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ZXM61N03FTC

Diodes Incorporated

ZXM61N03FTC by Diodes Incorporated

ZXM61N03FTC by Diodes Inc. is a N-CHANNEL FET with 30V DS Breakdown Voltage, 1.4A ID, and 0.22 ohm RDS(on). It's used for switching applications in small outline packages with Gull Wing terminals.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 1,344 parts In-Stock

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Nova Conductors

Japan . 32 parts In-Stock

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32

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Distributors (Availability)

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Aztec Data Supply Inc.

USA . 446 parts In-Stock

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$0.300

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446

$0.300

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Corohmni

South Africa . 229 parts In-Stock

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$1.974

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229

$1.974

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AZTECH Wire

Italy . 816 parts In-Stock

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$12.210

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816

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Semicontronic

India . 366 parts In-Stock

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$63.050

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$61.474

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$61.158

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366

$63.050

$61.474

$61.158

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Kepictronics

USA . 45,000 parts In-Stock

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45,000

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Continental Prestige Electronics

USA . 4,036 parts In-Stock

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Argo Parts USA

USA . 2,040 parts In-Stock

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Bastille Electronics

Australia . 50 parts In-Stock

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Overview

Unlock the power of innovation with the ZXM61N03FTC by Diodes Incorporated. As a leading manufacturer in the field of small signal Field Effect Transistors (FET), Diodes Incorporated brings you a product that offers exceptional quality and reliability. Ideal for switching applications, this N-CHANNEL transistor provides a seamless performance with a maximum drain current of 1.4A and a minimum DS breakdown voltage of 30V. With a package style designed for convenience and efficiency, the ZXM61N03FTC is a must-have component for your electronic projects. Explore endless possibilities and experience top-notch performance with this cutting-edge transistor.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection against external elements, making this FET suitable for a wide range of applications.

Polarity or Channel Type: N-CHANNEL

Offers excellent performance characteristics such as low ON resistance and high switching speeds, making it ideal for switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Simplifies the circuit design by incorporating a built-in diode, reducing the overall component count and saving board space.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring reliable performance and efficient operation.

Surface Mount: YES

Allows for easy and convenient installation on a circuit board, saving time and effort during assembly.

Minimum DS Breakdown Voltage: 30 V

Provides a high breakdown voltage, ensuring reliable operation in high voltage applications.

Package Shape: RECTANGULAR

Offers a compact and space-saving design, making it suitable for applications with limited board space.

Terminal Form: GULL WING

Facilitates easy soldering and installation, ensuring a secure connection on the circuit board.

Operating Mode: ENHANCEMENT MODE

Allows for enhanced control over the transistor's conductivity, improving overall performance and efficiency.

Maximum Drain Current (Abs) (ID): 1.4 A

Capable of handling high drain currents, making it suitable for power applications.

No. of Terminals: 3

Provides the necessary connections for proper operation and integration into a circuit.

Maximum Power Dissipation (Abs): 0.625 W

Can dissipate heat effectively, ensuring reliable performance under various operating conditions.

Package Style (Meter): SMALL OUTLINE

Offers a compact and lightweight design, making it suitable for portable and space-constrained applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Provides high reliability and performance, ensuring long-term operation in demanding environments.

Maximum Operating Temperature: 150 °C

Can operate at high temperatures without compromising performance, suitable for harsh environments.

Transistor Element Material: SILICON

Provides high-speed switching capabilities and low power consumption, contributing to overall efficiency.

Terminal Finish: MATTE TIN

Facilitates reliable solder joints and connections, ensuring longevity and stability in operation.

Maximum Drain-Source On Resistance: 0.22 ohm

Offers low ON resistance, reducing power loss and improving efficiency in switching applications.

Terminal Position: DUAL

Provides multiple terminal positions for flexible installation and integration into a circuit design.

Technical Specifications

Small Signal Field Effect Transistors (FET) ZXM61N03FTC attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Diodes Incorporated

Specs

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (Abs) (ID):

1.4 A

Maximum Drain Current (ID):

1.4 A

Maximum Drain-Source On Resistance:

.22 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

ZXM61N03FTC Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Diodes Incorporated

Diodes Incorporated is an international leader in the design and production of high-grade application specific standard products utilized in a wide variety of industries. The company has developed cutting-edge technology that enhances the performance and reliability of components for consumer, industrial, automotive and communication applications. Established in 1959, Diodes Incorporated has been providing superior services to its customers by creating innovative solutions from their world-class manufacturing centers located around the world. Their commitment to delivering quality products extends to their selection of materials which are carefully chosen to meet the demand of both commercial and military requirements.

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Management team

Chairman and CEO

Keh-Shew Lu 

CFO

Brett R. Whitmire 

Lead Director

Angie Chen Button

Manufacturer fab locations 11

Fab name Location Fab Initiation Wafer Capacity

Fab 1

Fabrication

Fab Initiation

1987

China

Shanghai

Wafer Capacity

40,000

1987

40,000

Zizhu Fab 1

Fabrication

Fab Initiation

2013

China

Shanghai

Wafer Capacity

18,500

2013

18,500

G Fab

Fabrication

Fab Initiation

2008

UK

Greenock

Wafer Capacity

8,000

2008

8,000

Keelung Fab

Fabrication

Fab Initiation

1990

Taiwan

Keelung

Wafer Capacity

58,000

1990

58,000

Wuxi Fab

Fabrication

Fab Initiation

2004

China

Wuxi

Wafer Capacity

190,000

2004

190,000

Shanghai Fab

Fabrication

Fab Initiation

1993

China

Shanghai

Wafer Capacity

110,000

1993

110,000

G Fab

Fabrication

Fab Initiation

1970

UK

Greenock

Wafer Capacity

22,000

1970

22,000

Hsinchu Fab

Fabrication

Fab Initiation

1998

Taiwan

Hsinchu

Wafer Capacity

38,000

1998

38,000

Fab 2

Fabrication

Fab Initiation

2003

China

Shanghai

Wafer Capacity

20,000

2003

20,000

SPFAB

Fabrication

Fab Initiation

1995

USA

South Portland

Wafer Capacity

17,000

1995

17,000

N/A

Fabrication

Fab Initiation

1982

UK

Oldham

Wafer Capacity

4,000

1982

4,000

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