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DMN1054UCB4-7

Diodes Incorporated

DMN1054UCB4-7 by Diodes Incorporated

DMN1054UCB4-7 by Diodes Inc. is a N-CHANNEL FET with 8V DS breakdown voltage, ideal for switching applications. It has a max drain current of 4A and 0.042 ohm on-resistance, operating in enhancement mode from -55 to 150°C. The package is a grid array with 4 terminals and built-in diode, suitable for surface mount assembly.

Median Price

$0.245

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Verical

USA . 27,000 parts In-Stock

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$0.245

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$0.245

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IBS Electronics

USA . 198,000 parts In-Stock

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$0.179

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$0.179

Vyrian

USA . 18,405 parts In-Stock

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18,405

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NAC Semi

USA . 12,000 parts In-Stock

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$0.234

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$0.234

Sensible Micro Corp

USA . 7,760 parts In-Stock

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7,760

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SPM Sales

USA . 132 parts In-Stock

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132

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Nova Conductors

Japan . 10 parts In-Stock

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10

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Distributors (Availability)

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Ampacity Inc.

Singapore . 157,738 parts In-Stock

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$0.178

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157,738

$0.178

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Continental Prestige Electronics

USA . 3,100 parts In-Stock

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$0.594

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$0.344

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$0.217

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$0.175

3,100

$0.594

$0.344

$0.217

$0.175

Corohmni

South Africa . 106 parts In-Stock

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$1.289

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106

$1.289

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Authorized Procurement Solutions

USA . 20,000 parts In-Stock

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Argo Parts USA

USA . 5,041 parts In-Stock

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Eastek

USA . 3,000 parts In-Stock

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$0.260

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3,000

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iodParts Technologies Inc.

India . 2,980 parts In-Stock

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Aranea Global

USA . 1,000 parts In-Stock

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1,000

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Overview

Enhance your electronic designs with the DMN1054UCB4-7 by Diodes Incorporated. This small signal field effect transistor offers high-quality performance and reliability for switching applications. With its N-channel configuration and built-in diode, this FET provides exceptional value and benefits to customers seeking efficient and precise operation. Whether you're working on consumer electronics or industrial equipment, this transistor's enhancement mode technology and low drain-source resistance make it an ideal choice for a wide range of applications. Upgrade your projects with the DMN1054UCB4-7 and experience superior performance like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the transistor lightweight and durable, ideal for applications where weight and durability are important factors.

Polarity or Channel Type: N-CHANNEL

N-Channel transistors typically have faster switching speeds and higher efficiency compared to P-Channel transistors, making them suitable for high-performance switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for efficient reverse current flow and protection against voltage spikes, making this transistor suitable for switching applications where protection is necessary.

Transistor Application: SWITCHING

Being specifically designed for switching applications, this transistor offers fast switching speeds and low power dissipation, making it ideal for efficient power management.

Surface Mount: YES

Surface mount technology allows for easy and compact PCB integration, saving space and reducing assembly time for electronic devices.

Maximum Drain Current (ID): 4 A

With a high maximum drain current rating, this transistor can handle high current loads, making it suitable for power switching applications.

Technical Specifications

Small Signal Field Effect Transistors (FET) DMN1054UCB4-7 attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Diodes Incorporated

Specs

Minimum DS Breakdown Voltage:

8 V

Maximum Drain Current (ID):

4 A

Maximum Drain-Source On Resistance:

.042 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

126 pF

JESD-30 Code:

S-PBGA-B4

JESD-609 Code:

e1

No. of Elements:

1

No. of Terminals:

4

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

SQUARE

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Surface Mount:

YES

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

BALL

Terminal Position:

BOTTOM

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

DMN1054UCB4-7 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Diodes Incorporated

Diodes Incorporated is an international leader in the design and production of high-grade application specific standard products utilized in a wide variety of industries. The company has developed cutting-edge technology that enhances the performance and reliability of components for consumer, industrial, automotive and communication applications. Established in 1959, Diodes Incorporated has been providing superior services to its customers by creating innovative solutions from their world-class manufacturing centers located around the world. Their commitment to delivering quality products extends to their selection of materials which are carefully chosen to meet the demand of both commercial and military requirements.

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Management team

Chairman and CEO

Keh-Shew Lu 

CFO

Brett R. Whitmire 

Lead Director

Angie Chen Button

Manufacturer fab locations 11

Fab name Location Fab Initiation Wafer Capacity

Fab 1

Fabrication

Fab Initiation

1987

China

Shanghai

Wafer Capacity

40,000

1987

40,000

Zizhu Fab 1

Fabrication

Fab Initiation

2013

China

Shanghai

Wafer Capacity

18,500

2013

18,500

G Fab

Fabrication

Fab Initiation

2008

UK

Greenock

Wafer Capacity

8,000

2008

8,000

Keelung Fab

Fabrication

Fab Initiation

1990

Taiwan

Keelung

Wafer Capacity

58,000

1990

58,000

Wuxi Fab

Fabrication

Fab Initiation

2004

China

Wuxi

Wafer Capacity

190,000

2004

190,000

Shanghai Fab

Fabrication

Fab Initiation

1993

China

Shanghai

Wafer Capacity

110,000

1993

110,000

G Fab

Fabrication

Fab Initiation

1970

UK

Greenock

Wafer Capacity

22,000

1970

22,000

Hsinchu Fab

Fabrication

Fab Initiation

1998

Taiwan

Hsinchu

Wafer Capacity

38,000

1998

38,000

Fab 2

Fabrication

Fab Initiation

2003

China

Shanghai

Wafer Capacity

20,000

2003

20,000

SPFAB

Fabrication

Fab Initiation

1995

USA

South Portland

Wafer Capacity

17,000

1995

17,000

N/A

Fabrication

Fab Initiation

1982

UK

Oldham

Wafer Capacity

4,000

1982

4,000

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