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SLG46826GTR

Dialog Semiconductor

SLG46826GTR by Dialog Semiconductor

CONSUMER CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 20; Package Code: TSSOP; Package Shape: RECTANGULAR;

Median Price

-

Lifecycle Status

Suppliers In-Stock

0

In-Stock Inventory

< 1k

Technical Specifications

Other Function Consumer ICs SLG46826GTR attributes and parameters. Explore more Other Function Consumer ICs devices from Dialog Semiconductor

Specs

Additional Features:

IT ALSO OPERATE WITH 2.5 TO 5.5,2.3 TO 5.5 V

General IC Type:

JESD-30 Code:

R-PDSO-G20

Length:

6.5 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.71 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

4.4 mm

Trade Compliance

SLG46826GTR General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Dialog Semiconductor

TOKYO, Japan, August 31, 2021 JST | LONDON, United Kingdom, August 31, 2021 ― Renesas Electronics Corporation (TSE: 6723, “Renesas”), a premier supplier of advanced semiconductor solutions, and Dialog Semiconductor Plc (“Dialog”), a leading provider of battery and power management, Wi-Fi, Bluetooth® low energy and Industrial edge computing solutions, today announced the successful completion of Renesas’ acquisition of the entire issued and to be issued share capital of Dialog. Renesas will fund the cash consideration payable to Dialog shareholders of approximately EUR 4.8 billion (approximately 624.0 billion yen at an exchange rate of 130 yen to the Euro) through a combination of debt, cash on hand and the proceeds of an equity offering of approximately 222.6 billion yen.

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