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DMN6068SEQ-13

Diodes Incorporated

DMN6068SEQ-13 by Diodes Incorporated

DMN6068SEQ-13 by Diodes Inc. is a N-channel power FET with 60V DS breakdown voltage and 20.8A max pulsed drain current, ideal for switching applications. It features a built-in diode, 0.068 ohm max drain-source resistance, and operates in enhancement mode. With AEC-Q101 reference standard, it's suitable for automotive electronics requiring high reliability under harsh conditions.

Median Price

$0.375

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 6,446 parts In-Stock

1+ parts

$1.140

100+ parts

$0.461

1k+ parts

$0.310

10k+ parts

$0.233

6,446

$1.140

$0.461

$0.310

$0.233

Verical

USA . 592,000 parts In-Stock

1+ parts

-

100+ parts

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$0.203

592,000

-

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$0.203

Arrow

USA . 12,000 parts In-Stock

1+ parts

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$0.188

12,000

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$0.188

Element14

Singapore . 2,110 parts In-Stock

1+ parts

-

100+ parts

$0.375

1k+ parts

$0.207

10k+ parts

$0.206

2,110

-

$0.375

$0.207

$0.206

Farnell

UK . 2,110 parts In-Stock

1+ parts

-

100+ parts

$0.382

1k+ parts

$0.218

10k+ parts

$0.214

2,110

-

$0.382

$0.218

$0.214

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 91,980 parts In-Stock

1+ parts

-

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91,980

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Chip Stock

USA . 20,138 parts In-Stock

1+ parts

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20,138

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Rutronik

Germany . 12,000 parts In-Stock

1+ parts

-

100+ parts

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$0.192

12,000

-

-

-

$0.192

NAC Semi

USA . 8,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

$0.680

8,000

-

-

-

$0.680

Sensible Micro Corp

USA . 1,354 parts In-Stock

1+ parts

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1,354

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Nova Conductors

Japan . 50 parts In-Stock

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50

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Distributors (Availability)

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Ampacity Inc.

Singapore . 92,016 parts In-Stock

1+ parts

$0.160

100+ parts

-

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92,016

$0.160

-

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Semicontronic

India . 91,734 parts In-Stock

1+ parts

$0.160

100+ parts

$0.156

1k+ parts

$0.155

10k+ parts

-

91,734

$0.160

$0.156

$0.155

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Corohmni

South Africa . 285 parts In-Stock

1+ parts

$1.164

100+ parts

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285

$1.164

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Aztec Data Supply Inc.

USA . 421 parts In-Stock

1+ parts

$1.360

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421

$1.360

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Infinite Electronics LLP (Excess)

. 102,067 parts In-Stock

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102,067

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GreenTree Electronics

Israel . 65,937 parts In-Stock

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65,937

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Authorized Procurement Solutions

USA . 15,000 parts In-Stock

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15,000

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Formix International (Excess)

India . 14,049 parts In-Stock

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14,049

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Eastek

USA . 4,000 parts In-Stock

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$0.200

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4,000

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$0.200

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Argo Parts USA

USA . 3,766 parts In-Stock

1+ parts

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3,766

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Continental Prestige Electronics

USA . 1,505 parts In-Stock

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1,505

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Bastille Electronics

Australia . 200 parts In-Stock

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200

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Overview

Looking to enhance your power management system? Look no further than the DMN6068SEQ-13 by Diodes Incorporated. As a leading manufacturer in the industry, Diodes Incorporated delivers top-quality Power Field Effect Transistors for various switching applications. With its N-CHANNEL configuration and built-in diode, this transistor offers superior performance and reliability. Whether you're in need of efficient power switching or reliable circuit protection, the DMN6068SEQ-13 has got you covered. Trust Diodes Incorporated for all your power management needs!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection, making it suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have lower resistance and higher efficiency, making them a good choice for power management.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode helps with reverse current protection, enhancing the reliability of the product.

Transistor Application: SWITCHING

Designed for efficient switching applications, ensuring optimal performance in various electronic devices.

Surface Mount: YES

Allows for easy and secure installation onto circuit boards, saving space and simplifying assembly.

Minimum DS Breakdown Voltage: 60 V

With a high breakdown voltage, this FET can handle higher voltages, providing added safety and reliability.

Package Shape: RECTANGULAR

The rectangular shape offers versatility in mounting options and facilitates efficient PCB layout.

Terminal Form: GULL WING

The gull wing terminals provide secure connections and improve heat dissipation, enhancing overall performance.

Operating Mode: ENHANCEMENT MODE

This mode allows for easy control of the FET, making it ideal for various applications where precise switching is required.

