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AMMP-6630-TR2G

Broadcom

AMMP-6630-TR2G by Broadcom

VARIABLE ATTENUATOR; Mounting Feature: SURFACE MOUNT; No. of Terminals: 8; Package Body Material: PLASTIC/EPOXY; Technology: GAAS; Minimum Operating Frequency: 0 MHz;

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

< 1k

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Vyrian

USA . 841 parts In-Stock

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841

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Digiode

USA . 141 parts In-Stock

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141

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Distributors (Availability)

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Native Components

USA . 951 parts In-Stock

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$0.504

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951

$0.504

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Northwest PG Solutions

USA . 910 parts In-Stock

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$0.555

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$0.489

910

$0.555

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$0.489

Decca Corp

Germany . 1,152 parts In-Stock

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$1.000

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$0.980

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$0.970

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1,152

$1.000

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AZTECH Wire

Italy . 990 parts In-Stock

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$9.510

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990

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Supply Digital

USA . 1,209 parts In-Stock

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Corphita

USA . 330 parts In-Stock

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330

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Technical Specifications

RF/Microwave Attenuators AMMP-6630-TR2G attributes and parameters. Explore more RF/Microwave Attenuators devices from Broadcom

Specs

Nominal Attenuation:

28 dB

Characteristic Impedance:

50 ohm

Construction:

COMPONENT

Maximum Input Power (CW):

30 dBm

Mounting Feature:

No. of Terminals:

8

Maximum Operating Frequency:

40000 MHz

Minimum Operating Frequency:

0 MHz

Package Body Material:

Package Equivalence Code:

LCC8,.2SQ,28

Power Supplies (V):

1

RF or Microwave Device Type:

Sub-Category:

RF/Microwave Attenuators

Technology:

Trade Compliance

AMMP-6630-TR2G RF & Microwave trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

PCN

Manufacturer Highlights

Broadcom

Broadcom Inc, a Delaware corporation headquartered in San Jose, CA, is a global technology leader that designs, develops and supplies a broad range of semiconductor and infrastructure software solutions. Broadcom’s category-leading product portfolio serves critical markets including data center, networking, software, broadband, wireless, storage and industrial. Our solutions include data center networking and storage, enterprise and mainframe software focused on automation, monitoring and security, smartphone components, telecoms and factory automation.

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