e0

Length:

21 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

255

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA255,16X16,50

Package Shape:

Package Style (Meter):

GRID ARRAY

Power Supplies (V):

2,2.5/3.3

Qualification:

Not Qualified

Maximum Seated Height:

2.8 mm

Speed:

350 rpm

Sub-Category:

Microprocessors

Maximum Supply Voltage:

2.1 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

2 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

BOTTOM

Width:

21 mm

Peripheral IC Type:

Trade Compliance

XPC745BPX350LE Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Freescale Semiconductor

On December 7, 2015, NXP completed the merger with Freescale Semiconductor; the merged company continued its operation as NXP Semiconductors N.V.

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