Maximum Pulsed Drain Current (IDM): 20.8 A

The high pulsed drain current capability makes this FET suitable for applications requiring short bursts of high power.

Avalanche Energy Rating (EAS): 37.5 mJ

With a high avalanche energy rating, this FET can withstand voltage spikes and transients, ensuring robustness in harsh conditions.

Maximum Drain Current (Abs) (ID): 5.6 A

The high drain current rating allows for reliable operation in applications requiring continuous current flow.

No. of Terminals: 4

The four terminals provide flexibility in circuit design and allow for multiple connection options.

Maximum Power Dissipation (Abs): 3.7 W

The high power dissipation rating ensures reliable performance under heavy loads, making it suitable for power applications.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on PCBs and facilitates compact designs.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFET technology offers high switching speeds and efficiency, making it ideal for power management applications.

Maximum Operating Temperature: 150 °C

With a high operating temperature range, this FET can operate in harsh environments without compromising performance.

Transistor Element Material: SILICON

Silicon-based FETs offer high reliability, stability, and performance, making them a popular choice for various applications.

Terminal Finish: MATTE TIN

The matte tin finish provides corrosion resistance and ensures secure solder connections.

Maximum Drain Current (ID): 4.1 A

The high drain current rating allows for reliable operation in applications requiring moderate current flow.

Maximum Drain-Source On Resistance: 0.068 ohm

The low on-resistance minimizes power loss and improves efficiency in power management applications.

Terminal Position: DUAL

The dual terminal position allows for versatile mounting options and enhances connectivity in different circuit configurations.

Case Connection: DRAIN

The drain connection facilitates easy integration into circuits and ensures proper current flow.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature ensures proper soldering and reliability during assembly processes.

Peak Reflow Temperature °C: 260

With a high peak reflow temperature, this FET can withstand high-temperature soldering processes, ensuring durability.

Reference Standard: AEC-Q101

Compliant with the AEC-Q101 automotive standard, indicating high quality and reliability for automotive applications.

Technical Specifications

Power Field Effect Transistors (FET) DMN6068SEQ-13 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Diodes Incorporated

Specs

Additional Features:

HIGH RELIABILITY

Avalanche Energy Rating (EAS):

37.5 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (Abs) (ID):

5.6 A

Maximum Drain Current (ID):

4.1 A

Maximum Drain-Source On Resistance:

.068 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-G4

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

4

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

20.8 A

Reference Standard:

AEC-Q101

Sub-Category:

FET General Purpose Powers

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

DMN6068SEQ-13 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Diodes Incorporated

Diodes Incorporated is an international leader in the design and production of high-grade application specific standard products utilized in a wide variety of industries. The company has developed cutting-edge technology that enhances the performance and reliability of components for consumer, industrial, automotive and communication applications. Established in 1959, Diodes Incorporated has been providing superior services to its customers by creating innovative solutions from their world-class manufacturing centers located around the world. Their commitment to delivering quality products extends to their selection of materials which are carefully chosen to meet the demand of both commercial and military requirements.

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Management team

Chairman and CEO

Keh-Shew Lu 

CFO

Brett R. Whitmire 

Lead Director

Angie Chen Button

Manufacturer fab locations 11

Fab name Location Fab Initiation Wafer Capacity

Fab 1

Fabrication

Fab Initiation

1987

China

Shanghai

Wafer Capacity

40,000

1987

40,000

Zizhu Fab 1

Fabrication

Fab Initiation

2013

China

Shanghai

Wafer Capacity

18,500

2013

18,500

G Fab

Fabrication

Fab Initiation

2008

UK

Greenock

Wafer Capacity

8,000

2008

8,000

Keelung Fab

Fabrication

Fab Initiation

1990

Taiwan

Keelung

Wafer Capacity

58,000

1990

58,000

Wuxi Fab

Fabrication

Fab Initiation

2004

China

Wuxi

Wafer Capacity

190,000

2004

190,000

Shanghai Fab

Fabrication

Fab Initiation

1993

China

Shanghai

Wafer Capacity

110,000

1993

110,000

G Fab

Fabrication

Fab Initiation

1970

UK

Greenock

Wafer Capacity

22,000

1970

22,000

Hsinchu Fab

Fabrication

Fab Initiation

1998

Taiwan

Hsinchu

Wafer Capacity

38,000

1998

38,000

Fab 2

Fabrication

Fab Initiation

2003

China

Shanghai

Wafer Capacity

20,000

2003

20,000

SPFAB

Fabrication

Fab Initiation

1995

USA

South Portland

Wafer Capacity

17,000

1995

17,000

N/A

Fabrication

Fab Initiation

1982

UK

Oldham

Wafer Capacity

4,000

1982

4,000

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