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2N7002V-7

Diodes Incorporated

2N7002V-7 by Diodes Incorporated

2N7002V-7 by Diodes Inc. is a N-channel FET with 60V breakdown voltage, 0.28A drain current, and 13.5 ohm on-resistance. Ideal for switching applications due to its small outline package and enhancement mode operation. Suitable for surface mount designs with dual terminals and built-in diode elements.

Median Price

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Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

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Vyrian

USA . 10,717 parts In-Stock

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VNN

France . 4,580 parts In-Stock

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Connector Distribution Corp

USA . 3,853 parts In-Stock

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Right Parts Inc.

USA . 3,853 parts In-Stock

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EMSNET

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Nova Conductors

Japan . 150 parts In-Stock

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Prism Electronics

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Aztec Data Supply Inc.

USA . 2,453 parts In-Stock

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$1.407

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Corohmni

South Africa . 648 parts In-Stock

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AZTECH Wire

Italy . 591 parts In-Stock

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$8.953

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Andel Nordic

Denmark . 4,950 parts In-Stock

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$11.392

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$10.937

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Ampacity Inc.

Singapore . 1,177 parts In-Stock

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$59.050

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Semicontronic

India . 1,180 parts In-Stock

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$58.549

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QUARKTWIN TECHNOLOGY LTD

USA . 27,614 parts In-Stock

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Metaverse IC Inc.

Canada . 6,000 parts In-Stock

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Argo Parts USA

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Glotronic Ltd.

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Continental Prestige Electronics

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Bastille Electronics

Australia . 300 parts In-Stock

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Perfect Parts

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Overview

Looking for a reliable solution for your switching applications? Look no further than the 2N7002V-7 by Diodes Incorporated. As a leading manufacturer in the industry, Diodes Incorporated delivers top-quality Small Signal Field Effect Transistors that are perfect for various electronic projects. With the ability to handle up to 0.28A of drain current and a minimum breakdown voltage of 60V, this N-channel transistor offers excellent performance and reliability. Whether you're designing a new circuit or replacing an old component, the 2N7002V-7 provides exceptional value and benefits that will meet your needs with ease.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the transistor.

Polarity or Channel Type: N-CHANNEL

Allows for efficient switching operations in electronic circuits.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring reliable performance.

Minimum DS Breakdown Voltage: 60 V

Suitable for applications requiring high breakdown voltage capabilities.

Surface Mount: YES

Enables easy and secure mounting on PCBs, saving space and facilitating automated assembly.

Maximum Drain Current (ID): 0.28 A

Allows for handling moderate levels of current in electronic circuits.

Maximum Power Dissipation (Abs): 0.15 W

Efficient power handling capability without overheating the transistor.

Maximum Operating Temperature: 150 °C

Can operate reliably at relatively high temperatures, suitable for various environments.

Technical Specifications

Small Signal Field Effect Transistors (FET) 2N7002V-7 attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Diodes Incorporated

Specs

Additional Features:

HIGH RELIABILITY

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (Abs) (ID):

.28 A

Maximum Drain Current (ID):

.28 A

Maximum Drain-Source On Resistance:

13.5 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

5 pF

JESD-30 Code:

R-PDSO-F6

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

2

No. of Terminals:

6

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

2N7002V-7 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Diodes Incorporated

Diodes Incorporated is an international leader in the design and production of high-grade application specific standard products utilized in a wide variety of industries. The company has developed cutting-edge technology that enhances the performance and reliability of components for consumer, industrial, automotive and communication applications. Established in 1959, Diodes Incorporated has been providing superior services to its customers by creating innovative solutions from their world-class manufacturing centers located around the world. Their commitment to delivering quality products extends to their selection of materials which are carefully chosen to meet the demand of both commercial and military requirements.

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Management team

Chairman and CEO

Keh-Shew Lu 

CFO

Brett R. Whitmire 

Lead Director

Angie Chen Button

Manufacturer fab locations 11

Fab name Location Fab Initiation Wafer Capacity

Fab 1

Fabrication

Fab Initiation

1987

China

Shanghai

Wafer Capacity

40,000

1987

40,000

Zizhu Fab 1

Fabrication

Fab Initiation

2013

China

Shanghai

Wafer Capacity

18,500

2013

18,500

G Fab

Fabrication

Fab Initiation

2008

UK

Greenock

Wafer Capacity

8,000

2008

8,000

Keelung Fab

Fabrication

Fab Initiation

1990

Taiwan

Keelung

Wafer Capacity

58,000

1990

58,000

Wuxi Fab

Fabrication

Fab Initiation

2004

China

Wuxi

Wafer Capacity

190,000

2004

190,000

Shanghai Fab

Fabrication

Fab Initiation

1993

China

Shanghai

Wafer Capacity

110,000

1993

110,000

G Fab

Fabrication

Fab Initiation

1970

UK

Greenock

Wafer Capacity

22,000

1970

22,000

Hsinchu Fab

Fabrication

Fab Initiation

1998

Taiwan

Hsinchu

Wafer Capacity

38,000

1998

38,000

Fab 2

Fabrication

Fab Initiation

2003

China

Shanghai

Wafer Capacity

20,000

2003

20,000

SPFAB

Fabrication

Fab Initiation

1995

USA

South Portland

Wafer Capacity

17,000

1995

17,000

N/A

Fabrication

Fab Initiation

1982

UK

Oldham

Wafer Capacity

4,000

1982

4,000

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