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AP2311SN-7

Diodes Incorporated

AP2311SN-7 by Diodes Incorporated

POWER SUPPLY SUPPORT CIRCUIT; Moisture Sensitivity Level (MSL): 1; JESD-609 Code: e4; Peak Reflow Temperature (C): 260; Terminal Finish: NICKEL PALLADIUM GOLD; Maximum Time At Peak Reflow Temperature (s): 30;

Median Price

$0.328

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Newark

USA . 2,225 parts In-Stock

1+ parts

$0.320

100+ parts

$0.169

1k+ parts

$0.142

10k+ parts

-

2,225

$0.320

$0.169

$0.142

-

DigiKey

USA . 2,850 parts In-Stock

1+ parts

$0.740

100+ parts

$0.276

1k+ parts

$0.184

10k+ parts

$0.115

2,850

$0.740

$0.276

$0.184

$0.115

Mouser Electronics

USA . 1,914 parts In-Stock

1+ parts

$0.740

100+ parts

$0.277

1k+ parts

$0.185

10k+ parts

$0.114

1,914

$0.740

$0.277

$0.185

$0.114

Verical

USA . 21,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.115

21,000

-

-

-

$0.115

Farnell

UK . 2,740 parts In-Stock

1+ parts

-

100+ parts

$0.194

1k+ parts

$0.108

10k+ parts

$0.104

2,740

-

$0.194

$0.108

$0.104

Element14

Singapore . 2,740 parts In-Stock

1+ parts

-

100+ parts

$0.336

1k+ parts

$0.220

10k+ parts

$0.202

2,740

-

$0.336

$0.220

$0.202

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 2,780 parts In-Stock

1+ parts

$0.428

100+ parts

$0.221

1k+ parts

$0.144

10k+ parts

$0.135

2,780

$0.428

$0.221

$0.144

$0.135

Native Components

USA . 126 parts In-Stock

1+ parts

$0.678

100+ parts

-

1k+ parts

-

10k+ parts

-

126

$0.678

-

-

-

Northwest PG Solutions

USA . 1,316 parts In-Stock

1+ parts

$0.746

100+ parts

-

1k+ parts

-

10k+ parts

-

1,316

$0.746

-

-

-

Perfect Parts

USA . 13,104 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

13,104

-

-

-

-

Eastek

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,000

-

-

-

-

Technical Specifications

Power Management ICs AP2311SN-7 attributes and parameters. Explore more Power Management ICs devices from Diodes Incorporated

Specs

JESD-609 Code:

e4

Moisture Sensitivity Level (MSL):

1

Peak Reflow Temperature (C):

260

Terminal Finish:

NICKEL PALLADIUM GOLD

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

AP2311SN-7 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Diodes Incorporated

Diodes Incorporated is an international leader in the design and production of high-grade application specific standard products utilized in a wide variety of industries. The company has developed cutting-edge technology that enhances the performance and reliability of components for consumer, industrial, automotive and communication applications. Established in 1959, Diodes Incorporated has been providing superior services to its customers by creating innovative solutions from their world-class manufacturing centers located around the world. Their commitment to delivering quality products extends to their selection of materials which are carefully chosen to meet the demand of both commercial and military requirements.

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Management team

Chairman and CEO

Keh-Shew Lu 

CFO

Brett R. Whitmire 

Lead Director

Angie Chen Button

Manufacturer fab locations 11

Fab name Location Fab Initiation Wafer Capacity

Fab 1

Fabrication

Fab Initiation

1987

China

Shanghai

Wafer Capacity

40,000

1987

40,000

Zizhu Fab 1

Fabrication

Fab Initiation

2013

China

Shanghai

Wafer Capacity

18,500

2013

18,500

G Fab

Fabrication

Fab Initiation

2008

UK

Greenock

Wafer Capacity

8,000

2008

8,000

Keelung Fab

Fabrication

Fab Initiation

1990

Taiwan

Keelung

Wafer Capacity

58,000

1990

58,000

Wuxi Fab

Fabrication

Fab Initiation

2004

China

Wuxi

Wafer Capacity

190,000

2004

190,000

Shanghai Fab

Fabrication

Fab Initiation

1993

China

Shanghai

Wafer Capacity

110,000

1993

110,000

G Fab

Fabrication

Fab Initiation

1970

UK

Greenock

Wafer Capacity

22,000

1970

22,000

Hsinchu Fab

Fabrication

Fab Initiation

1998

Taiwan

Hsinchu

Wafer Capacity

38,000

1998

38,000

Fab 2

Fabrication

Fab Initiation

2003

China

Shanghai

Wafer Capacity

20,000

2003

20,000

SPFAB

Fabrication

Fab Initiation

1995

USA

South Portland

Wafer Capacity

17,000

1995

17,000

N/A

Fabrication

Fab Initiation

1982

UK

Oldham

Wafer Capacity

4,000

1982

4,000

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