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MCZ33903BD5EK/R2

Freescale Semiconductor

MCZ33903BD5EK/R2 by Freescale Semiconductor

POWER SUPPLY MANAGEMENT CIRCUIT; Temperature Grade: AUTOMOTIVE; No. of Terminals: 32; Package Code: HSSOP; Package Shape: RECTANGULAR; Surface Mount: YES;

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Microchip USA

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UNI Independent Distributors

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Technical Specifications

Power Management ICs MCZ33903BD5EK/R2 attributes and parameters. Explore more Power Management ICs devices from Freescale Semiconductor

Specs

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G32

JESD-609 Code:

e3

Length:

11 mm

Moisture Sensitivity Level (MSL):

3

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

2.45 mm

Maximum Supply Voltage (Vsup):

28 V

Minimum Supply Voltage (Vsup):

5.5 V

Nominal Supply Voltage (Vsup):

10.5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width (mm):

7.5 mm

Trade Compliance

MCZ33903BD5EK/R2 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Freescale Semiconductor

On December 7, 2015, NXP completed the merger with Freescale Semiconductor; the merged company continued its operation as NXP Semiconductors N.V.

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