Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
Featured manufacturers
Heat Sinks;
Median Price
$0.500
Lifecycle Status
Suppliers In-Stock
2
In-Stock Inventory
1k+
DigiKey
1+ parts
100+ parts
$0.389
1k+ parts
$0.344
10k+ parts
$0.316
RLX Solution Inc.
-
The ASSMANN WSW Group is well known as a global system provider for standard and customer-tailored connectors, cable assemblies, heat sinks and assembly services. The ASSMANN WSW Group has more than 50 years of experience in the electromechanical and the thermal management market. The products are available internationally through a global distribution network. The products of the ASSMANN WSW Group are used in both the industrial and automotive sectors. The BCS Group GmbH, as 100% owner of the ASSMANN WSW Group, has mainly produced cable assemblies and lighting technology for the automotive industry since 1993.
LM358AN
Samsung
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
SMBJ18CA
Diodes Incorporated
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
CL10B104KB8NNNC
Samsung Electro-mechanics
CL10B104KB8NNNC by Samsung Electro-mechanics is a ceramic capacitor with capacitance of 0.1uF and rated DC voltage of 50V. It has a negative tolerance of 10% and temperature coefficient of 15ppm/°C, suitable for surface mount applications in various electronic devices. With dimensions of 1.6mm x 0.8mm x 0.9mm, it operates b/w -55 to 125 °C providing stable performance in compact designs.
1N4148
ROHM
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
Digitron Semiconductors
BAV99
Temic Semiconductors
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
Nexperia
2N7002
Plessey Semiconductors Discrete Components Div
Other Transistors;
SS14
Frontier Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Good-ark Electronics
RECTIFIER DIODE; Surface Mount: NO; No. of Elements: 1; Maximum Non Repetitive Peak Forward Current: .5 A; Maximum Forward Voltage (VF): 1 V; No. of Phases: 1;
LL4148
Promax-johnton
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
FDD5614P
Onsemi
FDD5614P by Onsemi is a P-CHANNEL Power FET with 60V DS Breakdown Voltage, ideal for SWITCHING applications. It features 45A IDM and 0.1 ohm RDS(ON), operating in ENHANCEMENT MODE at up to 175°C. The PLASTIC/EPOXY package with GULL WING terminals ensures efficient heat dissipation and reliable performance.
SPC TECHNOLOGY/ MULTICOMP
2N2222A
Crystalonics
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
Gec Plessey Semiconductors
BSS84PH6327XTSA2
Infineon Technologies
BSS84PH6327XTSA2 by Infineon is a P-CHANNEL FET with 60V DS breakdown voltage, ideal for switching applications. It features a single configuration with built-in diode and operates in enhancement mode. With a max drain current of 0.17A and on-resistance of 8 ohm, it offers reliable performance in small outline packages.
Jgd Semiconductors
TRANS VOLTAGE SUPPRESSOR DIODE; Surface Mount: YES; Polarity: BIDIRECTIONAL; Maximum Clamping Voltage: 29.2 V; Nominal Breakdown Voltage: 21.2 V; Maximum Repetitive Peak Reverse Voltage: 18 V;
BSS138
General Semiconductor
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Minimum DS Breakdown Voltage: 50 V; Qualification: Not Qualified;
Daco Semiconductor
M39029/58360
Souriau-sunbank Connection Technologies
Souriau-sunbank's M39029/58360 is a MIL-Spec backshell with CRIMP contact type and male gender. It conforms to MIL-DTL-38999 standards, mates with M39029/56348 contacts, and requires M81969/14-01 insertion tools. Ideal for military applications requiring reliable crimp terminals.
FK231SA220
Fischer Elektronik & Kg
HEAT SINK; Body Material: ALUMINUM; Height: 9.5 mm; Length: 19 mm; Width: 13.5 mm;
508700B00000G
Boyd
Boyd's 508700B00000G Heat Sink has a Thermal Resistance of 27.2 ohm, Height of 4.83mm, and Length of 50.8mm. Ideal for cooling electronic components in compact spaces with its extruded aluminum construction and anodized finish.
