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ZXM61N02F

Diodes Incorporated

ZXM61N02F by Diodes Incorporated

ZXM61N02F by Diodes Inc. is a N-CHANNEL FET with 20V DS breakdown voltage, 1.7A ID, and 0.24 ohm RDS(on). Ideal for switching applications due to its single configuration with built-in diode and enhancement mode operation in small outline package style.

Median Price

$0.264

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Element14

Singapore . 14,471 parts In-Stock

1+ parts

-

100+ parts

$0.329

1k+ parts

$0.263

10k+ parts

$0.258

14,471

-

$0.329

$0.263

$0.258

Farnell

UK . 1,701 parts In-Stock

1+ parts

-

100+ parts

$0.200

1k+ parts

$0.153

10k+ parts

$0.137

1,701

-

$0.200

$0.153

$0.137

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 200 parts In-Stock

1+ parts

$0.130

100+ parts

-

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200

$0.130

-

-

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Vyrian

USA . 5,003 parts In-Stock

1+ parts

-

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5,003

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Bristol Electronics

USA . 2,477 parts In-Stock

1+ parts

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2,477

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Atlantic Semiconductor

USA . 2,477 parts In-Stock

1+ parts

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2,477

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-

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Sensible Micro Corp

USA . 1,250 parts In-Stock

1+ parts

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1,250

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-

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ABC Electronics Ltd.

UK . 643 parts In-Stock

1+ parts

-

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643

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Mil-Aero Solutions, Inc.

USA . 300 parts In-Stock

1+ parts

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300

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Rebound Electronics

UK . 121 parts In-Stock

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121

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Elcom Components

USA . 60 parts In-Stock

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60

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Argo Parts USA

USA . 2,339 parts In-Stock

1+ parts

$0.125

100+ parts

-

1k+ parts

-

10k+ parts

$0.121

2,339

$0.125

-

-

$0.121

Aranea Global

USA . 1,000 parts In-Stock

1+ parts

$0.127

100+ parts

-

1k+ parts

$0.122

10k+ parts

-

1,000

$0.127

-

$0.122

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Corohmni

South Africa . 824 parts In-Stock

1+ parts

$0.891

100+ parts

-

1k+ parts

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824

$0.891

-

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Advanced Electronics

New Zealand . 5,000 parts In-Stock

1+ parts

$1.691

100+ parts

$1.539

1k+ parts

$1.387

10k+ parts

-

5,000

$1.691

$1.539

$1.387

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Aztec Data Supply Inc.

USA . 3,831 parts In-Stock

1+ parts

$1.710

100+ parts

-

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3,831

$1.710

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Continental Prestige Electronics

USA . 6,956 parts In-Stock

1+ parts

-

100+ parts

$0.287

1k+ parts

$0.161

10k+ parts

$0.153

6,956

-

$0.287

$0.161

$0.153

Authorized Procurement Solutions

USA . 5,500 parts In-Stock

1+ parts

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5,500

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iodParts Technologies Inc.

India . 5,035 parts In-Stock

1+ parts

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5,035

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Infinite Electronics LLP (Excess)

. 1,246 parts In-Stock

1+ parts

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1,246

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Kepictronics

USA . 866 parts In-Stock

1+ parts

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866

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Futuretech Components

Singapore . 821 parts In-Stock

1+ parts

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821

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Overview

Unleash the power of cutting-edge technology with the ZXM61N02F by Diodes Incorporated. Crafted with precision and expertise, this N-CHANNEL Small Signal Field Effect Transistor boasts unparalleled quality and reliability. Ideal for switching applications, this transistor offers seamless performance and efficiency. With a minimum DS Breakdown Voltage of 20V and a maximum Drain Current of 1.7A, this product ensures optimal functionality for your projects. Experience the difference with Diodes Incorporated - where innovation meets excellence.

Feature Benefit Bullets

Package Body Material

PLASTIC/EPOXY - Provides durability and protection for the transistor components, making it a reliable choice.

Polarity or Channel Type

N-CHANNEL - Offers efficient current flow and low resistance, enhancing overall performance.

Configuration

SINGLE WITH BUILT-IN DIODE - Simplifies circuit design and allows for easy integration into various applications.

