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MR20H40CDF

Everspin Technologies

MR20H40CDF by Everspin Technologies

MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: HVSON; Package Shape: RECTANGULAR; Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE;

Median Price

$22.670

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

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Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Verical

USA . 467 parts In-Stock

1+ parts

$22.670

100+ parts

$17.600

1k+ parts

$17.290

10k+ parts

$17.290

467

$22.670

$17.600

$17.290

$17.290

DigiKey

USA . 1,107 parts In-Stock

1+ parts

$25.390

100+ parts

$20.029

1k+ parts

$19.353

10k+ parts

-

1,107

$25.390

$20.029

$19.353

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Arrow

USA . 1,140 parts In-Stock

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$22.620

1,140

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$22.620

Avnet

USA . 570 parts In-Stock

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570

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NAC Semi

USA . 570 parts In-Stock

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$34.010

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570

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$34.010

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Chip Stock

USA . 553 parts In-Stock

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553

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Distributors (Availability)

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Component Stockers USA

USA . 1,639 parts In-Stock

1+ parts

$22.040

100+ parts

$18.270

1k+ parts

$18.270

10k+ parts

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1,639

$22.040

$18.270

$18.270

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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Perfect Parts

USA . 1,852 parts In-Stock

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Futuretech Components

Singapore . 1,460 parts In-Stock

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Kepictronics

USA . 500 parts In-Stock

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Technical Specifications

Other Function Memory ICs MR20H40CDF attributes and parameters. Explore more Other Function Memory ICs devices from Everspin Technologies

Specs

JESD-30 Code:

R-PDSO-N8

Length:

6 mm

Memory Density:

4194304 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

8

No. of Words:

524288 words

No. of Words Code:

512K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

512KX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

.9 mm

Maximum Standby Current:

.00075 Amp

Sub-Category:

SRAMs

Maximum Supply Current:

46.5 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

NO LEAD

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

5 mm

Trade Compliance

MR20H40CDF Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Everspin Technologies

Everspin Technologies, Inc. Headquartered in Chandler, Arizona, Everspin Technologies, Inc. is the worldwide leader in designing, manufacturing, and commercially shipping discrete and embedded Magnetoresistive RAM (MRAM) and Spin-transfer Torque MRAM (STT-MRAM) into markets and applications where data persistence and integrity, low latency, and security are paramount. With over 120 Million MRAM and STT-MRAM products deployed in data center, cloud storage, energy, industrial, automotive, and transportation markets, Everspin has built the strongest and fastest growing foundation of MRAM users in the world. Core Competence with MRAM: From Perpendicular to Field-Switched Everspin’s knowledge and experience in magnetic memory design, manufacture and delivery into relevant applications is unique within the semiconductor industry. With an intellectual property portfolio of more than 600 active patents and applications, Everspin leads the market in development of both in-plane and perpendicular magnetic tunnel junction (MTJ) STT-MRAM bit cells. Manufacturing - The Capacity to Deliver In 2014, Everspin partnered with GLOBALFOUNDRIES for full turn-key 300mm high-volume production of in-plane and perpendicular MTJ ST-MRAM on advanced technology nodes including 40nm, 28nm and beyond. In addition, Everspin owns and operates an integrated magnetic fabrication line located in Chandler, Arizona, where Everspin produces MRAM products are based on 180nm, 130nm, and 90nm process technology nodes. Product package and test operations are located in China, Taiwan and other Asian countries.

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