V8511X
Assmann Wsw Components
HEAT SINK;
SK10450.8STS
SK56
HEAT SINK; Body Material: ALUMINUM; Construction: EXTRUDED; Height: 40 mm; Finish: ANODIZED; Color: BLACK;
RA-T2X-51E
Ohmite Manufacturing
The Ohmite RA-T2X-51E heat sink, made of aluminum, measures 42x25x50.8 mm and weighs 51g. With an anodized black finish and omnidirectional fin orientation, it efficiently dissipates heat in various electronic applications.
321527B00000G
Aavid Thermalloy
HEAT SINK; Fin Orientation: RADIAL; Finish: ANODIZED; Height: 12.7 mm; Thermal Resistance: 35.2 ohm; Color: BLACK;
576802B03100G
Boyd 576802B03100G Heat Sink has Thermal Resistance of 27.3 ohm, Height 12.7mm, and Width 14.48mm. Ideal for cooling electronic components in compact spaces due to its small dimensions and efficient heat dissipation capabilities.
ATS-1146-C1-R0
Advanced Thermal Solutions
ATS-1146-C1-R0 by Advanced Thermal Solutions is a 22.9mm tall, 59mm wide heat sink with gold anodized finish. Constructed from extruded chromate material, it features longitudinal fin orientation for efficient thermal dissipation. Ideal for applications requiring compact cooling solutions in electronic devices.
HTS501-P
TE Connectivity
TE Connectivity's HTS501-P heat sink, with UL approval, features a 9.06mm height and 34.92mm diameter aluminum body for ICs up to 15W power rating. Its radial fin orientation and clip profile make it ideal for efficient heat dissipation in various electronic applications.
576802B00000G
HEAT SINK; Profile: U; Body Material: ALUMINUM; Construction: CLIP; Fin Orientation: TRANSVERSE; Thermal Resistance: 27.3 ohm;
530613B00000G
Boyd 530613B00000G Heat Sink has Thermal Resistance of 16.7 ohm, U Profile, and Aluminum Body Material. Ideal for cooling electronic components in compact spaces with its dimensions of 25.4mm x 12.7mm x 29.97mm.
322400B00000G
HEAT SINK; Fin Orientation: RADIAL; Color: BLACK; Finish: ANODIZED; Height: 5.97 mm; Thermal Resistance: 99.99 ohm;
FA-T220-38E
Ohmite FA-T220-38E Heat Sink, 38.1mm H, 25mm W, 41.6mm L, ALUM Body, ANOD Finish. Weighs 27g with OMNIDIR fins. Ideal for cooling electronic components in various applications.
6399BG
Boyd's 6399BG heat sink has a thermal resistance of 3.3 ohm, height of 50.8mm, and width of 25.4mm. Ideal for transistors, this extruded aluminum device with radial fin orientation is anodized in black finish for efficient heat dissipation in electronic applications.
RA-T2X-38E
The Ohmite RA-T2X-38E heat sink is 38.1mm tall, 25mm wide, and weighs 38g. Made of aluminum with an anodized finish, it's ideal for thermal management in various electronic applications due to its omnidirectional fin orientation.
FK237SA220V
FK237SA220V by Fischer Elektronik & Kg is a black anodized aluminum heat sink measuring 12.7mm in height, 14.5mm in width, and 19.05mm in length. Primarily used on transistors for effective heat dissipation in electronic devices.
PF527G
Boyd PF527G Heat Sink has 7.4 ohm Thermal Resistance, 25mm Height, and Anodized Black Finish. Ideal for cooling electronic components in various applications due to its aluminum body material and efficient heat dissipation capabilities.
1542618-2
TE Connectivity's 1542618-2 heat sink, with a height of 6.5mm and width of 18mm, is approved by CSA and UL for up to 15W power rating. Made of cold-forged aluminum, it is ideal for use on transceivers due to its pin fin orientation and clip profile.
421K
WAKEFIELD-VETTE INC
421K by Wakefield-vette is a Heat Sink measuring 66.7mm in height, 120.7mm in width, and 76.2mm in length. Constructed using extruded material, it weighs 285.77g making it ideal for thermal management applications in various electronic devices and systems.
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