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MAX2837ETM+T

Analog Devices

MAX2837ETM+T by Analog Devices

Analog Devices' MAX2837ETM+T is a BICMOS Ethernet transceiver with 48 terminals in a square chip carrier package. It operates b/w -40 to 85°C, with a peak reflow temperature of 260°C for up to 30 seconds. Ideal for industrial telecom applications requiring a nominal voltage of 2.8V and very thin profile design.

Median Price

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Lifecycle Status

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5

In-Stock Inventory

1k+

MAX2837ETM+T by Analog Devices
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Chip Stock

USA . 7,799 parts In-Stock

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Vyrian

USA . 4,715 parts In-Stock

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Anansix

USA . 2,842 parts In-Stock

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Nova Conductors

Japan . 900 parts In-Stock

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900

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Digiode

USA . 372 parts In-Stock

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372

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Distributors (Availability)

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MARBEL Systems

Belgium . 550 parts In-Stock

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$7.816

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$7.816

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Corohmni

South Africa . 8 parts In-Stock

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$8.018

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Texas Native Microelectronics

USA . 800 parts In-Stock

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$8.984

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$8.625

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$8.355

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$7.906

800

$8.984

$8.625

$8.355

$7.906

Kenton Components

USA . 839 parts In-Stock

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$10.781

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$9.487

839

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$9.487

AZTECH Wire

Italy . 702 parts In-Stock

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$11.523

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Aztec Data Supply Inc.

USA . 272 parts In-Stock

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$14.620

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Qasali Group International

UK . 32,368 parts In-Stock

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$24.257

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$22.559

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$21.346

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Ampacity Inc.

Singapore . 955 parts In-Stock

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$759.000

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One Stop Electronics

USA . 1,245 parts In-Stock

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Semicontronic

India . 1,066 parts In-Stock

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$971.000

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$946.725

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$941.870

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Continental Prestige Electronics

USA . 5,147 parts In-Stock

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Argo Parts USA

USA . 2,578 parts In-Stock

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Corphita

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RC Electronics

USA . 1,711 parts In-Stock

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Authorized Procurement Solutions

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Bastille Electronics

Australia . 800 parts In-Stock

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Overview

Enhance your network interfaces with the MAX2837ETM+T by Analog Devices, a top-tier manufacturer known for its superior quality and cutting-edge technology. This versatile chip carrier offers a very thin profile and matte tin terminal finish, making it ideal for industrial applications. Elevate your networking capabilities with this Ethernet transceiver, providing reliable performance and seamless connectivity. Upgrade to Analog Devices for unparalleled value and innovation in every product.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient mounting on printed circuit boards, saving space and reducing assembly time.

Package Shape: SQUARE

Square package shape provides a stable and secure mounting option, minimizing the risk of damage during handling and installation.

No. of Terminals: 48

Having 48 terminals offers a high level of connectivity and versatility for various network interface applications.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can withstand demanding environmental conditions without performance degradation.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures reliable and consistent performance even in extreme cold environments.

Terminal Finish: Matte Tin (Sn) - annealed

Matte tin finish provides excellent solderability for reliable electrical connections, while the annealed state enhances durability and resistance to corrosion.

Terminal Position: QUAD

Quad terminal position allows for efficient PCB layout and connection, optimizing signal integrity and performance.

Width: 6 mm

Compact width size saves space on the PCB, making it suitable for applications where board real estate is limited.

Peak Reflow Temperature °C: 260

High peak reflow temperature ensures secure solder joints and reliable connections during the assembly process.

Technology: BICMOS

BICMOS technology offers a combination of bipolar and CMOS benefits, providing high speed, low power consumption, and improved noise immunity.

Technical Specifications

Network Interfaces MAX2837ETM+T attributes and parameters. Explore more Network Interfaces devices from Analog Devices

Specs

JESD-30 Code:

S-XQCC-N48

JESD-609 Code:

e3

Length:

6 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.8 mm

Nominal Supply Voltage:

2.8 V

Surface Mount:

YES

Technology:

BICMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

6 mm

Trade Compliance

MAX2837ETM+T Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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