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ACPM-7868-BLK

Broadcom

ACPM-7868-BLK by Broadcom

TELECOM CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 16; Package Code: HVSON; Package Shape: SQUARE; Length: 5 mm;

Median Price

-

Lifecycle Status

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2

In-Stock Inventory

< 1k

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Digiode

USA . 438 parts In-Stock

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438

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Vyrian

USA . 295 parts In-Stock

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295

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Distributors (Availability)

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Decca Corp

Germany . 893 parts In-Stock

1+ parts

$10.000

100+ parts

$9.800

1k+ parts

$9.702

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893

$10.000

$9.800

$9.702

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Native Components

USA . 987 parts In-Stock

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$23.688

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987

$23.688

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Northwest PG Solutions

USA . 1,002 parts In-Stock

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$26.056

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$23.451

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1,002

$26.056

$23.451

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Supply Digital

USA . 738 parts In-Stock

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738

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Corphita

USA . 89 parts In-Stock

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89

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Technical Specifications

Other Function Telecom Interface ICs ACPM-7868-BLK attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Broadcom

Specs

JESD-30 Code:

S-PDSO-N16

Length:

5 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

16

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Nominal Supply Voltage:

3.5 V

Surface Mount:

YES

Telecom IC Type:

Terminal Form:

Terminal Pitch:

.625 mm

Terminal Position:

DUAL

Width:

5 mm

Trade Compliance

ACPM-7868-BLK Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

Manufacturer Highlights

Broadcom

Broadcom Inc, a Delaware corporation headquartered in San Jose, CA, is a global technology leader that designs, develops and supplies a broad range of semiconductor and infrastructure software solutions. Broadcom’s category-leading product portfolio serves critical markets including data center, networking, software, broadband, wireless, storage and industrial. Our solutions include data center networking and storage, enterprise and mainframe software focused on automation, monitoring and security, smartphone components, telecoms and factory automation.

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