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AP2331FJ-7

Diodes Incorporated

AP2331FJ-7 by Diodes Incorporated

AP2331FJ-7 by Diodes Inc. is a 3-terminal Power Management IC with Vsup range of 2.7V to 5.2V, ideal for industrial applications. It features small outline package style, surface mount capability, and operates b/w -40°C to 85°C temperature range.

Median Price

$0.081

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Verical

USA . 9,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.081

9,000

-

-

-

$0.081

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$0.119

100+ parts

-

1k+ parts

-

10k+ parts

-

100

$0.119

-

-

-

NAC Semi

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.115

3,000

-

-

-

$0.115

Vyrian

USA . 1,987 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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1,987

-

-

-

-

VNN

France . 30 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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30

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 8,923 parts In-Stock

1+ parts

$0.069

100+ parts

-

1k+ parts

-

10k+ parts

-

8,923

$0.069

-

-

-

Continental Prestige Electronics

USA . 1,683 parts In-Stock

1+ parts

$0.119

100+ parts

-

1k+ parts

-

10k+ parts

$0.117

1,683

$0.119

-

-

$0.117

Argo Parts USA

USA . 1,419 parts In-Stock

1+ parts

$0.119

100+ parts

-

1k+ parts

-

10k+ parts

$0.115

1,419

$0.119

-

-

$0.115

AZTECH Wire

Italy . 159 parts In-Stock

1+ parts

$9.690

100+ parts

-

1k+ parts

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10k+ parts

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159

$9.690

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Overview

Enhance your power management solutions with the AP2331FJ-7 by Diodes Incorporated. Known for their superior quality and reliability, Diodes Incorporated offers a wide range of Power Management ICs designed to optimize performance and efficiency. The AP2331FJ-7, with its compact package style and industrial temperature grade, is perfect for various applications requiring precise power supply support. Experience the value and benefits of this innovative product, providing customers with unmatched performance and peace of mind. Upgrade your power management system today with Diodes Incorporated.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body makes the product lightweight and cost-effective.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly, saving time and reducing production costs.

Nominal Supply Voltage (Vsup): 5 V

Suitable for a wide range of applications that require a 5V power supply, providing versatility.

No. of Terminals: 3

Having only 3 terminals simplifies the design and assembly process, making the product user-friendly.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, the product can withstand high-temperature environments without compromising performance.

Minimum Operating Temperature: -40 °C

The product's ability to operate at temperatures as low as -40°C ensures reliable performance in extreme conditions.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the PCB, making it ideal for compact electronic devices.

Minimum Supply Voltage (Vsup): 2.7 V

The minimum supply voltage of 2.7V allows for flexibility in power input options, catering to different system requirements.

Terminal Form: NO LEAD

The no lead terminal form eliminates the risk of lead contamination and ensures environmental safety.

Technical Specifications

Power Management ICs AP2331FJ-7 attributes and parameters. Explore more Power Management ICs devices from Diodes Incorporated

Specs

Adjustable Threshold:

NO

JESD-30 Code:

S-PDSO-N3

Length:

2 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

3

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SON

Package Equivalence Code:

SOLCC3(UNSPEC)

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.63 mm

Maximum Supply Voltage (Vsup):

5.2 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

NO LEAD

Terminal Position:

DUAL

Width (mm):

2 mm

Trade Compliance

AP2331FJ-7 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Diodes Incorporated

Diodes Incorporated is an international leader in the design and production of high-grade application specific standard products utilized in a wide variety of industries. The company has developed cutting-edge technology that enhances the performance and reliability of components for consumer, industrial, automotive and communication applications. Established in 1959, Diodes Incorporated has been providing superior services to its customers by creating innovative solutions from their world-class manufacturing centers located around the world. Their commitment to delivering quality products extends to their selection of materials which are carefully chosen to meet the demand of both commercial and military requirements.

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Management team

Chairman and CEO

Keh-Shew Lu 

CFO

Brett R. Whitmire 

Lead Director

Angie Chen Button

Manufacturer fab locations 11

Fab name Location Fab Initiation Wafer Capacity

Fab 1

Fabrication

Fab Initiation

1987

China

Shanghai

Wafer Capacity

40,000

1987

40,000

Zizhu Fab 1

Fabrication

Fab Initiation

2013

China

Shanghai

Wafer Capacity

18,500

2013

18,500

G Fab

Fabrication

Fab Initiation

2008

UK

Greenock

Wafer Capacity

8,000

2008

8,000

Keelung Fab

Fabrication

Fab Initiation

1990

Taiwan

Keelung

Wafer Capacity

58,000

1990

58,000

Wuxi Fab

Fabrication

Fab Initiation

2004

China

Wuxi

Wafer Capacity

190,000

2004

190,000

Shanghai Fab

Fabrication

Fab Initiation

1993

China

Shanghai

Wafer Capacity

110,000

1993

110,000

G Fab

Fabrication

Fab Initiation

1970

UK

Greenock

Wafer Capacity

22,000

1970

22,000

Hsinchu Fab

Fabrication

Fab Initiation

1998

Taiwan

Hsinchu

Wafer Capacity

38,000

1998

38,000

Fab 2

Fabrication

Fab Initiation

2003

China

Shanghai

Wafer Capacity

20,000

2003

20,000

SPFAB

Fabrication

Fab Initiation

1995

USA

South Portland

Wafer Capacity

17,000

1995

17,000

N/A

Fabrication

Fab Initiation

1982

UK

Oldham

Wafer Capacity

4,000

1982

4,000

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