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2N7002DWA-7

Diodes Incorporated

2N7002DWA-7 by Diodes Incorporated

2N7002DWA-7 by Diodes Inc. is an N-channel FET with max drain current of 0.2A and power dissipation of 0.4W. Ideal for surface mount applications, it operates up to 150°C making it suitable for various electronic devices requiring low-power switching capabilities.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 17,654 parts In-Stock

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VNN

France . 1,148 parts In-Stock

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Nova Conductors

Japan . 450 parts In-Stock

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450

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Distributors (Availability)

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Aztec Data Supply Inc.

USA . 110 parts In-Stock

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$0.370

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110

$0.370

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Corohmni

South Africa . 81 parts In-Stock

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$0.915

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81

$0.915

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AZTECH Wire

Italy . 267 parts In-Stock

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$5.983

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$5.983

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Ampacity Inc.

Singapore . 1,027 parts In-Stock

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$17.050

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$17.050

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Semicontronic

India . 369 parts In-Stock

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$20.050

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$19.549

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$19.448

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369

$20.050

$19.549

$19.448

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Perfect Parts

USA . 82,346 parts In-Stock

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Kepictronics

USA . 23,739 parts In-Stock

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Continental Prestige Electronics

USA . 6,907 parts In-Stock

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Argo Parts USA

USA . 3,218 parts In-Stock

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GreenTree Electronics

Israel . 200 parts In-Stock

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200

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Bastille Electronics

Australia . 10 parts In-Stock

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10

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Overview

Discover the unparalleled quality and reliability of Diodes Incorporated with the 2N7002DWA-7 Small Signal Field Effect Transistor. As a leading manufacturer in the industry, Diodes Incorporated ensures top-notch performance and durability in their products. This N-Channel FET boasts a maximum drain current of 0.2A and a maximum power dissipation of 0.4W, making it perfect for a wide range of applications. From consumer electronics to industrial equipment, this METAL-OXIDE SEMICONDUCTOR technology offers exceptional value and benefits to customers seeking efficient and reliable solutions. Trust Diodes Incorporated for superior performance in every application.

Feature Benefit Bullets

Polarity or Channel Type

N-Channel transistors are commonly used in high-power applications due to their superior performance and efficiency.

Surface Mount

Surface mount technology allows for smaller and more compact circuit designs, making it ideal for space-constrained applications.

Maximum Drain Current (Abs) (ID)

The high maximum drain current rating of 0.2A ensures that this transistor can handle a significant amount of current, making it suitable for a wide range of applications.

Maximum Power Dissipation (Abs)

With a maximum power dissipation of 0.4W, this transistor can dissipate heat efficiently, ensuring reliable operation even under high load conditions.

Field Effect Transistor Technology

Metal-Oxide Semiconductor technology offers excellent performance characteristics such as high efficiency, low noise, and fast switching speeds.

Maximum Operating Temperature

The high maximum operating temperature of 150°C ensures that this transistor can withstand elevated temperatures, making it suitable for harsh environments.

Terminal Finish

Matte tin terminal finish provides a reliable and durable connection, ensuring good electrical conductivity and longevity in use.

Maximum Time At Peak Reflow Temperature (s)

The transistor can withstand peak reflow temperatures for up to 30 seconds, making it easier to solder onto a circuit board during assembly.

Peak Reflow Temperature °C

The high peak reflow temperature rating of 260°C ensures that the transistor remains stable and reliable during the soldering process.

Technical Specifications

Small Signal Field Effect Transistors (FET) 2N7002DWA-7 attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Diodes Incorporated

Specs

Maximum Drain Current (Abs) (ID):

.2 A

Maximum Drain Current (ID):

.2 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

Maximum Operating Temperature:

150 Cel

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

FET General Purpose Powers

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

2N7002DWA-7 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Diodes Incorporated

Diodes Incorporated is an international leader in the design and production of high-grade application specific standard products utilized in a wide variety of industries. The company has developed cutting-edge technology that enhances the performance and reliability of components for consumer, industrial, automotive and communication applications. Established in 1959, Diodes Incorporated has been providing superior services to its customers by creating innovative solutions from their world-class manufacturing centers located around the world. Their commitment to delivering quality products extends to their selection of materials which are carefully chosen to meet the demand of both commercial and military requirements.

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Management team

Chairman and CEO

Keh-Shew Lu 

CFO

Brett R. Whitmire 

Lead Director

Angie Chen Button

Manufacturer fab locations 11

Fab name Location Fab Initiation Wafer Capacity

Fab 1

Fabrication

Fab Initiation

1987

China

Shanghai

Wafer Capacity

40,000

1987

40,000

Zizhu Fab 1

Fabrication

Fab Initiation

2013

China

Shanghai

Wafer Capacity

18,500

2013

18,500

G Fab

Fabrication

Fab Initiation

2008

UK

Greenock

Wafer Capacity

8,000

2008

8,000

Keelung Fab

Fabrication

Fab Initiation

1990

Taiwan

Keelung

Wafer Capacity

58,000

1990

58,000

Wuxi Fab

Fabrication

Fab Initiation

2004

China

Wuxi

Wafer Capacity

190,000

2004

190,000

Shanghai Fab

Fabrication

Fab Initiation

1993

China

Shanghai

Wafer Capacity

110,000

1993

110,000

G Fab

Fabrication

Fab Initiation

1970

UK

Greenock

Wafer Capacity

22,000

1970

22,000

Hsinchu Fab

Fabrication

Fab Initiation

1998

Taiwan

Hsinchu

Wafer Capacity

38,000

1998

38,000

Fab 2

Fabrication

Fab Initiation

2003

China

Shanghai

Wafer Capacity

20,000

2003

20,000

SPFAB

Fabrication

Fab Initiation

1995

USA

South Portland

Wafer Capacity

17,000

1995

17,000

N/A

Fabrication

Fab Initiation

1982

UK

Oldham

Wafer Capacity

4,000

1982

4,000

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