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QSBT40-7

Diodes Incorporated

QSBT40-7 by Diodes Incorporated

DIODE BUS TERMINATION ARRAY; Temperature Grade: MILITARY; Terminal Form: GULL WING; No. of Terminals: 6; Package Code: TSSOP; Package Shape: RECTANGULAR;

Median Price

$0.822

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

NAC Semi

USA . 1,200 parts In-Stock

1+ parts

$0.105

100+ parts

-

1k+ parts

-

10k+ parts

-

1,200

$0.105

-

-

-

Component Electronics Inc.

Canada . 2,930 parts In-Stock

1+ parts

$1.540

100+ parts

$1.150

1k+ parts

$1.000

10k+ parts

-

2,930

$1.540

$1.150

$1.000

-

Bristol Electronics

USA . 7,989 parts In-Stock

1+ parts

-

100+ parts

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7,989

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-

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-

PC Components Company LLC

USA . 5,558 parts In-Stock

1+ parts

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1k+ parts

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5,558

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-

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Connector Distribution Corp

USA . 4,998 parts In-Stock

1+ parts

-

100+ parts

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4,998

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-

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Right Parts Inc.

USA . 4,998 parts In-Stock

1+ parts

-

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4,998

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-

-

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Sunrise Surplus Inc.

USA . 2,500 parts In-Stock

1+ parts

-

100+ parts

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2,500

-

-

-

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QIE Inc.

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

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1,000

-

-

-

-

Carlin Systems, Inc.

USA . 182 parts In-Stock

1+ parts

-

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182

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Prism Electronics

USA . 149 parts In-Stock

1+ parts

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149

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 502 parts In-Stock

1+ parts

$22.040

100+ parts

-

1k+ parts

-

10k+ parts

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502

$22.040

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Component Stockers USA

USA . 307 parts In-Stock

1+ parts

$99.990

100+ parts

-

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307

$99.990

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Kepictronics

USA . 18,000 parts In-Stock

1+ parts

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18,000

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Perfect Parts

USA . 1,911 parts In-Stock

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1,911

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Technical Specifications

Data Bus Terminators QSBT40-7 attributes and parameters. Explore more Data Bus Terminators devices from Diodes Incorporated

Specs

Differential Output:

NO

Interface IC Type:

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e0

Length:

2 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Signal Lines:

4

No. of Terminals:

6

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

1.25 mm

Trade Compliance

QSBT40-7 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Diodes Incorporated

Diodes Incorporated is an international leader in the design and production of high-grade application specific standard products utilized in a wide variety of industries. The company has developed cutting-edge technology that enhances the performance and reliability of components for consumer, industrial, automotive and communication applications. Established in 1959, Diodes Incorporated has been providing superior services to its customers by creating innovative solutions from their world-class manufacturing centers located around the world. Their commitment to delivering quality products extends to their selection of materials which are carefully chosen to meet the demand of both commercial and military requirements.

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Management team

Chairman and CEO

Keh-Shew Lu 

CFO

Brett R. Whitmire 

Lead Director

Angie Chen Button

Manufacturer fab locations 11

Fab name Location Fab Initiation Wafer Capacity

Fab 1

Fabrication

Fab Initiation

1987

China

Shanghai

Wafer Capacity

40,000

1987

40,000

Zizhu Fab 1

Fabrication

Fab Initiation

2013

China

Shanghai

Wafer Capacity

18,500

2013

18,500

G Fab

Fabrication

Fab Initiation

2008

UK

Greenock

Wafer Capacity

8,000

2008

8,000

Keelung Fab

Fabrication

Fab Initiation

1990

Taiwan

Keelung

Wafer Capacity

58,000

1990

58,000

Wuxi Fab

Fabrication

Fab Initiation

2004

China

Wuxi

Wafer Capacity

190,000

2004

190,000

Shanghai Fab

Fabrication

Fab Initiation

1993

China

Shanghai

Wafer Capacity

110,000

1993

110,000

G Fab

Fabrication

Fab Initiation

1970

UK

Greenock

Wafer Capacity

22,000

1970

22,000

Hsinchu Fab

Fabrication

Fab Initiation

1998

Taiwan

Hsinchu

Wafer Capacity

38,000

1998

38,000

Fab 2

Fabrication

Fab Initiation

2003

China

Shanghai

Wafer Capacity

20,000

2003

20,000

SPFAB

Fabrication

Fab Initiation

1995

USA

South Portland

Wafer Capacity

17,000

1995

17,000

N/A

Fabrication

Fab Initiation

1982

UK

Oldham

Wafer Capacity

4,000

1982

4,000

Category top products 20

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