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BCM53134MKFBG

Broadcom

BCM53134MKFBG by Broadcom

BCM53134MKFBG by Broadcom is a network interface IC with 212 terminals in a square grid array package. Operating temperature range of 0-70°C, CMOS technology, and Ethernet transceiver type make it ideal for commercial telecom applications. Package size is 11x11mm with 0.65mm terminal pitch and 1V supply voltage.

Median Price

$10.100

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

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DigiKey

USA . 600 parts In-Stock

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$10.100

100+ parts

$6.719

1k+ parts

$6.109

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600

$10.100

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$6.109

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Distributors (In-Stock)

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Digiode

USA . 346 parts In-Stock

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$6.745

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346

$6.745

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Vyrian

USA . 8,005 parts In-Stock

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VNN

France . 1,877 parts In-Stock

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Nova Conductors

Japan . 900 parts In-Stock

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900

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Distributors (Availability)

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Ampacity Inc.

Singapore . 649 parts In-Stock

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$6.030

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649

$6.030

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Corphita

USA . 121 parts In-Stock

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$6.390

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Continental Prestige Electronics

USA . 10 parts In-Stock

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$10.880

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$8.470

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10

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Decca Corp

Germany . 577 parts In-Stock

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$13.130

100+ parts

$12.867

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$12.739

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577

$13.130

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Vigor

Singapore . 77 parts In-Stock

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$13.170

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Microchip USA

USA . 1,309 parts In-Stock

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$26.660

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$26.280

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$26.080

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$25.890

1,309

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$26.280

$26.080

$25.890

Supply Digital

USA . 2,406 parts In-Stock

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Argo Parts USA

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Aranea Global

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Authorized Procurement Solutions

USA . 500 parts In-Stock

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Overview

Experience unparalleled connectivity with the Broadcom BCM53134MKFBG Network Interface. Manufactured by industry leader Broadcom, this innovative product boasts top-notch quality and reliability. Ideal for a wide range of applications, this Ethernet transceiver offers customers seamless networking solutions with its advanced technology and high-performance capabilities. Say goodbye to connectivity issues and embrace the future of networking with the Broadcom BCM53134MKFBG.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is lightweight and durable, making the product easy to handle and resistant to damage during installation or handling.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving time and effort during production.

Package Shape: SQUARE

Square package shape helps in easy integration into circuit designs and ensures a compact overall footprint in the final product.

No. of Terminals: 212

Having a high number of terminals allows for versatile connectivity options and compatibility with various system requirements.

Terminal Position: BOTTOM

Bottom terminal position simplifies the connection process and offers better accessibility during installation.

Technology: CMOS

CMOS technology provides low power consumption, high speed, and compatibility with a wide range of devices, enhancing overall performance.

Nominal Supply Voltage: 1 V

Operating at a low supply voltage of 1V ensures energy efficiency and reduces power consumption, making it an eco-friendly option.

Technical Specifications

Network Interfaces BCM53134MKFBG attributes and parameters. Explore more Network Interfaces devices from Broadcom

Specs

JESD-30 Code:

S-PBGA-B212

Length:

11 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

212

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Maximum Seated Height:

1.017 mm

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Width:

11 mm

PCN

Manufacturer Highlights

Broadcom

Broadcom Inc, a Delaware corporation headquartered in San Jose, CA, is a global technology leader that designs, develops and supplies a broad range of semiconductor and infrastructure software solutions. Broadcom’s category-leading product portfolio serves critical markets including data center, networking, software, broadband, wireless, storage and industrial. Our solutions include data center networking and storage, enterprise and mainframe software focused on automation, monitoring and security, smartphone components, telecoms and factory automation.

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