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DMN6022SSD-13

Diodes Incorporated

DMN6022SSD-13 by Diodes Incorporated

DMN6022SSD-13 by Diodes Inc. is a N-channel FET with 60V DS breakdown voltage, 45A pulsed drain current, and 0.034 ohm max on-resistance. Ideal for switching applications in small outline packages, it operates b/w -55 to 150 °C with MIL-STD-202 compliance.

Median Price

$0.736

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 4,338 parts In-Stock

1+ parts

$0.720

100+ parts

$0.405

1k+ parts

$0.295

10k+ parts

$0.246

4,338

$0.720

$0.405

$0.295

$0.246

Element14

Singapore . 2,500 parts In-Stock

1+ parts

$0.752

100+ parts

$0.448

1k+ parts

$0.324

10k+ parts

$0.324

2,500

$0.752

$0.448

$0.324

$0.324

Newark

USA . 1,397 parts In-Stock

1+ parts

$1.020

100+ parts

$0.461

1k+ parts

$0.326

10k+ parts

-

1,397

$1.020

$0.461

$0.326

-

DigiKey

USA . 2,363 parts In-Stock

1+ parts

$1.120

100+ parts

$0.444

1k+ parts

$0.313

10k+ parts

$0.255

2,363

$1.120

$0.444

$0.313

$0.255

Verical

USA . 5,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.246

5,000

-

-

-

$0.246

Farnell

UK . 2,500 parts In-Stock

1+ parts

-

100+ parts

$0.454

1k+ parts

$0.329

10k+ parts

$0.280

2,500

-

$0.454

$0.329

$0.280

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 3,206 parts In-Stock

1+ parts

$0.455

100+ parts

-

1k+ parts

-

10k+ parts

-

3,206

$0.455

-

-

-

Component Stockers USA

USA . 22,522 parts In-Stock

1+ parts

$0.740

100+ parts

$0.440

1k+ parts

$0.310

10k+ parts

$0.240

22,522

$0.740

$0.440

$0.310

$0.240

Native Components

USA . 609 parts In-Stock

1+ parts

$99.630

100+ parts

-

1k+ parts

-

10k+ parts

$95.645

609

$99.630

-

-

$95.645

Northwest PG Solutions

USA . 1,033 parts In-Stock

1+ parts

$109.593

100+ parts

-

1k+ parts

-

10k+ parts

-

1,033

$109.593

-

-

-

Metaverse IC Inc.

Canada . 90,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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90,000

-

-

-

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QUARKTWIN TECHNOLOGY LTD

USA . 21,136 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

21,136

-

-

-

-

Eastek

USA . 2,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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2,500

-

-

-

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Overview

Enhance your electronic projects with the DMN6022SSD-13 by Diodes Incorporated, a top-quality Power FET that offers unmatched reliability and performance. Ideal for switching applications, this N-Channel transistor features a unique configuration with built-in diodes, making it a versatile choice for a variety of projects. With a high DS breakdown voltage of 60V and maximum drain current of 6A, this transistor delivers exceptional power while maintaining efficient operation. Trust in Diodes Incorporated for cutting-edge technology and superior components that will take your designs to the next level. Elevate your creations with the DMN6022SSD-13 today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and reliability in various operating conditions.

Polarity or Channel Type: N-CHANNEL

N-channel FETs usually have lower ON-resistance and higher mobility, making them efficient for switching applications.

Configuration: SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE

Having separate elements with a built-in diode allows for versatile circuit designs and enhanced functionality.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring efficient and reliable performance in high-frequency operations.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving space and reducing manufacturing costs.

Minimum DS Breakdown Voltage: 60 V

With a minimum breakdown voltage of 60V, this FET can handle high voltage applications with ease.

Terminal Form: GULL WING

Gull wing terminals provide strong mechanical stability and ease of soldering during PCB assembly.

Maximum Pulsed Drain Current (IDM): 45 A

High maximum pulsed drain current ensures reliable performance in high-power applications.

Avalanche Energy Rating (EAS): 24 mJ

The high avalanche energy rating ensures the FET can withstand voltage spikes and transients without failing.

Maximum Power Dissipation (Abs): 1.5 W

With a maximum power dissipation of 1.5W, this FET can handle high power levels without overheating.

Maximum Operating Temperature: 150 °C

The high maximum operating temperature allows for reliable operation in a wide range of environmental conditions.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high performance and reliability in various applications.

Maximum Drain-Source On Resistance: 0.034 ohm

Low ON resistance ensures minimal power loss and efficient operation in switching applications.

Technical Specifications

Power Field Effect Transistors (FET) DMN6022SSD-13 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Diodes Incorporated

Specs

Avalanche Energy Rating (EAS):

24 mJ

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (ID):

6 A

Maximum Drain-Source On Resistance:

.034 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

51 pF

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

2

No. of Terminals:

8

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

45 A

Reference Standard:

MIL-STD-202

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

DMN6022SSD-13 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Diodes Incorporated

Diodes Incorporated is an international leader in the design and production of high-grade application specific standard products utilized in a wide variety of industries. The company has developed cutting-edge technology that enhances the performance and reliability of components for consumer, industrial, automotive and communication applications. Established in 1959, Diodes Incorporated has been providing superior services to its customers by creating innovative solutions from their world-class manufacturing centers located around the world. Their commitment to delivering quality products extends to their selection of materials which are carefully chosen to meet the demand of both commercial and military requirements.

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Management team

Chairman and CEO

Keh-Shew Lu 

CFO

Brett R. Whitmire 

Lead Director

Angie Chen Button

Manufacturer fab locations 11

Fab name Location Fab Initiation Wafer Capacity

Fab 1

Fabrication

Fab Initiation

1987

China

Shanghai

Wafer Capacity

40,000

1987

40,000

Zizhu Fab 1

Fabrication

Fab Initiation

2013

China

Shanghai

Wafer Capacity

18,500

2013

18,500

G Fab

Fabrication

Fab Initiation

2008

UK

Greenock

Wafer Capacity

8,000

2008

8,000

Keelung Fab

Fabrication

Fab Initiation

1990

Taiwan

Keelung

Wafer Capacity

58,000

1990

58,000

Wuxi Fab

Fabrication

Fab Initiation

2004

China

Wuxi

Wafer Capacity

190,000

2004

190,000

Shanghai Fab

Fabrication

Fab Initiation

1993

China

Shanghai

Wafer Capacity

110,000

1993

110,000

G Fab

Fabrication

Fab Initiation

1970

UK

Greenock

Wafer Capacity

22,000

1970

22,000

Hsinchu Fab

Fabrication

Fab Initiation

1998

Taiwan

Hsinchu

Wafer Capacity

38,000

1998

38,000

Fab 2

Fabrication

Fab Initiation

2003

China

Shanghai

Wafer Capacity

20,000

2003

20,000

SPFAB

Fabrication

Fab Initiation

1995

USA

South Portland

Wafer Capacity

17,000

1995

17,000

N/A

Fabrication

Fab Initiation

1982

UK

Oldham

Wafer Capacity

4,000

1982

4,000

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