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HFBR-5111-OPTION-FDS

Broadcom

HFBR-5111-OPTION-FDS by Broadcom

TELECOM CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: UNSPECIFIED; Package Shape: RECTANGULAR; No. of Functions: 1; JESD-30 Code: R-XXFO-X;

Median Price

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2

In-Stock Inventory

< 1k

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Vyrian

USA . 201 parts In-Stock

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201

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Digiode

USA . 129 parts In-Stock

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129

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Decca Corp

Germany . 608 parts In-Stock

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$17.000

100+ parts

$16.660

1k+ parts

$16.493

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608

$17.000

$16.660

$16.493

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Native Components

USA . 94 parts In-Stock

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$23.190

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94

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Northwest PG Solutions

USA . 1,779 parts In-Stock

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$25.509

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$22.958

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1,779

$25.509

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Supply Digital

USA . 2,220 parts In-Stock

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2,220

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Corphita

USA . 464 parts In-Stock

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464

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Technical Specifications

Other Function Telecom Interface ICs HFBR-5111-OPTION-FDS attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Broadcom

Specs

JESD-30 Code:

R-XXFO-X

No. of Functions:

1

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

Package Style (Meter):

FIBER OPTIC

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Position:

UNSPECIFIED

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

HFBR-5111-OPTION-FDS Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Broadcom

Broadcom Inc, a Delaware corporation headquartered in San Jose, CA, is a global technology leader that designs, develops and supplies a broad range of semiconductor and infrastructure software solutions. Broadcom’s category-leading product portfolio serves critical markets including data center, networking, software, broadband, wireless, storage and industrial. Our solutions include data center networking and storage, enterprise and mainframe software focused on automation, monitoring and security, smartphone components, telecoms and factory automation.

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