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7023B-MTG

Boyd

7023B-MTG by Boyd

HEAT SINK; Body Material: ALUMINUM; Construction: FIN; Fin Orientation: FOLDEDBACK; Height: 44.45 mm; Color: BLACK;

Median Price

$1.610

Lifecycle Status

Suppliers In-Stock

16

In-Stock Inventory

1k+

Distributors (Authorized)

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RS Americas

USA . 2,666 parts In-Stock

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$0.626

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Future Electronics

Canada . 68,076 parts In-Stock

1+ parts

$1.380

100+ parts

$1.340

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$1.300

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Mouser Electronics

USA . 2,973 parts In-Stock

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$1.610

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$1.280

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$1.230

2,973

$1.610

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$1.280

$1.230

DigiKey

USA . 1,483 parts In-Stock

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$7.800

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$6.107

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$5.551

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$5.350

1,483

$7.800

$6.107

$5.551

$5.350

Master Electronics

USA . 4,377 parts In-Stock

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$1.490

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$1.250

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RS (Exports)

UK . 683 parts In-Stock

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$7.950

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Arrow

USA . 478 parts In-Stock

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$6.704

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478

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Verical

USA . 478 parts In-Stock

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$6.704

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478

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NEP Electronics

USA . 226 parts In-Stock

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$1.225

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226

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$1.225

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Distributors (In-Stock)

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NAC Semi

USA . 63,000 parts In-Stock

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$2.300

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Electro Sonic

Canada . 4,455 parts In-Stock

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$1.470

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$1.200

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IBS Electronics

USA . 3,954 parts In-Stock

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$1.534

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$1.521

3,954

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Q Components

USA . 300 parts In-Stock

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Inventory MP

USA . 232 parts In-Stock

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Bristol Electronics

USA . 232 parts In-Stock

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A2Z Electronics, Inc.

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Perfect Parts

USA . 7,299 parts In-Stock

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7,299

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Authorized Procurement Solutions

USA . 100 parts In-Stock

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100

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Technical Specifications

Heat Sinks 7023B-MTG attributes and parameters. Explore more Heat Sinks devices from Boyd

Device Specifications

Construction:

Fin

Fin Orientation:

Physical Specifications

Height:

1.75 in (44.45 mm)

Width:

0.95 in (24.13 mm)

Length:

1.9 in (48.26 mm)

Material and Finish

Finish:

Anodized

Body Material Composition:

Color:

Black

Thermal Specifications

Thermal Resistance:

4.4 Ω

Usage and Compatibility

Device Type:

Manufacturer Highlights

Boyd

Boyd is the world's leading innovator in sustainable engineered material and thermal solutions that make our customers’ products better, safer, faster, and more reliable. We develop and combine technologies to solve ambitious performance targets in our customers’ most critical applications. By implementing technologies and material science in novel ways to seal, protect, cool, and interface, Boyd has continually redefined the possible and championed customer success for over 90 years. Innovation demands for smaller, lighter, and faster technologies with intuitive new features compete with the need for more sustainable solutions. More smart functionality operating faster in tighter spaces with more sophisticated interfaces mean increased power density and more heat, electrical, and mechanical challenges. Adding further complexity, devices are used in unpredictable environments with harsh conditions and must be contaminant and waterproof, insulated against temperature extremes, and ruggedized. Not only are we determined to find solutions to these challenges, Boyd strives to simplify where possible and create the most wholistic, effective, and sustainable solutions.

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