Transistor Application

SWITCHING - Suitable for quick and efficient switching operations, making it versatile for different uses.

Surface Mount

YES - Allows for easy and secure installation on circuit boards, saving space and improving reliability.

Minimum DS Breakdown Voltage

20 V - Provides reliable voltage protection, ensuring the transistor can handle high voltage applications.

Package Shape

RECTANGULAR - Compact design saves space and allows for efficient placement in tight spaces.

Terminal Form

GULL WING - Facilitates easy soldering and connection, ensuring a secure and reliable electrical connection.

Operating Mode

ENHANCEMENT MODE - Offers control over the transistor's conductivity, enhancing efficiency and performance.

No. of Terminals

3 - Provides flexibility in circuit design and connections, allowing for versatile applications.

Package Style (Meter)

SMALL OUTLINE - Compact size makes it suitable for small electronic devices and tight spaces.

Field Effect Transistor Technology

METAL-OXIDE SEMICONDUCTOR - Offers high efficiency and reliability in operation, making it a durable choice.

Transistor Element Material

SILICON - Provides excellent electrical properties, ensuring high performance and stability.

Terminal Finish

MATTE TIN - Enhances solderability and connection reliability, ensuring a secure electrical contact.

Maximum Drain Current (ID)

1.7 A - Can handle high current loads, making it suitable for a wide range of applications.

Maximum Drain-Source On Resistance

0.24 ohm - Provides low resistance and efficient power management, ensuring optimal performance.

Terminal Position

DUAL - Offers flexibility in mounting and connection options, allowing for easy integration into various circuits.

Technical Specifications

Small Signal Field Effect Transistors (FET) ZXM61N02F attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Diodes Incorporated

Specs

Minimum DS Breakdown Voltage:

20 V

Maximum Drain Current (ID):

1.7 A

Maximum Drain-Source On Resistance:

.24 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

ZXM61N02F Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Diodes Incorporated

Diodes Incorporated is an international leader in the design and production of high-grade application specific standard products utilized in a wide variety of industries. The company has developed cutting-edge technology that enhances the performance and reliability of components for consumer, industrial, automotive and communication applications. Established in 1959, Diodes Incorporated has been providing superior services to its customers by creating innovative solutions from their world-class manufacturing centers located around the world. Their commitment to delivering quality products extends to their selection of materials which are carefully chosen to meet the demand of both commercial and military requirements.

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Management team

Chairman and CEO

Keh-Shew Lu 

CFO

Brett R. Whitmire 

Lead Director

Angie Chen Button

Manufacturer fab locations 11

Fab name Location Fab Initiation Wafer Capacity

Fab 1

Fabrication

Fab Initiation

1987

China

Shanghai

Wafer Capacity

40,000

1987

40,000

Zizhu Fab 1

Fabrication

Fab Initiation

2013

China

Shanghai

Wafer Capacity

18,500

2013

18,500

G Fab

Fabrication

Fab Initiation

2008

UK

Greenock

Wafer Capacity

8,000

2008

8,000

Keelung Fab

Fabrication

Fab Initiation

1990

Taiwan

Keelung

Wafer Capacity

58,000

1990

58,000

Wuxi Fab

Fabrication

Fab Initiation

2004

China

Wuxi

Wafer Capacity

190,000

2004

190,000

Shanghai Fab

Fabrication

Fab Initiation

1993

China

Shanghai

Wafer Capacity

110,000

1993

110,000

G Fab

Fabrication

Fab Initiation

1970

UK

Greenock

Wafer Capacity

22,000

1970

22,000

Hsinchu Fab

Fabrication

Fab Initiation

1998

Taiwan

Hsinchu

Wafer Capacity

38,000

1998

38,000

Fab 2

Fabrication

Fab Initiation

2003

China

Shanghai

Wafer Capacity

20,000

2003

20,000

SPFAB

Fabrication

Fab Initiation

1995

USA

South Portland

Wafer Capacity

17,000

1995

17,000

N/A

Fabrication

Fab Initiation

1982

UK

Oldham

Wafer Capacity

4,000

1982

4,000

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